Abstract: Methods and data acquisition systems enable joint acquisition of seismic and electromagnetic data in a target area using stand-alone digital recorders.

Abstract: Systems and methods for determining a capacitance on a device-under-test (“DUT”). An example implementation includes a voltage signal generator that generates a voltage signal alternating between a high voltage and a low voltage at regular time intervals. The voltage signal generator causes a DUT current to flow in the DUT. The DUT current comprises a leakage current and a capacitance measurement current in response to the voltage signal. A current signal generator receives the DUT current from the DUT. The current signal generator generates a cancellation current signal alternating between high and low values at the regular time intervals of the voltage signal such that the cancellation current signal cancels the leakage current through the DUT. A signal measurement circuit receives the capacitance measurement current remaining after the leakage current is canceled to generate an output voltage having an output voltage value used to determine a capacitance of the DUT.

Abstract: Hundreds of thousands of concrete bridges and hundreds of billions of tons of concrete require characterization with time for corrosion. Accordingly, protocols for rapid testing and improved field characterization systems that automatically triangulate electrical resistivity and half-cell corrosion potential measurements would be beneficial allowing discrete/periodic mapping of a structure to be performed as well as addressing testing for asphalt covered concrete. Further, it is the low frequency impedance of rebar in concrete that correlates to corrosion state but these are normally time consuming vulnerable to noise. Hence, it would be beneficial to provide a means of making low frequency electrical resistivity measurements rapidly. Further, prior art techniques for electrical rebar measurements require electrical connection be made to the rebar which increases measurement complexity/disruption/repair/cost even when no corrosion is identified.

Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

Abstract: A method for analyzing quality of electrical energy in a three-phase electric network, the method including: measuring a set of electrical magnitudes, the set including one electrical magnitude per phase; forming a space vector from an instantaneous three-dimensional transformation of the set of measured electrical magnitudes; and determining a set including at least one parameter representative of the quality of the electrical energy in the three-phase electric network, according to the space vector.

Abstract: Aspects of the present disclosure include a computer-implemented method for identifying an operating temperature of an integrated circuit (IC), the method including using a computing device for: applying a test voltage to a test circuit embedded within the IC, the test circuit including a phase shift memory (PSM) element therein, wherein the PSM element crystallizes at a crystallization temperature from an amorphous phase having a first electrical resistance into a crystalline phase having a second electrical resistance, the second electrical resistance being less than the first electrical resistance; and identifying the IC as having operated above the crystallization temperature in response to a resistance of the test circuit at the test voltage being outside of the target operating range.

Abstract: A method and apparatus scan a first capacitive sensor element that is located in a first scan region for a presence of a conductive object and then scan a second capacitive sensor element that is located in a second scan region for the presence of the conductive object. The scan of the first capacitive sensor element includes applying a ground voltage to a ground element through the second capacitive sensor element, the ground element located in the first scan region.

Abstract: Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober; removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

Abstract: A testing apparatus to establish a fault by a process of elimination includes an input unit, a signal converting unit, a switch unit, and a display unit. The input unit receives an input signal and outputs a switch signal. The signal converting unit receives the switch signal and outputs a control signal. The switch unit receives the control signal and outputs a test signal. The display unit receives the test signal and runs a built in self test (BIST) program to test the proper functioning of the display unit. The signal converting unit outputs a data signal and a clock signal to the display unit when the display unit works normally. The signal converting unit not output the data signal and the clock signal to the display unit when the input signal and resulting control signal are repeated.

Abstract: A jack detector detects a combination state between a socket including a detecting pin and a first signal pin and a jack. The jack detector includes a first current source for supplying a first detecting current, a second current source for supplying a second detecting current larger than the first detecting current, and a buffer for generating a detecting signal in accordance with a detecting pin voltage input from the detecting pin. The second current source instead of the first current source is connected to the detecting pin in synchronization with a combination starting point when the detecting pin and the first signal pin are electrically connected to each other and it is determined that the jack is combined with the socket when the detecting signal is maintained at a state of the combination starting point.

Abstract: A method of preventing inter-system interference while acquiring waveforms in a test and measurement instrument with variation in a device under test system S-parameters. The method includes receiving a waveform from a device under test at the test and measurement instrument, digitizing the waveform, identifying portions of the digitized waveform with different S-parameter characteristics, separating the identified portions of the digitized waveform into different waveforms, and displaying the different waveforms to a user.

Abstract: A two-axes MEMS magnetometer includes, in one plane, a freestanding rectangular frame having inner walls and four torsion springs, wherein opposing inner walls of the frame are contacted by one end of only two torsion springs, each torsion spring being anchored by its other end, towards the center of the frame, to a substrate. In operation, the magnetometer measures the magnetic field in two orthogonal sensing modes using differential capacitance measurements.

Abstract: A sensor measures a sample in a measuring cell including a helix conductor. The shell structure of the measuring cell is made of an electrically non-conductive material. The measuring cell and at least part of the helix conductor are placeable inside a chamber. A radio-frequency signal input element couples a radio-frequency signal to the chamber to form a helix resonance. A radio-frequency signal output element is responsive to a helix resonance of the helix conductor and transmits a radio-frequency signal for measurement. A device for measuring a sample in a measuring cell includes the sensor, a radio-frequency signal source, and a measuring and control part. The radio-frequency signal source produces a radio-frequency signal to the input element. The measuring and control part measures a property of a sample on the basis of a resonance frequency.

Abstract: A semiconductor device inspection system (1) includes a laser beam source (2), for emitting light, an optical sensor (12) for detecting the light reflected by the semiconductor device (10) from the light and outputting a detection signal, a frequency band setting unit (16) for setting a measurement frequency band and a reference frequency band with respect to the detection signal, a spectrum analyzer (15) for generating a measurement signal and a reference signal from the detection signals in the measurement frequency band and the reference frequency band, and a signal acquisition unit (17) for calculating a difference between the measurement signal and the reference signal to acquire an analysis signal. The frequency band setting unit (16) sets the reference frequency band to a frequency domain in which a level of the detection signal is lower than a level obtained by adding 3 decibels to a white noise level serving as a reference.

Abstract: Approaches are disclosed for electrical impedance tomography which apply a current to a region at two or more frequencies and acquire voltage measurements at each frequency to generate a set of multi-frequency voltage measurements. One or more images of the region are generated, using spectral constraints, based on the multi-frequency data.

Abstract: Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

Abstract: The present disclosure is a system for monitoring power that has a unified polyphase distribution transformer monitoring (PDTM) device that interfaces with at least three electrical conductors electrically connected to a transformer. In addition, the PDTM device measures a current and a voltage of each of the three electrical conductors. Additionally, the system has logic that calculates values indicative of power corresponding to the transformer based upon the currents and the voltages measured and transmit data indicative of the calculated values.

Abstract: A testing apparatus for providing per pin level setting is disclosed, and the testing apparatus includes a control unit and a filter circuit, where the control unit is electrically connected to the filter circuit. The control unit includes a field programmable gate array (FPGA) for providing a PWM signal. The filter circuit receives the PWM signal and outputs at least one DC voltage.

Abstract: A ground fault detection circuit comprising a fuse and a fuse detect circuit. The fuse and the fuse detect circuit are arranged to be coupled in parallel between a reference point and a second point of a monitored circuit for which ground faults are to be detected. The fuse detect circuit is further arranged to detect a fuse break indicative of a ground fault condition and disable at least a portion of the monitored circuit.

Abstract: A characterization apparatus for characterizing a liquid containing insoluble particles includes a housing including an inlet portion defining an inlet passage between an inlet end and a first channel end, a channel portion defining a measurement channel between the first channel end and a second channel end, and an outlet portion defining an outlet passage between the second channel end and an outlet end. The channel portion includes a first electrode and a second electrode at a first and second side of the channel. The apparatus also includes a measurement device configured for measuring an electric measure representative for properties of the liquid flowing between the first electrode and the second electrode. The inlet passage gradually changes shape from the inlet end to the first channel end. The outlet passage gradually changes shape from the second channel end to the outlet end.