Abstract: The present invention provides seam-welded, air hardenable steel tubes, methods of manufacturing seam-welded air hardenable steel tubes, tube mills for practicing such methods and applications for using seam-welded, air hardenable steel tubing of the present invention.

Abstract: A welding stud is attachable to a workpiece at a work end portion shaped for enhanced attachment strength with the workpiece. The welding stud has a portion of reduced thickness along a body portion between the work end portion and a retaining collar. The reduced thickness portion is furnished to yield or bend in the event of contact by some other body or piece and preserve the integrity of the attachment weld. The work end portion may also have an enlarged contact face with increased surface area for forming the weld.

Abstract: A cable arrangement for a robot arm is provided, which includes a rotation arm and a line member such as a power cable. The rotation arm has a front end and a base end, the front end being provided with a swing shaft, the base end being provided with a rotational shaft rotatable about a longitudinal axis. The line member extends from the base end toward the front end of the arm. The rotational shaft includes a line offset member formed with at least one through-hole for passing the line member. The through-hole as a whole is offset from the axis of the rotational shaft.

Abstract: On production of a component, two primary pieces must often be fixed together to give one piece. In order to achieve the above, it is important that the two primary pieces are oriented in a particular manner during the fixing process, which provides some difficulties. According to the invention, a plug body is fixed to the component by a mounting, whereby the position of the plug body relative to the component remains unchanged during a fixing process.

Abstract: A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract: A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtaining luminance variations at an edge portion of the pad in each taken image to determine an in-focus height of the pad based on an image taking height position at which the taken image has the largest luminance variation at the edge portion of the pad; obtaining luminance variations on an upper surface of the ball in each taken image to determine an in-focus height of the upper surface of the ball based on an image taking height position at which the taken image has the largest luminance variation on the upper surface of the ball; and calculating the thickness of the ball by finding a difference between the obtained in-focus heights of the pad and the upper surface of the ball.

Abstract: A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.

Abstract: A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.

Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 ?m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 ?m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 ?m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.

Abstract: A method of joining two vehicle axle housing components made from the same or dissimilar materials includes providing a first axle housing component, and providing a second axle housing component, where one of the first and second axle housing components is a metallic component made of a metallic material. A portion of one of the first and second axle housing components is positioned within a portion of the other of the axle housing components in an overlapping manner, thereby forming an overlapping portion. A metallic band may be disposed around the overlapping portion. An inductor is positioned around the overlapping portion. The inductor is energized to generate a magnetic field for collapsing at least one of the overlapping portion and the metallic band, thereby securing the first and second axle housing components together.

Abstract: A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical axis of the image recognition system are separated by a vectorial distance D. The Wire Bonder has a device with a body with an optical marking and with two stop faces that enable the vectorial distance D to be recalibrated at any time. The control program of the Wire Bonder is set up on the one hand to move the capillary towards the first stop face and to determine a first co-ordinate xC of the position of the bondhead as soon as the capillary touches the first stop face and then to move the capillary towards the second stop face and to determine a second co-ordinate yC of the position of the bondhead as soon as the capillary touches the second stop face.

Abstract: A curved electrode includes an installing portion to be installed in an electrode holder, an offset portion by which the offset amount is obtained, and a tip portion which comes into contact with the material to be welded W, the portions being formed separately and assembled together. A vertical hole and a horizontal hole are formed within the installing portion, an axis hole is formed within the offset portion, and a water supply tube is inserted into a cooling hole which is constructed of the vertical hole, the horizontal hole and the axis hole. C-chamfering or R-chamfering is conducted to a corner where the vertical hole and the horizontal hole intersect. An object of the present invention is to provide a curved electrode which can be manufactured easily at a low cost, and if a part of it is damaged, only that part needs to be replaced at a low cost. The durability of the curved electrode can be improved at the same time.

Abstract: These shielding gas flow-control devices avoid weld start quality problems often created in typical GMAW systems. They accomplished this while maintaining the common high pressure gas delivery pressures. Higher pressures maintain automatic flow compensation when gas restrictions occur while welding. A measured amount of extra shielding gas is quickly delivered at the weld start to displace air that enters the welding torch body and cable when welding is stopped. They also provide extra gas to purge the air in the weld start area. The extra gas is provided without excess gas flow velocity that, if present, causes air to be pulled into the shielding gas stream. These unique devices control gas flow while being located in, on or in close proximity to the wire feeder. A simple method of limiting gas flow adjustment is also included. These systems also minimize shielding gas waste which often occurs at the weld start.