Abstract: Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.

Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Abstract: A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): X is an oxygen, sulfur, or nitrogen; R1 is an alkyl group, an aryl group, or an alkylaryl group; R2, R3, and R4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R3 and the adjacent nitrogen, m is 1.

Abstract: The present invention relates to a thermosetting resin composition containing an inorganic filler (A1) containing a nanofiller (a), a thermosetting resin (B), and an elastomer (C); and a thermosetting resin composition containing an inorganic filler (A2), a thermosetting resin (B), and an elastomer (C), wherein the inorganic filler (A2) has at least two peaks of a first peak and a second peak in a particle size distribution measured according to the laser diffraction scattering method, and a peak position of the first peak appears at 0.3 to 0.7 ?m, while a peak position of the second peak appears at 0.7 to 1.2 ?m.

Abstract: A polymeric composition for restoring a previously formed spike hole in a wood railroad tie is described. The polymeric composition comprises a resin comprising a chain extender in a concentration of at least about 10 wt % and at least one polyol, and at least one isocyanate-containing compound. The chain extender may be diethylene glycol. The composition may also include a moisture control additive in a concentration of at least 5 wt % of the resin.

Abstract: Copolymer compositions and methods of making copolymer compositions with enhanced stability in high temperature and high salinity environments. The copolymers include hydrophobic monomers and sulfonated monomers. The sulfonated monomers can include 2-acrylamido-2-methylpropane sulfonic acid and allyl sulfonate. The sulfonated monomers increase the stability of the polymers in harsh conditions, and in high temperature, high salinity environments. The sulfonated monomers also reduce or prevent the hydrolysis of acrylamide groups, and therefore enhance the stability of the copolymer. The copolymer compositions can be made with free radical polymerization and an initiation complex.

Abstract: Coating compositions comprise: a B-staged reaction product of one or more compounds comprising: a core chosen from C6-50 carbocyclic aromatic, C2-50 heterocyclic aromatic, C1-20 aliphatic, C1-20 heteroaliphatic, C3-20 cycloaliphatic, and C2-20 heterocycloaliphatic, each of which may be substituted or unsubstituted; and two or more substituents of formula (1) attached to the core: wherein: Ar1 is an aromatic group independently chosen from C6-50 carbocyclic aromatic and C2-50 heteroaromatic, each of which may be substituted or unsubstituted; Z is a substituent independently chosen from OR1, protected hydroxyl, carboxyl, protected carboxyl, SR1, protected thiol, —O—C(?O)—C1-6 alkyl, halogen, and NHR2; wherein each R1 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, and C5-30 aryl; each R2 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, C5-30 aryl, C(?O)—R1, and S(?O)2—R1; x is an integer from 1 to the total number of available aromatic ring atoms in Ar1

Abstract: An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent —NR—, —CO—, —SO—, —CS—, —SO2—, —CH2—, —O—, null, —C(CH3)2—, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.

Abstract: The present invention relates to a new process for preparing polyisocyanates containing isocyanurate groups and being flocculation-stable in solvents from (cyclo)aliphatic diisocyanates.

Abstract: A flexibilizing capped prepolymer can include a reaction product of reaction mixture including a polyisocyanate and an isocyanate-reactive component at an equivalent ratio of polyisocyanate equivalents to isocyanate-reactive component equivalents of from 1.4:1 to 2.1:1. The isocyanate-reactive component can include a polyol component and a branching agent component. The branching agent component can include a monoglyceride, a diglyceride, a triglyceride, or a combination thereof having a number average functionality of from 3 to 6 NCO-reactive functional groups. The reaction product is terminated with a capping agent to form the flexibilizing capped prepolymer.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.

Abstract: The present disclosure relates to a novel composite film configured for CO2 sensing, and the method of making and using the novel composite film. The novel composite film comprises a carbon nanotube film and a CO2 absorbing layer deposited on the carbon nanotube film, wherein the CO2 absorbing layer comprises a mixture of a branched polyethylenimine, a polyethylene glycol, and poly[1-(4-vinylbenzyl)-3-methylimidazolium tetrafluoroborate] of formula I: wherein n ranges from 10-300.

Abstract: Process for the manufacturing of a polymer with urethane groups, wherein in a first alternative a compound A) with at least two five-membered cyclic monothiocarbonate groups and a compound B) with at least two amino groups, selected from primary or secondary amino groups and optionally a compound C) with at least one functional group that reacts with a group —SH are reacted or wherein in a second alternative a compound A) with at least two five-membered cyclic monothiocarbonate groups or a mixture of a compound A) with a compound A1) with one five-membered cyclic monothiocarbonate group and a compound B) with at least two amino groups, selected from primary or secondary amino groups or a compound B1) with one amino group selected from primary or secondary amino groups or mixtures of compounds B) and B1) and a compound C) with at least two functional groups that react with a group —SH or in case of a carbon-carbon triple bond as functional group that react with a group —SH, a compound C) with at least one carb

Abstract: The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.

Abstract: The present invention relates to silicone hydrogels exhibiting desired combinations of physical and mechanical properties, formed from a reactive monomer mixture comprising at least one N-alkyl methacrylamide, and at least one silicone-containing component. These silicone hydrogels may also contain hydrophilic components, crosslinking agents and toughening monomers. These silicone hydrogels are useful in preparing biomedical devices, ophthalmic lenses, and contact lenses.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.

Abstract: A benzocyclobutene-containing polyimide resin and a benzocyclobutene-containing polyimide resin composition are provided. The composition includes: (a) a filler: hollow silica, a perfluoroalkoxy alkane resin, or a combination thereof, and (b) a benzocyclobutene-containing polyimide resin with characteristics of high heat resistance, low dielectric property, low elastic modulus, and suitable for manufacturing a redistribution layer and a polyamide film of a semiconductor packaging material in a high-speed and high-frequency field.

Abstract: Aspects of the present disclosure relate to Schiff base oligomers and uses thereof. In at least one aspect, an oligomer is represented by Formula (IV) wherein each instance of R9 is independently selected from the group consisting of alkyl, cycloalkyl, aryl, heteroaryl, and ether. Each instance of R28 and R29 of Formula (IV) is independently selected from the group consisting of hydrogen, alkyl, cycloalkyl, and aryl. Each instance of R33 of Formula (IV) is independently selected from the group consisting of alkyl, cycloalkyl, aryl, heterocyclyl, and a bond. Each instance of R41 of Formula (IV) is independently —NH— or a bond and each instance of R40 is independently —NH— or —NH—NH—. Each instance of R42 of Formula (IV) is independently —NH— or a bond and each instance of R43 is independently —NH— or —NH—NH—.