Patents Examined by Rhadames J Alonzo Miller
  • Patent number: 10176924
    Abstract: A multilayer ceramic capacitor may include a ceramic body including a plurality of dielectric layers; a first internal electrode disposed in the ceramic body and exposed to a first side surface in a width direction of the ceramic body and a second internal electrode disposed in the ceramic body and exposed to the first side surface in the width direction of the ceramic body; and first to third external electrodes disposed on the first side surface in the width direction of the ceramic body.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: January 8, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Kwang Lee, Jin Kim, Ju Eun Nam, Young Ghyu Ahn
  • Patent number: 10148051
    Abstract: A modular structural member (100) comprising: at least two connection portions (102), and a structural portion (101), the connection portions arranged to provide electrical and mechanical connection to other structural members, and wherein, electronic componentry (125) is provided on the structural portion, and/or the connection portions are arranged to receive a fastener (240; 260), to connect multiple connection portions together, which is provided with electronic componentry, and further wherein, a plurality of the structural members arranged to be connected together to form a structure.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: December 4, 2018
    Assignee: University of Southampton, Research and Innovation Services
    Inventors: Reuben Wilcock, Thomas Redman
  • Patent number: 10128588
    Abstract: A cable connecting structure includes a cable that includes a conductive film formed on a surface of a core line exposed at a distal end surface, and a substrate that includes an electrode formed on a predetermined connection side surface for connecting the cable. The distal end surface of the cable and the connection side surface of the substrate are arranged so as to face each other. The conductive film formed on the surface of the core line and the electrode are connected by a conductive material.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: November 13, 2018
    Assignee: OLYMPUS CORPORATION
    Inventor: Mikio Nakamura
  • Patent number: 10128023
    Abstract: An cable that is flexible and watertight by means of a metallic water resistant barrier has at least two protective layers 20, 30 of metal tape wound to a cable core 10 with small gaps 50 between each turn of the tape, and where each layer is displaced 50% relative to each other thus covering the gaps in the layers 20, 30, and where the gaps 50 are filled with a water resistant material.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: November 13, 2018
    Assignee: NEXANS
    Inventor: Espen Olsen
  • Patent number: 10123776
    Abstract: A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: November 13, 2018
    Assignee: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD.
    Inventors: Zhenyu Chen, Ming Tang
  • Patent number: 10123415
    Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: November 6, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takahiro Hayashi, Seiji Mori, Tatsuya Ito
  • Patent number: 10104937
    Abstract: An article of footwear, an article of apparel or protective gear can include a tensioning apparatus for tightening, for example, laces, cables or strings or other devices that secure the article to a wearer. The tensioning apparatus receives signals from an input assembly that is in communication with the tensioning apparatus. The input assembly may include pairs of wires that have twisted loops or other curvilinear segments that allow the input assembly to accommodate to different actions by the wearer of the footwear. The input assembly may also include a flexible epoxy cover that protects the connections between the wires and a printed circuit board that includes input devices.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: October 23, 2018
    Assignee: NIKE, Inc.
    Inventors: Tiffany A. Beers, Andrew A. Owings, Steven H. Walker
  • Patent number: 10109409
    Abstract: A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwan Lee, Chan Yoon, Hye Yeon Cha, Jin Woo Han
  • Patent number: 10111348
    Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: October 23, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro Shimizu, Kiyoyuki Nakagawa
  • Patent number: 10096398
    Abstract: An electrical cable (1) is provided having (1) a conductive element (2), a first layer (3) having polyimide (PI) surrounding said conductive element (2), a second fluorinated layer (4) having at least one fluorinated compound, surrounding the first layer, and optionally at least one fluorinated semiconductor layer having at least one fluorinated compound, where the total thickness of the assembly of fluorinated layers is at least 0.4 mm.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: October 9, 2018
    Assignee: NEXANS
    Inventors: Hakim Janah, Thiery Daumand, Virak Phul, Patrick Rybski, Pascal Clouet, Wilfried Lecluse, Rui Manuel Da Silva
  • Patent number: 10080286
    Abstract: A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: September 18, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventor: Hiroyuki Waku
  • Patent number: 10068869
    Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: September 4, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kiyohiro Hine, Akio Furusawa, Masato Mori, Taichi Nakamura, Hidetoshi Kitaura
  • Patent number: 10070545
    Abstract: The invention relates to an electrical device (1) having a housing (2) and at least one receiving shaft (3), which is accessible from an outer side of the housing (2), for an electronic data storage means (4) which can be inserted into the receiving shaft (3) and, as a result, can make contact with electrical components arranged in the electrical device (1) and optionally can be removed again from the receiving shaft (3), wherein the receiving shaft (3) is surrounded at least partially by a recessed grip (5) on the outer side of the housing (2), which recessed grip is designed as a depression with respect to the outer contour of the housing (2), wherein at least one light exit opening (9) for light output by at least one electric light source (10) of the electrical device (1) is arranged within the recessed grip (5).
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: September 4, 2018
    Assignee: WAGO VERWALTUNGSGESELLSCHAFT MBH
    Inventor: Lars Binner
  • Patent number: 10063044
    Abstract: A rigid joint assembly for jointing two cables; the assembly includes outer cable entry parts outside a water-tight casing assembly. A first and second cable insulation system deformation preventing devices are provided, each including a rigid pipe, which surrounds a respective first or second cable core end section, and a bedding material layer, which extends at least partially along a length of an inner surface of the respective rigid pipe. The assembly further includes first and second grooved pipes of elastic material having a plurality of grooves on the side facing the cable, each grooved pipe surrounding the respective first or second cable core end section at a respective inner cable entry part inside the water-tight casing assembly 30.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: August 28, 2018
    Assignee: NKT HV Cables GmbH
    Inventors: Håkan Sandell, Andreas Tyrberg, Armando León-Guarena, Henrik Ekholm
  • Patent number: 10056170
    Abstract: A shielded cable includes adjacent first and second conductor sets, each conductor set includes a pair of insulated conductors. At least 90% of a periphery of each conductor set is encompassed by a shielding film. The cable also includes first and second non-conductive polymeric films disposed on opposite sides of the cable. The polymeric films include cover portions and pinched portions. In transverse cross section, the cover portions of the polymeric films in combination surround the conductor sets, and the pinched portions of the polymeric films in combination form pinched portions of the cable on each side of the cable. When the cable is laid flat, a center-to-center spacing of the pair of insulated conductors for the first conductor set is ?1 and a center-to-center spacing of the first and second conductor sets is ?. ?/?1 is less than 4.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: August 21, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley
  • Patent number: 10053810
    Abstract: The laundry treatment apparatus may include a cabinet providing an accommodation space, a drum rotatably provided inside the cabinet, a front cover unit provided on a portion of a front surface of the cabinet and having a cover hole provided to enable introduction and discharge of laundry into the drum, and a door assembly provided on the front cover unit so as to open or close the cover hole. The door assembly includes a hinge unit having one side separably coupled to the front cover unit and a remaining side separably coupled to the door assembly, so as to rotate the door assembly, and a handle unit separably coupled to the door assembly. The hinge unit and the handle unit are separably coupled to the door assembly by exchanging positions thereof.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: August 21, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Seonil Heo, Kihyun Kim
  • Patent number: 10049791
    Abstract: A differential transmission cable includes a pair of signal lines, an insulation covering the pair of signal lines, and a shielding tape helically wound around the insulation. The shielding tape includes a conductor and an insulation layer that is formed on one surface of the conductor and that has a thickness of not less than 10 nm and less than 1 ?m.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: August 14, 2018
    Assignee: HITACHI METALS, LTD.
    Inventors: Hiroshi Ishikawa, Takahiro Sugiyama
  • Patent number: 10021779
    Abstract: An apparatus and system for attaining quick response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single spherical tungsten (or other material) ball in a single or plurality of sealed spherical chambers in a particle impact damper (PID). The single spherical tungsten (or other material) ball is not weighed down, constrained, encumbered or influenced by other spherical balls within the chamber; accordingly, providing unrestricted freedom for the ball to quickly respond at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single spherical particle within a sealed spherical chamber also provides a path of minimum distance for the ball to travel before colliding with the ceiling or side walls of the PID chamber. A plurality of spherical chambers can be arranged in a variety of patterns within the PID housing such as desired.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: July 10, 2018
    Assignee: TopLine Coporation
    Inventor: Martin B. Hart
  • Patent number: 10009997
    Abstract: A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: June 26, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroharu Inoue, Koji Kishino
  • Patent number: 9999120
    Abstract: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21) for electrically connecting the components (12, 14) are realized by means of a single layered composite (18). In particular, the electric shield (24) and the conducting path (21) are formed by the same electrically conductive layer, wherein a hole (25) ensures complete electrical insulation of the conducting path (21) from the shield (24). The invention further relates to a method for producing such a circuit carrier.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: June 12, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Florian Poprawa, Markus Schieber, Christina Schindler, Jörg Zapf