Abstract: The organosilanes and organopolysiloxanes containing groups which form free radicals and are soluble in organic solvents, processes for their preparation, macromonomers and graft copolymers from the organosilanes and organopolysiloxanes according to the invention as free radical initiators and organic monomers which can be polymerized by free radicals, a process for the preparation of the macromonomers and graft copolymers and their use.
Abstract: Novel metallohalopolymers comprising an oxyhalopolymer and a transition metal covalently bonded to an oxygen site on the oxyhalopolymer possess desirable properties of inertness, stability, hydrophobicity and high electronegativity like fluoropolymers such as PTFE. The metallohalopolymers also possess unusual superacidic properties making oxygen-containing sites on the polymeric backbone highly nucleophilic and reactive with transition metals for synthesis of stable metallized polymers without requiring exposure to destructive calcining temperatures or intermediate chelating organosilane linking agents. The transition metals can be covalently bonded directly to the polymeric support to form metallohalopolymers for use as catalysts in the synthesis of chemicals, biocides and useful articles of manufacture, such as filtration devices containing the biocidally active metallohalopolymers.
Abstract: A system and method for the parenteral delivery of a drug in a biodegradable polymeric matrix to a warm blooded animal as a liquid with the resultant formation of a gel depot for the controlled release of the drug. The system comprises an injectable biodegradable block copolymeric drug delivery liquid having reverse thermal gelation properties. The delivery liquid is an aqueous solution having dissolved or dispersed therein an effective amount of a drug intimately contained in a biodegradable block copolymer matrix. The copolymer has a reverse gelation temperature below the body temperature of the animal to which it is administered and is made up of (i) a hydrophobic A polymer block comprising a member selected from the group consisting of poly(.alpha.-hydroxy acids) and poly(ethylene carbonates) and (ii) a hydrophilic B polymer block comprising a polyethylene glycol. Prior to use the liquid is maintained at a temperature below the reverse gelation temperature of the block copolymer.
Type:
Grant
Filed:
October 25, 1995
Date of Patent:
December 30, 1997
Assignee:
Macromed, Inc.
Inventors:
Younsik Cha, Young Kweon Choi, You Han Bae
Abstract: Novel loop polymers having a polymeric backbone and a plurality of olefinic groups which have been converted to closed loops by reaction with difunctional organic compounds reactive with said olefinic groups, said olefinic groups from which the loops are formed may either be present within the backbone and/or pendent from the polymeric backbone. The loop polymers may also have hydroxy or carboxy groups which can be capped with diisocyanates or epoxies, respectively.
Abstract: A non-corrosive translucent room temperature vulcanizable silicone composition consists essentially of an alkyl alkoxy stopped diorganopolysiloxane, a polyalkoxysilane crosslinking agent and a tetra alkyl titanate condensation cure catalyst.
Abstract: The present invention relates to 5-membered heteroaryl-oxazolidinones, to processes for their preparation and to their use as medicaments, in particular as antibacterial medicaments.
Type:
Grant
Filed:
July 17, 1995
Date of Patent:
December 16, 1997
Assignee:
Bayer Aktiengesellschaft
Inventors:
Bernd Riedl, Dieter Habich, Andreas Stolle, Hanno Wild, Rainer Endermann, Klaus Dieter Bremm, Hein-Peter Kroll, Harald Labischinski, Klaus Schaller, Hans-Otto Werling
Abstract: A sequential catalysis of the ring opening polymerization of cyclic organosiloxanes using a base catalyst that can be neutralized by a subsequent redistribution and condensation catalyst such as a Lewis acid catalyst, preferably a phosphonitrilic compound, permits the rapid synthesis of functionalized and poly-functionalized silicone copolymers such as alkenyl hydride copolymers, a new composition of matter.
Type:
Grant
Filed:
July 30, 1996
Date of Patent:
December 16, 1997
Assignee:
General Electric Company
Inventors:
Susan A. Nye, Donna A. Riccio, Brenda S. Wutzer
Abstract: Proposed is a radiation-curable organopolysiloxane composition which is useful as a coating agent for the formation of a releasable coating film on a substrate to serve as a releasable sheet without the problem due to generation of peeling noises. The composition essentially comprises, as a blend, (a) a first organopolysiloxane having a specified viscosity and containing (meth)acryloxyalkyl groups bonded to the silicon atoms in a specified content and (b) a second organopolysiloxane having a specified viscosity and containing (meth)acrylaminoalkyl groups bonded to the silicon atoms in a specified content, the weight proportion of the second organopolysiloxane to the first organopolysiloxane being in a specified range.
Abstract: The present invention provides curable resin compositions containing finely divided particles of a cured organosiloxane material with microparticles of silica bound to the surfaces of the particles. The particle size of the cured organosiloxane material and the particle size and properties of the silica are within specified limits.
Abstract: The present invention provides a phenolic resin molding material high in flowability and heat stability in the molten state and excellent in curability at high temperatures which contains (a) a high ortho-novolak type phenolic resin having a number-average molecular weight of 350-500 and an ortho-bond/para-bond ratio of 1.5-2.5, (b) hexamethylene-tetramine, (c) a low-molecular polyolefin compound and (d) a filler. This phenolic resin molding material can further contain a crystalline phenolic compound having two or more benzene rings and/or a monohydric aliphatic alcohol to further improve the flowability, heat stability and curability.
Abstract: The invention concerns a method of decomposing materials containing polycyanurates, the method calling for the polycyanurate-containing materials to be converted, in a first operation, into a finely divided form and then, in a second operation, aminolysed with an agent containing at least one reactive NH.sub.2 group.
Type:
Grant
Filed:
June 21, 1996
Date of Patent:
November 25, 1997
Assignee:
Fraunhofer-Gesellschaft Zur Forderung der Angewandten Forschung e.v.
Abstract: The present invention provides a process for producing a rapidly curable cold-setting polyurethane coating waterproofer which permits the employment of a highly safe aromatic polyamine crosslinker, which is rapidly cured even in the absence of an organometallic catalyst to thereby give a coating film having excellent heat and water resistances, and which can retain a pot life suited for, especially, hand coating. A base composed of an isocyanate-terminated prepolymer comprising the product of reaction between tolylene diisocyanate and a polyoxypropylene polyol and/or a polyoxyethylenepropylene polyol is in-situ mixed with a curing agent containing an aromatic polyamine crosslinker composed of diethyltoluenediamine and a plasticizer, and the obtained mixture is subjected to coating and curing. The plasticizer is contained in the curing agent in an amount of 20 to 130 parts by weight per 100 parts by weight of the prepolymer of the base.
Type:
Grant
Filed:
November 2, 1995
Date of Patent:
November 18, 1997
Assignees:
Hodogaya Chemical Co., Ltd., Hodogaya Construction Products Co., Ltd.
Abstract: Novel derivatives of estrogenic nuclei, contain a side-chain substitution of the formula --R.sup.1 ?B--R.sup.2 --!.sub.x L--G and may be used in pharmaceutical compositions as sex steroid activity inhibitors useful in the treatment of both androgen-related and estrogen-related diseases.
Abstract: The invention provides a novel coating composition comprising a first component (i.e. 100 parts by weight of a fluorine-containing copolymer), a second component (i.e. 0.1-20 parts by weight of an alkyl silicate), and a third component (i.e. 0.05-3 parts by weight of a water-soluble polyether-modified silicone oil and/or 1-25 parts by weight of a polyoxytetramethylene glycol). The fluorine-containing copolymer has a hydroxyl value of 80-200 mg KOH per 1g thereof and is prepared by copolymerizing 40-65 mol % of a fluoroolefin, 14-50 mo1% of a copolymerizable vinyl-containing compound, 12-25 mol % of a polymerizable hydroxyl-containing compound, and 0.1-12 mol % of at least one other copolymerizable compound. A cured coated film prepared from the coating composition is superior in elasticity and weathering and stain resistances.
Type:
Grant
Filed:
October 25, 1995
Date of Patent:
November 4, 1997
Assignee:
Central Glass Company, Limited
Inventors:
Yoshi Hirashima, Kazuhiko Maeda, Kentaro Tsutsumi
Abstract: A curable resin composition comprising (a) an oxyalkylene polymer comprising at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a curing catalyst for the oxyalkylene polymer containing at least one reactive silicon group per molecule, (c) an epoxy resin, and (d) a ketimine; and a curable resin composition further comprises (e) a reactive silicon group-containing silane compound in addition to (a) to (d).
Abstract: The present invention discloses a method for the preparation of heat-resistant protective coatings wherein powder-based compositions are cured at temperatures greater than about 205.degree. C. to form high-film-build coatings which are substantially free of coating defects.
Abstract: Coating compositions based on water-redispersible powders comprising water-soluble polymer and organosilicon compounds, wherein the organosilicon compounds comprise at least one low molecular weight organosilicon compound having a viscosity of not more than 5,000 mm.sup.2 /s at 25.degree. C. and at least one high molecular weight organopolysiloxane resin which has a viscosity of at least 100,000 mm.sup.2 /s at 25.degree. C. or is solid at room temperature.
Type:
Grant
Filed:
March 18, 1996
Date of Patent:
October 28, 1997
Assignee:
Wacker-Chemie GmbH
Inventors:
Richard Weidner, Volker Frey, Ingeborg Koenig-Lumer, Hans Mayer
Abstract: A high yield of three armed radial anionic polymers is produced by the process of coupling metal terminated anionic polymers with a trialkoxysilane having a silicon-hydrogen bond, preferably trimethoxysilane. The metal terminated anionic polymer is preferably produced by initiating polymerization with a protected functional initiator which is readily converted to terminal hydroxyl groups or derivatives thereof for use in adhesives, sealants, and coatings.
Type:
Grant
Filed:
August 29, 1996
Date of Patent:
October 28, 1997
Assignee:
Shell Oil Company
Inventors:
Robert Charles Bening, Ronald James Hoxmeier
Abstract: A coating composition having excellent antifogging property, good abrasion resistance, improved adhesion to the substrate and good water resistance, which comprises an epoxy functional organosilane or the hydrolysate or condensate thereof; an amino functional organosilane or the hydrolysate or condensate thereof; a hydrophilic (meth)acrylate monomer, or a copolymer of two components selected from the hydrophilic (meth)acrylate monomer, another hydrophilic monomer and an organosilane and/or a terpolymer of the three components; a curing catalyst; and, optionally, a multi-functional (meth)acrylate monomer having at least two (meth)acryl groups and a radical polymerization initiator.
Type:
Grant
Filed:
April 26, 1996
Date of Patent:
October 21, 1997
Assignee:
Lucky Limited
Inventors:
Yong-Il Cho, Sung-Hoon Jang, Jung-Ok Park
Abstract: This invention relates to heat-resistant film adhesives for use in fabrication of printed circuit boards formulated from polyimides with silicone units and epoxy resins and, if necessary, epoxy resin curing agents. It is possible to introduce functional groups reactive with epoxy resins into the polyimide structure. The films are used by inserting them between adherends and pressing at 1 to 1,000 kg/cm.sup.2 and 20.degree. to 250.degree. C. and they show excellent heat resistance, heat resistance at soldering temperature after moisture absorption and processibility when contact-bonded at 250.degree. C. or less.