Abstract: Presently described are curable compounds and curable compositions. Thermosets including the curable compounds and curable compositions described herein are derived from bio-based components and have improved mechanical properties. The described compositions can also be applicable to rosin derivatives and fatty acid derivatives.

Abstract: A composition contains a mixture of silyl hydride, a siloxane and a Bridged Frustrated Lewis Pair and can be thermally triggered to cure.

Abstract: The present invention discloses a novel diamine that has a structure bearing an intramolecular imide group and additionally an amide-substituted aromatic ring group at opposite sides of the imide group. The use of the novel diamine as a polymerization ingredient in polyimide production can provide a polyimide film which has remarkably improved mechanical and thermal properties while maintaining optical properties.

Abstract: The present disclosure discloses a waterborne epoxy resin for an anti-corrosion coating, and a preparation method and use thereof. In the preparation method, a strongly-hydrophilic polyethylene glycol (PEG) branch is introduced into a molecular chain of epoxy resin to realize the self-emulsification function of epoxy resin. Moreover, due to the short molecular chain, a solid content can reach up to 66.7% under the action of PEG. In addition, the waterborne emulsion can be prepared without adding any additional alcohol-soluble solvents and other high-boiling-point organic solvents, and a production process and a product use process both are very environmentally friendly. The waterborne epoxy resin can be mixed with a waterborne ammonia curing agent to form a film for corrosion protection.

Abstract: The present invention relates to a two-component coating composition comprising one first saturated polyhydroxy component, optionally one second saturated polyhydroxy component, wherein the second polyhydroxy compound is different from the first polyhydroxy compound, at least one metal component, water and at least one polyisocyanate. The resulting composition offers excellent scratch resistance, better mechanical properties and good applicability.

Abstract: A polymer obtainable by reacting a compound A) comprising at least one five-membered cyclic monothiocarbonate group and at least one polymerizable, ethylenically unsaturated group, a compound B) comprising at least one amino group, selected from primary or secondary amino groups, optionally a compound C) which is different from compound A) and comprises at least one five-membered cyclic monothiocarbonate group, and optionally a compound D) which is different from compound A) and comprises at least one functional group that reacts with a group —SH.

Abstract: The present invention relates to thermoplastic polyurethanes obtainable or obtained by reaction of at least one polyisocyanate composition which comprises 4,4?-MDI and at least one further polyisocyanate, at least one chain extender of general formula (I) and at least one polyol composition. The present invention further relates to a production process for such thermoplastic polyurethanes and to the use of a thermoplastic polyurethane according to the invention or of a thermoplastic polyurethane obtainable or obtained by a process according to the invention for producing extrusion products, films and molded articles.

Abstract: Disclosed herein are methods and compositions for preparing a surface comprising thermoplastic or thermoset material to receive a polysulfide or polythioether sealant or coating, the method comprising applying to the surface an activating composition consisting of a tetraalkoxide of a Group 4 metal, a complex of an alkoxide of a Group 4 metal, or a combination thereof.

Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by Piers-Rubinsztajn reaction.

Abstract: A composition for a wire coating material containing a silane-crosslinked polyolefin which is excellent in flame-retardancy, fusion resistance, and heat-deformation resistance, and an insulated wire and a wiring harness coating the composition. A composition for a wire coating material contains (A) a silane-grafted polyolefin which is a polyolefin graft-modified with a silane coupling agent, (B) an unmodified polyolefin, (C) a modified polyolefin having one or more functional groups selected from the group consisting of a carboxy group, an ester group, an acid anhydride group, an amino group, and an epoxy group, (D) a flame retardant, and (E) a crosslinking catalyst. The polyolefin of (A) the silane-grafted polyolefin has a density of 0.855 to 0.890 g/cm3 in an ungrafted state and has a melting point of 80° C. or higher, and the unmodified polyolefin has a density of 0.855 to 0.950 g/cm3.

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

Abstract: The present disclosure provides compositions, articles thereof, and methods of forming compositions. In at least one aspect, a composition includes (1) an epoxy, (2) an amino or amido hardener, (3) a polyaniline, (4) a dopant selected from a triazolyl, a thiazolyl, a quinolinyl, a salicylate, a benzoate, a glycolate, a phosphate, a sulfonate, an oxalate, or combination(s) thereof; and (5) a pigment selected from titanium dioxide, silica, talc, mica, aluminium stearate, or combination(s) thereof. The polyaniline+dopant comprises greater than 6 wt %, by weight of the composition. In at least one aspect, a method includes introducing an acid form of a polyaniline to a hydroxide to form a polyaniline hydroxide. The method includes introducing a dopant to the polyaniline hydroxide to form a doped polyaniline.

Abstract: Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of ?50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

Abstract: A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

Abstract: The present invention relates to a method for preparing a polyolefin block copolymer, the method comprising: a first step of coordination polymerization of an olefin monomer with a transition metal catalyst in the presence of organozinc; and a second step of continuously adding a diacyl peroxide compound to perform polymerization, and to a polyolefin block copolymer prepared therefrom.

Abstract: The present invention further relates to a waterborne dispersion comprising (A) polymer P; (B) amphiphilic block copolymer obtained with a controlled radical polymerization process and comprising at least blocks [A] and [B], whereby block [A] comprises ethylenically unsaturated monomer(s) bearing water-soluble and/or water-dispersible functional groups (monomer(s) (i)), and block [B] comprises ethylenically unsaturated monomer(s) different from monomer(s) (i) (monomer(s) (ii)); and (C) crosslinker, characterized in that the polymer P is crosslinkable and comprises ethylenically unsaturated monomer(s) bearing crosslinkable functional groups different from monomer(s) (i) and monomer(s) (ii) (monomer(s) (iii)) in an amount of from 1 to 10 wt. %, based on the total weight of monomers used to prepare the polymer P, the amount of lock copolymer is higher than 1 wt. % and lower than 30 wt.

Abstract: A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

Abstract: Object of the invention is a process for the manufacturing of a polymer with urethane groups, wherein in a first alternative A) a five-membered cyclic monothiocarbonate B) a compound with at least two amino groups, selected from primary or secondary amino groups, and C) a compound which at least two functional groups that react with a group —SH or, in case of a carbon-carbon triple bond as functional group that react with a group —SH, a compound with at least one carbon-carbon triple bond are reacted or wherein in a second alternative A) a five-membered cyclic monothiocarbonate and D) a compound with at least one primary or secondary amino group and at least one functional group that reacts with a group —SH.

Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 ?m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, —C(O)O—, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.