Patents Examined by Rhadames J Alonzo Miller
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Patent number: 10777786Abstract: Electrical feedthroughs for battery housings are presented. The electrical feedthroughs include a connector, a ceramic insulator, and a terminal. A first seal couples the connector to the ceramic insulator via a first braze alloy. A second seal couples the ceramic insulator to the terminal via a second braze alloy. The electrical feedthroughs can also include a spacer. A first seal couples the connector to the ceramic insulator; a second seal couples the ceramic insulator to the spacer; and the third seal couples the spacer to the terminal. The first seal, the second seal, and the third seal include, respectively, a first braze alloy, a second braze alloy, and a third braze alloy.Type: GrantFiled: December 20, 2019Date of Patent: September 15, 2020Assignee: Apple Inc.Inventors: YooEup Hyung, Victor W. Santini
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Patent number: 10176924Abstract: A multilayer ceramic capacitor may include a ceramic body including a plurality of dielectric layers; a first internal electrode disposed in the ceramic body and exposed to a first side surface in a width direction of the ceramic body and a second internal electrode disposed in the ceramic body and exposed to the first side surface in the width direction of the ceramic body; and first to third external electrodes disposed on the first side surface in the width direction of the ceramic body.Type: GrantFiled: November 2, 2017Date of Patent: January 8, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Kwang Lee, Jin Kim, Ju Eun Nam, Young Ghyu Ahn
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Patent number: 10148051Abstract: A modular structural member (100) comprising: at least two connection portions (102), and a structural portion (101), the connection portions arranged to provide electrical and mechanical connection to other structural members, and wherein, electronic componentry (125) is provided on the structural portion, and/or the connection portions are arranged to receive a fastener (240; 260), to connect multiple connection portions together, which is provided with electronic componentry, and further wherein, a plurality of the structural members arranged to be connected together to form a structure.Type: GrantFiled: December 22, 2016Date of Patent: December 4, 2018Assignee: University of Southampton, Research and Innovation ServicesInventors: Reuben Wilcock, Thomas Redman
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Patent number: 10128588Abstract: A cable connecting structure includes a cable that includes a conductive film formed on a surface of a core line exposed at a distal end surface, and a substrate that includes an electrode formed on a predetermined connection side surface for connecting the cable. The distal end surface of the cable and the connection side surface of the substrate are arranged so as to face each other. The conductive film formed on the surface of the core line and the electrode are connected by a conductive material.Type: GrantFiled: June 18, 2012Date of Patent: November 13, 2018Assignee: OLYMPUS CORPORATIONInventor: Mikio Nakamura
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Patent number: 10128023Abstract: An cable that is flexible and watertight by means of a metallic water resistant barrier has at least two protective layers 20, 30 of metal tape wound to a cable core 10 with small gaps 50 between each turn of the tape, and where each layer is displaced 50% relative to each other thus covering the gaps in the layers 20, 30, and where the gaps 50 are filled with a water resistant material.Type: GrantFiled: August 25, 2014Date of Patent: November 13, 2018Assignee: NEXANSInventor: Espen Olsen
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Patent number: 10123776Abstract: A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.Type: GrantFiled: June 19, 2015Date of Patent: November 13, 2018Assignee: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD.Inventors: Zhenyu Chen, Ming Tang
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Patent number: 10123415Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.Type: GrantFiled: July 29, 2013Date of Patent: November 6, 2018Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takahiro Hayashi, Seiji Mori, Tatsuya Ito
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Patent number: 10111348Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.Type: GrantFiled: October 17, 2014Date of Patent: October 23, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro Shimizu, Kiyoyuki Nakagawa
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Patent number: 10109409Abstract: A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.Type: GrantFiled: November 14, 2014Date of Patent: October 23, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hwan Lee, Chan Yoon, Hye Yeon Cha, Jin Woo Han
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Patent number: 10104937Abstract: An article of footwear, an article of apparel or protective gear can include a tensioning apparatus for tightening, for example, laces, cables or strings or other devices that secure the article to a wearer. The tensioning apparatus receives signals from an input assembly that is in communication with the tensioning apparatus. The input assembly may include pairs of wires that have twisted loops or other curvilinear segments that allow the input assembly to accommodate to different actions by the wearer of the footwear. The input assembly may also include a flexible epoxy cover that protects the connections between the wires and a printed circuit board that includes input devices.Type: GrantFiled: March 15, 2016Date of Patent: October 23, 2018Assignee: NIKE, Inc.Inventors: Tiffany A. Beers, Andrew A. Owings, Steven H. Walker
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Patent number: 10096398Abstract: An electrical cable (1) is provided having (1) a conductive element (2), a first layer (3) having polyimide (PI) surrounding said conductive element (2), a second fluorinated layer (4) having at least one fluorinated compound, surrounding the first layer, and optionally at least one fluorinated semiconductor layer having at least one fluorinated compound, where the total thickness of the assembly of fluorinated layers is at least 0.4 mm.Type: GrantFiled: August 7, 2012Date of Patent: October 9, 2018Assignee: NEXANSInventors: Hakim Janah, Thiery Daumand, Virak Phul, Patrick Rybski, Pascal Clouet, Wilfried Lecluse, Rui Manuel Da Silva
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Patent number: 10080286Abstract: A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg.Type: GrantFiled: February 15, 2012Date of Patent: September 18, 2018Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventor: Hiroyuki Waku
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Patent number: 10068869Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.Type: GrantFiled: October 12, 2015Date of Patent: September 4, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Kiyohiro Hine, Akio Furusawa, Masato Mori, Taichi Nakamura, Hidetoshi Kitaura
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Patent number: 10070545Abstract: The invention relates to an electrical device (1) having a housing (2) and at least one receiving shaft (3), which is accessible from an outer side of the housing (2), for an electronic data storage means (4) which can be inserted into the receiving shaft (3) and, as a result, can make contact with electrical components arranged in the electrical device (1) and optionally can be removed again from the receiving shaft (3), wherein the receiving shaft (3) is surrounded at least partially by a recessed grip (5) on the outer side of the housing (2), which recessed grip is designed as a depression with respect to the outer contour of the housing (2), wherein at least one light exit opening (9) for light output by at least one electric light source (10) of the electrical device (1) is arranged within the recessed grip (5).Type: GrantFiled: February 27, 2015Date of Patent: September 4, 2018Assignee: WAGO VERWALTUNGSGESELLSCHAFT MBHInventor: Lars Binner
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Patent number: 10063044Abstract: A rigid joint assembly for jointing two cables; the assembly includes outer cable entry parts outside a water-tight casing assembly. A first and second cable insulation system deformation preventing devices are provided, each including a rigid pipe, which surrounds a respective first or second cable core end section, and a bedding material layer, which extends at least partially along a length of an inner surface of the respective rigid pipe. The assembly further includes first and second grooved pipes of elastic material having a plurality of grooves on the side facing the cable, each grooved pipe surrounding the respective first or second cable core end section at a respective inner cable entry part inside the water-tight casing assembly 30.Type: GrantFiled: May 26, 2016Date of Patent: August 28, 2018Assignee: NKT HV Cables GmbHInventors: Håkan Sandell, Andreas Tyrberg, Armando León-Guarena, Henrik Ekholm
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Patent number: 10056170Abstract: A shielded cable includes adjacent first and second conductor sets, each conductor set includes a pair of insulated conductors. At least 90% of a periphery of each conductor set is encompassed by a shielding film. The cable also includes first and second non-conductive polymeric films disposed on opposite sides of the cable. The polymeric films include cover portions and pinched portions. In transverse cross section, the cover portions of the polymeric films in combination surround the conductor sets, and the pinched portions of the polymeric films in combination form pinched portions of the cable on each side of the cable. When the cable is laid flat, a center-to-center spacing of the pair of insulated conductors for the first conductor set is ?1 and a center-to-center spacing of the first and second conductor sets is ?. ?/?1 is less than 4.Type: GrantFiled: February 15, 2017Date of Patent: August 21, 2018Assignee: 3M Innovative Properties CompanyInventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley
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Patent number: 10053810Abstract: The laundry treatment apparatus may include a cabinet providing an accommodation space, a drum rotatably provided inside the cabinet, a front cover unit provided on a portion of a front surface of the cabinet and having a cover hole provided to enable introduction and discharge of laundry into the drum, and a door assembly provided on the front cover unit so as to open or close the cover hole. The door assembly includes a hinge unit having one side separably coupled to the front cover unit and a remaining side separably coupled to the door assembly, so as to rotate the door assembly, and a handle unit separably coupled to the door assembly. The hinge unit and the handle unit are separably coupled to the door assembly by exchanging positions thereof.Type: GrantFiled: January 5, 2016Date of Patent: August 21, 2018Assignee: LG ELECTRONICS INC.Inventors: Seonil Heo, Kihyun Kim
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Patent number: 10049791Abstract: A differential transmission cable includes a pair of signal lines, an insulation covering the pair of signal lines, and a shielding tape helically wound around the insulation. The shielding tape includes a conductor and an insulation layer that is formed on one surface of the conductor and that has a thickness of not less than 10 nm and less than 1 ?m.Type: GrantFiled: September 27, 2016Date of Patent: August 14, 2018Assignee: HITACHI METALS, LTD.Inventors: Hiroshi Ishikawa, Takahiro Sugiyama
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Patent number: 10021779Abstract: An apparatus and system for attaining quick response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single spherical tungsten (or other material) ball in a single or plurality of sealed spherical chambers in a particle impact damper (PID). The single spherical tungsten (or other material) ball is not weighed down, constrained, encumbered or influenced by other spherical balls within the chamber; accordingly, providing unrestricted freedom for the ball to quickly respond at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single spherical particle within a sealed spherical chamber also provides a path of minimum distance for the ball to travel before colliding with the ceiling or side walls of the PID chamber. A plurality of spherical chambers can be arranged in a variety of patterns within the PID housing such as desired.Type: GrantFiled: November 28, 2017Date of Patent: July 10, 2018Assignee: TopLine CoporationInventor: Martin B. Hart
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Patent number: 10009997Abstract: A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.Type: GrantFiled: June 12, 2012Date of Patent: June 26, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroharu Inoue, Koji Kishino