Abstract: A brazing product for low temperature fluxless brazing comprises a filler metal-forming composition which melts in the range from about 380-575° C. The filler metal-forming composition comprises zinc optionally in combination with aluminum and/or silicon, and further comprises at least one braze promoter selected from nickel, cobalt, iron and palladium. The filler metal-forming composition may comprise a single layer or may comprise a number of distinct layers. The brazing product may take the form of a brazing preform or a brazing sheet or casting in which the filler metal-forming composition is deposited on a non-consumable substrate. The substrate may preferably comprise aluminum or an aluminum alloy, but may instead be comprised of one or more metals other than aluminum.

Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.

Abstract: A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: A material for welding 5 having a region 11 in which welding such as laser welding or arc welding is performed, the region including indentations 5a-1 which are produced by carrying out a first working step comprising embossing, V-bending, U-bending, L-bending, drawing, stepped drawing, or a combination of these to form a curved portion 5a in the material being worked, and a second working step which is press working which crushes the curved portion 5a which is formed by the first working step. The indentations 5a-1 have a protruded portion 11a which projects from a flat surface which forms the surface of the material being worked 5, and a recessed portion 11b which is formed on the inside of the protruded portion 11. Indentations 5a-1 are provided in the form of at least two separated dots so as to be generally parallel to the predicted welding position and are arranged on the expected welding position.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric.

Abstract: An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power supply. When the direct-current high voltage power supply is turned ON, a space discharge occurs between the tip end of the wire and the torch electrode, resulting in that the wire tip end melts and is formed into a ball and that the tin of the torch electrode is also heated to a high temperature and diffused into space, so that ionized plus tin ions are attracted to the tip end of the melted wire, thus causing tin to adhere to the surface of the ball-shaped tip end of the wire, and forming an initial ball that has a low-melting-point coating material adhered to its surface.

Abstract: An apparatus (1) for manufacturing tubes made from thin-walled material, especially made from sheet metal, with a welding machine for longitudinal-seam welding, as well as with a clamping device (2), which has clamping jaws, which are arranged on opposite sides of the tube blank (3) and which can be pressed against the tube blank (3) for holding a tubular, preformed blank in the welding position. The clamping jaws (4) each have a stack of pressure plates (5), which contact each other on the flat sides thereof, and which contact the tube blank (3) on the narrow sides thereof in a contact region (6), and which can be pressed against the tube blank (3). The plate stacks are adapted to the outer contours of the tube blank (3) in the contact region (6). Through the use of the apparatus according to the invention, a uniform and uniformly load-bearing weld seam can be achieved, even for contoured tubes, which have outer diameters that vary along the course of their longitudinal extent.

Abstract: This invention provides a configuration of a joint that allows a satisfactory welded joint to be formed with reduced deformation of the joint region when two-face structures (panels) are friction-welded end to end. The panels 31, 32 each have two substantially parallel plates 33, 34 and a third member 35 connecting the two plates 33, 34. The end portions of the plates 33, 34 of one panel 32 are friction-welded to the end portions of the plates 33, 34 of the other panel 32. At least one of the panels has a plate 36 at its end for connecting the plates 33 and 34 and has a rigidity to support a pressing force produced during the friction welding.

Abstract: A hydrogen separation filter includes a plurality of hydrogen extraction layers, a plurality of separation layers with hydrogen separation films, and a plurality of reformed gas layers, which are laid one upon another in the sequence of the extraction layer, the separation layer, the reformed gas layer, and the separation layer to form a laminate structure. The respective layers are composed of porous ceramic material to ensure the required strength. The direction of the gas flow in the reformed gas layers and that in the extraction layers are respectively fixed to simplify the gas intake and discharge structure. The hydrogen separation filter is covered with a casing via a cushioning member to ensure the sufficient strength and the required sealing properties. A methanation catalyst that accelerates methanation of carbon monoxide is carried on either the separation layer or the extraction layer.

Abstract: The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.

Abstract: Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A friction stir weld tool sleeve is supported by an underlying support pin. The pin material is preferably selected for toughness and fracture characteristics. The pin sleeve preferably has a geometry which employs the use of an interrupted thread, a plurality of flutes and/or eccentric path to provide greater flow through. Paddles have been found to assist in imparting friction and directing plastic metal during the welding process.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.

Abstract: A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially positioned, either manually or automatically, near a target weld path with the aid of the fiber optic device. The flexible articulate tubular device is then more precisely articulated to direct the terminus along the target weld path, with the aid of the heat sensors. As such, the flexible articulate tubular device operates in a heat seeking manner to follow the weld bead. Ultimately, a gaseous flux is supplied along the flexible articulate tubular device and toward the target weld path, so as to blast the weld bead with an anti-oxidation shield gas and thereby protect the weld.

Abstract: Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder.

Abstract: An improved cooling system for adapting to a two-component welding electrode device having a shank and cap, includes a retractable nozzle tube, a manifold, and an adjustment element for adjustably interconnecting the tube and manifold. A threaded bushing or plunger is attached to the tube and operable to adjust the distance between the interior surface of the cap and the outlet of the tube to a preferred distance. A threaded sleeve interconnects the tube and bushing for additional adjustability. The tube defines an elastically compressible bellows section, and a spacer is removably attached to the distal end of the tube for automatic adjustment of the outlet position by the cap.

Abstract: An apparatus is proposed for connection of workpieces using the friction stir welding method, with a shaft (33, 33?) which can be driven such that it rotates and at whose end remote from the drive end of the shaft a pin-like projection (8) is arranged, at whose end a first stop, which is formed by a first shoulder (6), is arranged, with the first shoulder having a diameter which is larger than the diameter of the pin-like projection (8), and with a second stop (7, 7?), which is formed from a second shoulder and is arranged such that the workpieces (19) to be connected can be enclosed between the stops (6, 7, 7?), in that at least one of the stops can be moved translationally in order to enclose the workpieces (19) with a predetermined force in the direction of the other stop.