Abstract: The present application discloses a laser receiving circuit and a LiDAR. The laser receiving circuit includes an amplifying circuit, a DC bias circuit, and an analog-to-digital converter. The amplifying circuit is connected to the analog-to-digital converter and configured to amplify input first voltage signals to obtain second voltage signals, and the second voltage signals are AC voltage signals. The DC bias circuit is connected to the analog-to-digital converter and configured to generate reverse DC voltage signals, and the reverse DC voltage signals and the second voltage signals are superimposed to obtain third voltage signals. The analog-to-digital converter is configured to sample the third voltage signals.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. To mitigate crosstalk, multiple rings of isolation structures may be formed around the SPAD. An outer deep trench isolation structure may include a metal filler such as tungsten and may be configured to absorb light. The outer deep trench isolation structure therefore prevents crosstalk between adjacent SPADs. Additionally, one or more inner deep trench isolation structures may be included. The inner deep trench isolation structures may include a low-index filler to reflect light and keep incident light in the active area of the SPAD.

Abstract: The system can include: a container no, a set of sensors 120, and a controller 130. The system can optionally include a robot 140. However, the system 100 can additionally or alternatively include any other suitable set of components. The system functions to monitor and/or maintain a fullness level of a container. The system can additionally or alternatively function to enable robotic picking out of the container (e.g., in a pick-and-place setting). The system can additionally function to maintain candidate objects within reach of the robot's end effector to increase robot uptime while minimizing the extent of the robot's required motion (e.g., in the z-axis).

Abstract: The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.

Abstract: An optical filter may include a first group of layers. The first group of layers may include alternating layers of a first dielectric material, of a group of dielectric materials, and a second dielectric material of the group of dielectric materials. The optical filter may include a second group of layers. The second group of layers may include alternating layers of a third dielectric material, of the group of dielectric materials, and a fourth dielectric material of the group of dielectric materials. The optical filter may include a third group of layers. The third group of layers may include alternating layers of a fifth dielectric material, of the group of dielectric materials, a sixth dielectric material, of the group of dielectric materials, and a metal material. The third group of layers may be disposed between the first group of layers and the second group of layers.

Abstract: One embodiment illustrated herein includes an optical device. The optical device includes a stacked device, formed in a single semiconductor chip, configured to be coupled in an overlapping fashion to an underlying device. The stacked device includes a plurality of optical output pixels. Each of the output pixels includes a plurality of subpixels. Each subpixel is configured to output a color of light. Each pixel is configured to output a plurality of colors of light. The optical device further includes one or more detectors, configured to detect light, interleaved with the subpixels of the pixels. The stacked device comprises a plurality of transparent regions formed in the stacked device between the pixels. The plurality of transparent regions are transparent, according to a first transmission efficiency, to light in a first spectrum. The underlying device emits light in the first spectrum.

Abstract: A system and method is disclosed for solar tracking and controlling an angular position of a photovoltaic power system. The solar tracking system includes an imaging device for capturing images of the sky; a solar position data generating module; and a control system comprising a neural network. The neural network has multiple convolutional layers to generate a first output associated with the images, and a solar position data module. A first dense layer module receives the solar position data and generates a second output. A second dense layer module receives the first output and the second output and generates a concatenated data sequence. A processor is programmed to generate a multi-planar irradiance signal (MPIS) in response to the concatenated data sequence, and determine an angular position of the PV power system and adjust the angular position in response to an angle of maximum irradiance.

Abstract: An imaging device comprises a first chip that includes a first semiconductor substrate including a photoelectric conversion region. The first chip includes a first insulating layer including a first multilayer wiring electrically connected to the photoelectric conversion region. The first multilayer wiring includes a first vertical signal line (VSL1) to output a first pixel signal, and a first wiring. The imaging device includes a second chip including a second semiconductor substrate including a logic circuit. The second chip includes a second insulating layer including a second multilayer wiring electrically connected to the logic circuit. The second multilayer wiring includes a second wiring. The first chip and the second chip are bonded to one another, and, in a plan view, the first wiring and the second wiring overlap with at least a portion of the first vertical signal line (VSL1).

Abstract: A sensor has plurality of pixels arranged in a plurality of rows and columns with row control circuitry for controlling which one of said rows is activated and column control circuitry for controlling which of said pixels in said activated row is to be activated. The column circuitry has memory configured to store information indication as to which of the pixels are defective, wherein each of the pixels has a photodiode and a plurality of transistors which control the activation of the photodiode. A first transistor is configured to be controlled by a column enable signal while a second transistor is configured to be controlled by a row select signal.

Abstract: Disclosed is a phase modulator apparatus comprises at least a first phase modulator for modulating input radiation, and a metrology device comprising such a phase modulator apparatus. The first phase modulator comprises a first moving grating in at least an operational state for diffracting the input radiation and Doppler shifting the frequency of the diffracted radiation; and a first compensatory grating element comprising a pitch configured to compensate for wavelength dependent dispersion of at least one diffraction order of said diffracted radiation.

Abstract: There is proposed an optical power measurement circuit and an optical power meter which use a linear amplification circuit based on multiple transimpedance operational amplification lanes and which add a bootstrap circuit and a compensator circuit. 1) The bootstrap is used to reduce the effect of the photodiode capacitance and increases the amplifier's bandwidth. 2) The compensator circuit monitors the photodiode's voltage and reproduces its transient distortions, to then subtract it from the output and thereby reduce the measurement error.

Abstract: The present application provides an ambient light sensor and an electronic device, which may improve detection accuracy and detection performance of the ambient light sensor. The ambient light sensor includes: a light filtering unit array including a plurality of light filtering units, the plurality of light filtering units including a color light filtering unit, a white light filtering unit and a transparent light filtering unit, the white light filtering unit being configured to pass a visible light signal and block an infrared light signal, and the transparent light filtering unit being configured to pass the visible light signal and the infrared light signal; a pixel unit array including a plurality of pixel units, the plurality of pixel units being configured to receive a light signal after the ambient light passes through the plurality of light filtering units for an ambient light detection.

Abstract: A method employs a device with a heterostructure as a resonator for electrons of an electrical circuit or for a terahertz electromagnetic wave. The heterostructure comprises at least one dielectric layer and at least one ferroelectric layer. The at least one ferroelectric layer comprises a plurality of ferroelectric polarization domains. The plurality of ferroelectric polarization domains forms a polarization pattern. The polarization pattern is adapted to perform an oscillation with a resonance frequency in a terahertz frequency range. The method comprises functionally coupling the oscillation of the polarization pattern and an oscillation of the electrons of the electrical circuit or of the terahertz electromagnetic wave by the device.

Abstract: An electronic apparatus has a housing in which a substrate with an electronic component mounted thereon, a thermoplastic hot-melt resin, and a substrate holding part are accommodated. The interior of the housing is divided by the substrate into a plurality of spaces. In the plurality of spaces, a distance between the substrate or the electronic component on the substrate and the substrate holding part, the housing, another substrate, or the electronic component on the another substrate is 0.3 mm to 1.5 mm.

Abstract: There is provided a light receiving device including: a pixel including a first tap configured to detect a charge photoelectrically converted by a photoelectric conversion unit, and a second tap configured to detect a charge photoelectrically converted by the photoelectric conversion unit; a first comparison circuit configured to compare a first detection signal detected by the first tap and a reference signal; a second comparison circuit configured to compare a second detection signal detected by the second tap and the reference signal; a first zero reset signal generation circuit configured to generate a first zero reset signal that is supplied to the first comparison circuit when the first comparison circuit performs an auto zero operation; and a second zero reset signal generation circuit configured to generate a second zero reset signal that is supplied to the second comparison circuit when the second comparison circuit performs an auto zero operation.

Abstract: The present application discloses an optical receiving device and an optical sensing device. The optical receiving device includes a lens assembly, a reflecting member, and a photosensitive member. The lens assembly includes at least one lens. The reflecting member is located on a transmission path of light passing through the lens assembly. The reflecting member has a reflecting surface. The reflecting surface is configured to reflect the light passing through the lens assembly. The photosensitive member has a photosensitive surface. The photosensitive surface is configured to receive light reflected by the reflecting surface. After passing through the lens assembly, a detecting echo light beam reflected back from a target object is reflected by the reflecting surface of the reflecting member, so that the light is transmitted to the photosensitive surface of the photosensitive member intensively.

Abstract: An optical sensor includes pixels. Each pixel has a photodetector. A readout circuit performs a process over an exposure time where the photodetector is connected to a reverse bias voltage supply to reset a voltage across the photodetector, and the photodetector is disconnected from the reverse bias voltage supply until that the voltage across the photodetector decreases in response to received ambient light. An ambient light level is then determine an based on a number of times the voltage across the photodetector is reset over the exposure time.

Abstract: For easily setting, for each of a plurality of detection apparatuses, a target object detected by the detection apparatus, a model providing apparatus including: a storage unit storing a machine learning model detecting a plurality of detection target objects, based on a received signal of a reflected wave of an electromagnetic wave with a wavelength equal to or greater than 30 micrometers and equal to or less than 1 meter; a request reception unit receiving a request for a detection model detecting the detection target object, based on the received signal; a selection unit selecting at least one out of a plurality of detection target objects for each request; generation unit generating a detection model detecting a selected detection target object and not detecting an unselected detection target object, based on the machine learning model; and a transmission unit transmitting the generated detection model to a detection apparatus is provided.

Abstract: Provided a full-automatic wheel hub 3D scanning system for intelligent production line of automotive wheel hubs, comprising: a base plate is provided with an X-directional displacement control device and a Y-directional displacement control device; a roller-table assembly is arranged on the base plate and comprises a roller table, wherein the roller table is provided with an opposite-type photoelectric sensors and a wheel hub centring positioning device for centring positioning a wheel hub; a 3D scanning device, comprising a mounting bracket, wherein the bottom of the mounting bracket is controlled by the Y-directional displacement control device; a 3D scanner is mounted on the mounting bracket; a wheel hub scanning platform is arranged at an end of the roller-table assembly and is controlled by the X-directional displacement control device; and a robot is arranged on a first side of the wheel hub scanning platform, for conveying the wheel hubs after 3D scanning.

Abstract: An optical sensor and filter assembly is provided and includes an optical sensor, a filter and a mounting structure. The optical sensor includes a detector layer having first and second opposed faces and a read-out integrated circuit (ROIC) to which the first face of the detector layer is hybridized. The filter permits passage of one or more wavelength bands of interest of incident light toward the optical sensor and the mounting structure directly hybridizes the filter to the second face of the detector layer.