Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: A plastic retaining pin for being inserted through a retaining hole in a high voltage insulating cover has an oval cross-section. The pin has a compressible nose, with the wide part of the nose being larger than the retaining hole. The nose has a relatively long front portion that expands out from the tip at about a 15 degree angle for easy insertion through the retaining hole. A back part of the nose is relatively short and has a relatively steep angle of about 45 degrees so as to require a higher pulling force to compress the nose when removing the pin from the hole. The other end of the pin has a grasping hole for receiving the hook of a hot stick. If the retaining hole is oval, the grasping hole is at a predetermined orientation with respect to the insulating structure to ease removal using a hot stick.

Abstract: Contemplated device, assembly and methods include a sensor feed through assembly that protects and seals a set of wires. The assembly has a body, a first seal, a second seal and a cover. The wires thread through a first opening on the body through a second opening of the first seal and exit orthogonally between the first seal and the second seal. The cover tightens the entire assembly and secures the wires between the two seals. The entire unit can be coupled to other pressurized vessels under different temperatures and pressurized environments.

Abstract: A first selection of mesh line segments of a mesh layer are of a first width and a second selection of mesh line segments of the mesh layer are of a second width, wherein the second width is greater than the first width. The second selection of mesh line segments of the second width are positioned in parallel to a selection of signal lines in a signal layer that are likely to introduce crosstalk, wherein the widening of the mesh line segments shadowing the selection of signal lines increases the likelihood that the return current associated with the signal will flow in the wider mesh line segment, thereby increasing the likelihood of containing the electromagnetic fields associated with the signal such that crosstalk to other signals is reduced or contained.

Abstract: A programmable logic controller (PLC) assembly includes a bottom housing with a base, a first plurality of elongate alignment features extending from the bottom housing transverse to the base, and a first connection feature. The PLC assembly includes a central processing unit with a circuit board and at least two receptacles therethrough configured to engage and slide along at least two of the first plurality of alignment features. The at least two of the first plurality of alignment features are positioned asymmetrically with respect to the base. The PLC assembly includes an upper housing with a second connection feature configured to slidably couple with the first connection feature and a second plurality of elongate alignment features configured to slidably engage at least two of the first plurality of alignment features, which are positioned asymmetrically with respect to the base.

Abstract: A flame-retardant cable includes at least one conductor and at least one coating made from a flame-retardant composition. The flame-retardant composition includes: (a) at least one crystalline propylene homopolymer or copolymer; (b) at least one copolymer of ethylene with at least one C3-C12 alpha-olefin, having a density of from 0.860 to 0.904 g/cm3 and a Molecular Weight Distribution Index not higher than 5; (c) at least one ethylene homopolymer or copolymer of ethylene with at least one C3-C12 alpha-olefin having a density of from 0.905 to 0.970 g/cm3; and (d) at least one flame-retardant filler.

Abstract: An electrical connector assembly includes a cage having an upper wall, a lower wall, and side walls that extend from the upper wall to the lower wall. The side walls have exterior sides. The cage includes an interior cavity and a divider that extends between the side walls and divides the interior cavity into at least two internal compartments. The cage includes a front end that is open to the internal compartments. The side walls have front edges at the front end. The internal compartments are configured to receive pluggable modules therein through the front end. An electromagnetic interference (EMI) cover is mounted to the divider such that the EMI cover is engaged with and electrically connected to the divider. The EMI cover includes a flap that wraps around the front edge of a corresponding side wall. The flap overlaps and engages the exterior side of the corresponding side wall.

Abstract: A cable connection structure includes a multi-core coaxial cable connected to a board. The multi-core coaxial cable includes a plurality of parallel-arranged coaxial cables each including a center conductor and an inner insulator, an outer conductor and an outer insulator sequentially formed on an outer periphery of the center conductor. The board includes a signal electrode connected to the center conductor and a ground electrode connected to the outer conductor. The cable connection structure further includes a positioning member lying between the signal electrode and the ground electrode for positioning the center conductor while the inner insulator is attached to the positioning member.

Abstract: A cover for an electronic device includes first and second planar members wherein, a first end of the second planar member is disposed adjacent to a first end of the first planar member. The cover also includes a coupling arrangement configured to be attached to a first end of the electronic device and configured to permit rotation of the first and second planar members around the first end of the electronic device, and a rotational hinge configured to couple together the first ends of the first and second planar members such that the second planar member is rotatable with respect to the first planar member.

Abstract: A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface.

Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

Abstract: A shielded electrical ribbon cable includes conductor sets each including one or more insulated conductors, and a first and second shielding film on opposite sides of the cable. In transverse cross section, cover portions of the shielding films substantially surround each conductor set, and pinched portions of the films form pinched portions of the cable on each side of each conductor set. Dense packing is achieved while maintaining high frequency electrical isolation between conductor sets. When the cable is laid flat, a quantity s/Dmin is in a range from 1.7 to 2, where S is a center- to-center spacing between nearest insulated conductors of two adjacent conductor sets, and Dmin is the lesser of the outer dimensions of such nearest insulated conductors. Alternatively, a first and second conductor set each having only one pair of insulated conductors can satisfy a condition that ?/?1 is in a range from 2.5 to 3.

Abstract: The foamed electric wire with a conductor and a foamed insulation layer covering the conductor; the foamed insulation layer is obtained by kneading a base resin composed of a high melting point propylene-based resin having a melting point of 150° C. or higher with a master batch containing a thermally decomposing chemical foaming agent and a low melting point propylene-based resin having a melting point of 135° C. or lower and melting the low melting point propylene-based resin followed by foaming by inducing thermal decomposition of the thermally decomposing chemical foaming agent, and a compounding ratio of the low melting point propylene-based resin in the entire resin component formed of the high melting point propylene-based resin and the low melting point propylene-based resin is less than 20% by mass.

Abstract: The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.

Abstract: A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad and a thickness of the stress buffer metal layer being 1-20 ?m, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post.

Abstract: A composite gasket for sealing and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.

Abstract: The present invention relates to an electrode comprising an auxiliary electrode comprising a conductive pattern and a main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode, and a manufacturing method thereof.

Abstract: A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.

Abstract: A bonding wire for semiconductor includes: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer. The alloy layer contains a noble metal and palladium and having a thickness of 1 to 80 nm. The noble metal is either gold or silver, and a concentration of the noble metal in the alloy layer is not less than 10% and not more than 75% by volume.

Abstract: An electronic device including a case, a covering plate, at least one first fixing unit, at least one second fixing unit, a circuit board disposed in the case, and a plurality of screwing members is provided. The case covered by the covering plate has a first datum surface and a second datum surface, where a distance between the covering plate and the first datum surface is greater than a distance between the covering plate and the second datum surface. The first and the second fixing units are disposed on the first and the second datum surfaces respectively. The first fixing unit includes a first screwing boss and at least one first rib adjacent thereto. The second fixing unit includes a second screwing boss and at least one second rib adjacent thereto. The screwing members pass through the covering plate and are screwed to the corresponding first and second screwing bosses.