Patents Examined by Randy Gulakowski
  • Patent number: 10364355
    Abstract: Paving compositions comprising asphalt cement, wherein the asphalt cement may have a with a pen value greater than 50 dmm at 25° C., and the composition may further include a an aminated wax, a rejuvenator and/or a polymeric component. Paving structures include a substrate pavement layer with a tack coat applied thereto, and methods of making a paving structure include applying a tack coat to a substrate pavement layer, wherein the tack coat comprises asphalt cement, wherein the asphalt cement may have a with a pen value greater than 50 dmm at 25° C., and the tack coat may further include a an aminated wax, a rejuvenator and/or a polymeric component.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 30, 2019
    Assignee: SHAMROCK M.E.D. LLC
    Inventor: Taryn Naidoo
  • Patent number: 9902803
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 27, 2018
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Patent number: 9903019
    Abstract: An aqueous composition for forming a chemical conversion layer on a metal surface, wherein the composition contains at least one active component for the formation of the chemical conversion layer, as well as at least one thickener, and has a viscosity in the range between 10 mPa*s and 10000 mPa*s.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: February 27, 2018
    Assignees: Airbus Operations GmbH, EADS Deutschland GmbH
    Inventors: Sonja Nixon, Martin Beneke, Dominik Raps
  • Patent number: 9884944
    Abstract: Functionalized polymer matrix and/or reinforcement materials that are capable of a thermoreversible Diels-Alder reaction are useful for making composite materials. Also disclosed is a composite material which includes one or both of functionalized reinforcement materials and functionalized polymer matrix materials, as well as a method for repairing a composite material including the step of thermally treating the composite material at a temperature sufficient to react a functionality on one of the reinforcement material and the polymer matrix material with another functionality via a Diels-Alder reaction. A method of making a composite material including functionalizing one or both of a reinforcing material and a polymer matrix material with a first reactive group, providing a second reactive group capable of undergoing a Diels-Alder reaction with the first reactive group and reacting the first and second reactive groups to form a composite material, is also described.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: February 6, 2018
    Assignees: Drexel University, The United States of America as Represented by the Secretary of the Army
    Inventors: Giuseppe R. Palmese, Amy M. Peterson, Robert E. Jensen
  • Patent number: 9879112
    Abstract: The present invention is related to novel preparative methods to a novel class of polymer network materials with a highly branched poly(glycidyl ether) (PGE) structure. Said polymer networks are prepared by a simple procedure involving ring-opening polymerisation and the method is applicable to a wide range of glycidyl ether containing monomers. The method comprises the step of copolymerising (A) at least one multi-topic glycidyl ether comprising at least three glycidyl ether groups with (B) at least one glycidyl ether component comprising at least one glycidyl ether group by ring opening polymerisation, wherein the multi-topic glycidyl ether (A) is glycerol glycidyl ether (GGE) having the Formula (I) and the glycidyl ether component (B) is selected from monoglycidyl ethers comprising one glycidyl ether group and diglycidyl ethers comprising two glycidyl ether groups.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: January 30, 2018
    Inventors: Adam Sisson, Duygu Ekinci, Andreas Lendlein, Friedrich Alfons Jung, Nan Ma
  • Patent number: 9845408
    Abstract: The present invention provides a floor coating composition comprising (A) and aqueous solvent; and (B) a chelating polymer which comprises units derived from one or more aminocarboxylate compounds or their salts, one or more other polymerizable monomers, one or more ethylenically unsaturated monomers and, optionally, one or more crosslinking monomers. For example, the aminocarboxylate compounds or their salts may be one or more of iminodiacetic acid (IDA), iminodisuccinic acid (IDS), ethylenediamine triacetic acid (ED3A) and ethylenediamine disuccinic acid (EDDS), or their salts. Suitable polymerizable monomers may be one or more of glycidyl methacrylate (GMA), allyl glycidyl ether (AGE), vinylbenzyl chloride (VBC), allyl bromide, and their derivatives.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: December 19, 2017
    Assignee: Rohm and Haas Company
    Inventors: Afia Sarpong Karikari, Theodore Tysak
  • Patent number: 9834671
    Abstract: A curable epoxy resin composition including: (a) a cycloaliphatic epoxy resin, (b) an oxazolidone ring-containing epoxy resin, (c) a reaction product of (i) an anhydride compound and (ii) a polyol, and (d) an anhydride hardener; a process for preparing the curable epoxy resin composition; and a composite including a reinforcing fiber embedded in a thermoset resin, wherein the thermoset resin is a reaction product of the curable epoxy resin composition.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: December 5, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Yanli Feng, Lejun Qi, Yi Zhang, Wei Du
  • Patent number: 9821523
    Abstract: A light emitting diode lighting device contains a light emitting diode and a lighting device component, wherein the device component comprises a polycarbonate composition comprising a bisphenol A polycarbonate; and 2,2?-(1,4-phenylene)bis(4H-3,1-benzoxazin-4-one) in an amount effective to provide a composition wherein a molded sample of the composition has a UL94 rating of V-2 or better at a thickness of 0.9 mm; an absorbance of less than 2 a.u. in the region of 370 to 380 nanometers; and an increase in yellowness index (?YI) of 12 or less at 2.5 mm thickness after heat aging at 130° C. for 5,000 hours.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: November 21, 2017
    Inventors: Hendrikus Petrus Cornelis van Heerbeek, Frank Huijs, Johannes de Brouwer, Christopher Luke Hein
  • Patent number: 9824900
    Abstract: The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: November 21, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Motomune Kodama, Takashi Naito, Yuichi Sawai, Tadashi Fujieda, Takuya Aoyagi, Masanori Miyagi
  • Patent number: 9796864
    Abstract: A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s?1 and greater than 30 cps at a shear rate of 495 s?1 and a temperature of 25° C.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: October 24, 2017
    Inventors: Yiliang Wu, Bryan A. Nerger
  • Patent number: 9796821
    Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: October 24, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Takuya Aoyagi, Takashi Naito, Tadashi Fujieda, Yuichi Sawai, Hajime Murakami, Hiroshi Yoshida, Akihiro Miyauchi, Masahiko Ogino
  • Patent number: 9783681
    Abstract: Methods of compounding nanoparticles with a resin, e.g., a curable resin and one or more surface modifying agents are described. The methods use wet milling technology, including both continuous and batch milling processes, and can be used to functionalize the nanoparticles and disperse the functionalized nanoparticles into the resin system in a single process. Methods of compounding curable resin systems containing reactive diluents are also disclosed.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: October 10, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Peter D. Condo, Jung-Sheng Wu, Chad A. Haraldson, William J. Schultz, Emily S. Goenner, James E. Thorson, Wendy L. Thompson
  • Patent number: 9777153
    Abstract: A polyalkylene carbonate resin composition with interpenetrating network structure includes an aliphatic polycarbonate obtained through a reaction of carbon dioxide with at least one epoxide compound selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy, (C4-C20)cycloalkylene oxide substituted or unsubstituted with halogen or alkoxy, and (C8-C20)styrene oxide substituted or unsubstituted with halogen, alkoxy, alkyl or aryl, at least one compound selected from a polyol compound, an epoxy compound and an acryl compound, and a curing agent for polymerization or networking.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: October 3, 2017
    Assignees: SK Innovation Co., Ltd., SK Global Chemical Co., Ltd.
    Inventors: Seung Gweon Hong, Jae Young Park, Hye Lim Kim, Ji Yeon Choi, Kwang Jin Chung, Myung Ahn Ok
  • Patent number: 9770889
    Abstract: A composite plate structure including a flexible substrate and a release layer is provided. The flexible substrate has an upper surface and a lower surface. The release layer is disposed on the lower surface of the flexible substrate, and includes a hydrophobic material and a bonding material. The hydrophobic material includes at least one fluorine atom. The bonding material at least includes an amide functional group or an epoxy functional group. The bonding material is bonded to the flexible substrate through the amide functional group or the epoxy functional group. A flexible apparatus including the composite plate structure is also provided.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: September 26, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Hsiao-Fen Wei, Kun-Lin Chuang
  • Patent number: 9745410
    Abstract: There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: August 29, 2017
    Inventors: Mitsuharu Kitamura, Yutaka Matsuura, Hisayuki Kuwahara, Tomotaka Wada, Yuiga Asai
  • Patent number: 9738782
    Abstract: An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: August 22, 2017
    Inventors: Mami Hayashi, Takayuki Fujiwara, Jun Misumi, Kenichi Yoshioka
  • Patent number: 9738783
    Abstract: Curable compositions comprising an epoxy mixture comprising a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy component and having an epoxide equivalent weight in the range of 170 to 200; and ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 and b) a hardener, are disclosed. The curable compositions can be used to prepare prepregs for hot-melt applications.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: August 22, 2017
    Assignee: BLUE CUBE IP LLC
    Inventors: Yi Ling Liang, William W. Fan, Stanley E. Moore, Rui Xie, Mark B. Wilson
  • Patent number: 9725567
    Abstract: In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: August 8, 2017
    Assignee: Mitsubishi Chemical Carbon Fiber and Composites, Inc.
    Inventors: Qiang Wang, Ito Akihiro, Paul Kyle, Augusto Arakaki, Catalina Gutierrez
  • Patent number: 9725816
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: August 8, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9718959
    Abstract: Provided are an aliphatic polycarbonate-polyurethane composition and an aliphatic polycarbonate-polyurethane polymer using the same.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: August 1, 2017
    Assignees: SK Innovation Co., Ltd., SK Global Chemical Co., Ltd.
    Inventors: Ji Yeon Choi, Jae Young Park, Seung Gweon Hong, Tae Wook Kwon, Kwang Jin Chung