Patents Examined by Richard Isla
  • Patent number: 12782390
    Abstract: A guide board mechanism includes two guide board modules spaced apart from each other. Each of the two guide board modules includes two guide boards, a spacing sheet sandwiched between the two guide boards, and at least two connection circuits that are formed on one of the two guide boards. In each of the two guide board modules, any one of the two guide boards has a plurality of thru-holes defined as at least two thru-hole groups, and the at least two connection circuits are arranged along the at least two thru-hole groups. Moreover, patterns of the at least two connection circuits in one of the two guide board modules are respectively identical to patterns of the at least two connection circuits in another one of the two guide board modules.
    Type: Grant
    Filed: January 2, 2025
    Date of Patent: November 3, 2026
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yu-Ju Lu, Hao-Yen Cheng, Rong-Yang Lai, Wei-Jhih Su
  • Patent number: 12782441
    Abstract: A discharge detection system includes a main breaker; a number of branch breakers; a number of discharge detection units; and at least one current limiting resistor. Each branch breaker is configured to interrupt a circuit based on a difference in a current value between a current I1 flowing in a first electrode and a current I2 flowing in a second electrode. Each discharge detection unit includes a discharge detection section configured to detect a noise superimposed on a voltage or current and a switch electrically connected to the first electrode of the corresponding branch breaker. The switch of each discharge detection unit has a secondary side electrically connected to common wirings.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: November 3, 2026
    Assignee: NITTO KOGYO CORPORATION
    Inventors: Atsushi Miyamoto, Tomoyasu Sakai, Hiyori Ajioka
  • Patent number: 12775042
    Abstract: Embodiments of the present invention provide a contact chuck test head for a handler of an integrated circuit tester system. The contact chuck test head comprises a magnetically held DUT contact unit that can be replaced by a technician without requiring any tool or special equipment. The contact chuck test head t is mounted to an automated handler. Magnets are employed at an interface between the DUT contact unit and contact chuck base. This allows the DUT contact unit to be brought into close proximity to the contact chuck base portion and magnetic forces act to both align and mate the two parts together. Since the DUT contact unit requires change out to accommodate different sizes and types of DUTs, it is advantageous to provide an easy swap-out mechanism.
    Type: Grant
    Filed: October 11, 2023
    Date of Patent: October 27, 2026
    Assignee: ADVANTEST CORPORATION
    Inventor: Patrick Sherman
  • Patent number: 12768900
    Abstract: A power converter includes an inverter including an inverter circuit configured to convert a DC power into an AC power, and a reactor provided between the inverter circuit and an interconnection point, and a control device configured to control the inverter as a voltage controlled inverter. The inverter outputs an output voltage superimposed with a harmonic to the interconnection point. The control device generates a first signal obtained by multiplying a signal of the harmonic to an output current measurement value of the inverter, generates a second signal by filtering the first signal, generates a third signal that is an absolute value of the second signal, generates a fourth signal by performing a lowpass filtering process on the third signal, and detects an islanding operation of the inverter based on the third signal and the fourth signal.
    Type: Grant
    Filed: December 5, 2024
    Date of Patent: October 20, 2026
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Takashi Hayashi
  • Patent number: 12761177
    Abstract: A measurement apparatus includes at least one conductive sensing plate; and a capacitance measurement circuit connected to the sensing plate. The capacitance measurement circuit is configured to measure a capacitance that includes the sensing plate, a substrate, and a residual solvent on the substrate when the substrate is arranged below the sensing plate and provide information of the residual solvent on the substrate using the measured capacitance.
    Type: Grant
    Filed: May 21, 2024
    Date of Patent: October 13, 2026
    Assignee: Analog Devices International Unlimited Company
    Inventors: Neal Tait Kurfiss, Jonathan Ephraim David Hurwitz
  • Patent number: 12761248
    Abstract: The present invention discloses a non-contact AC/DC sensing probe and a sensing method and application thereof. The non-contact AC/DC sensing probe adopts a Hall sensing module, breaks through the limitation that a traditional induction coil can sense only an AC current, and can directly perform AC/DC sensing on a single wire or a cable composed of two or more wires, so as to allow the target wire to generate an electromagnetic signal to be collected by the Hall sensing module, and sensing of electrical parameters, including a current, a voltage, a frequency, a duty cycle, a phase, a harmonic, a frequency-conversion signal, etc. is realized without peeling and cable branching, so that the non-contact AC/DC current sensing probe is simple and convenient to operate, can be applied to measuring instruments such as a test pen, a multimeter and a clamp meter, and has a wide range of applications.
    Type: Grant
    Filed: July 18, 2024
    Date of Patent: October 13, 2026
    Assignees: MEET ELECTRONICS LTD.
    Inventors: Ronald Chi Kang Chou, Kai Sheng Chou
  • Patent number: 12761247
    Abstract: A a testing head with vertical probes for a probe card, including: at least one pair of support and guide plates arranged parallel to each other in a prefixed spaced apart relation and provided with a plurality of guide and housing holes; a plurality of contact probes housed and extended between corresponding holes of the guide plates; at least one additional plate slidingly mounted next to one or the other of the guide plates and provided with one corresponding plurality of holes of the guide plates. The embodiments also relate to a method of assembly of the testing head.
    Type: Grant
    Filed: October 11, 2023
    Date of Patent: October 13, 2026
    Assignee: Microtest S.p.A.
    Inventor: Giuseppe Amelio
  • Patent number: 12754210
    Abstract: A probe head including a probe and an insulating support provided with a tapered hole to support a plurality of portions of the probe.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: October 6, 2026
    Assignee: YOKOWO CO., LTD.
    Inventors: Yusuke Shimizu, Katsuhiko Sato, Takayoshi Okuno
  • Patent number: 12748234
    Abstract: A sensor device is configured to be disposed on a surface of a side of an object. The sensor device includes a casing, and the casing has a first side that is distant from the object and a second side that is relatively closer to the object. A first induction coil set is disposed on the first side, and a second induction coil set is disposed on the second side. The sensor device further includes a control circuit board. The control circuit board includes a connection line that is electrically connected with the first induction coil set and the second induction coil set, and a microcontroller. When the sensor device is in operation, the microcontroller determines a position change of a metal item on another side of the object according to a physical quantity difference between the first induction coil set and the second induction coil set.
    Type: Grant
    Filed: January 30, 2024
    Date of Patent: September 29, 2026
    Assignee: Getac Technology Corporation
    Inventor: Cheng-Shih Peng
  • Patent number: 12748131
    Abstract: A test apparatus includes a probe assembly, which includes: a multilayer structure including probe contact pads; an upper guide plate including an array of upper holes therethrough; a lower guide plate including an array of lower holes therethrough; a dielectric spacer plate located between the upper guide plate and the lower guide plate and including an opening; and an array of probes attached to the probe contact pads, vertically extending through the upper guide plate, the lower guide plate, and the dielectric spacer plate. The lower guide plate includes a downward-protruding portion having a first laterally-extending segment having a first width, and further includes a base portion overlying the downward-protruding portion and having a wider second width. The downward-protruding portion can be used to protect the array of probes while probing test pads on a wafer that are exposed between neighboring semiconductor dies.
    Type: Grant
    Filed: July 14, 2023
    Date of Patent: September 29, 2026
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventor: Ming-Cheng Hsu
  • Patent number: 12733856
    Abstract: An optically pumped magnetometer includes a cell, a pump light incidence unit causing pump light to be incident on a plurality of sensitivity regions inside the cell in a first direction, a probe light incidence unit causing probe light to be incident on the sensitivity regions in a direction intersecting the first direction, bias magnetic field coils applying a bias magnetic field to the inside of the cell and determining a resonance frequency of the electron spins, an electron spin tilting unit tilting a rotation axis direction of the electron spins in a direction perpendicular to the first direction, an optical sensor detecting the probe light; and a magnetic field measuring unit measuring magnetic field strengths related to the sensitivity regions, wherein the bias magnetic field coils respectively apply a plurality of the bias magnetic fields having strengths different from each other to the plurality of corresponding sensitivity regions.
    Type: Grant
    Filed: July 8, 2024
    Date of Patent: September 15, 2026
    Assignees: HAMAMATSU PHOTONICS K.K., Kyoto University
    Inventors: Akinori Saito, Takenori Oida, Takahiro Moriya, Motohiro Suyama, Yosuke Ito, Hiroyuki Ueda
  • Patent number: 12724090
    Abstract: A power generation sensor includes a magnetic wire configured to exhibit a large Barkhausen effect, a coil wound around the magnetic wire, and a pair of magnetic flux conducting pieces that include a pair of magnetically-soft components respectively magnetically coupled to the opposite end portions of the magnetic wire. The pair of magnetic flux conducting pieces include a pair of axis-orthogonal portions respectively fixed to the opposite end portions of the magnetic wire and respectively extending parallel to each other orthogonally to the axial direction from the opposite end portions of the magnetic wire, and a pair of axis-parallel portions extending toward each other in the axial direction from the distal ends of the axis-orthogonal portions with their adjacent ends opposed to each other and spaced a gap from each other in the axial direction.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 1, 2026
    Assignees: ORIENTAL MOTOR CO., LTD.
    Inventors: Akihiko Houda, Masayuki Someya, Sakao Ozeki
  • Patent number: 12724039
    Abstract: A testing equipment includes a tester, a load board and an adapter. The load board is disposed on the tester. The adapter is disposed on the load board and configured to support a device under test. The adapter is electrically connected to the load board and the device under test. The tester is configured to transmit a testing signal to the device under test and receive a feedback signal from the device under test through the load board and the adapter.
    Type: Grant
    Filed: January 26, 2024
    Date of Patent: September 1, 2026
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Yuan Chen
  • Patent number: 12724042
    Abstract: A positioning method and probe system for performing the same, a method for operating probe system, and a method for utilizing probe system to produce a tested semiconductor device are provided. The positioning method is used for positioning a plurality of probe assemblies with an under-test device including a plurality of pads, each of the probe assemblies have at least one probe tip that corresponds to each of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies during a positioning process.
    Type: Grant
    Filed: January 3, 2024
    Date of Patent: September 1, 2026
    Assignee: MPI CORPORATION
    Inventors: Stojan Kanev, Chien-Hung Chen, Ming-Yang Liu, Yu-Hsun Hsu, Yan-Cheng Chen, Lin-Lin Chih
  • Patent number: 12724052
    Abstract: A Rydberg sensor may include an array of Rydberg quantum radio frequency (QRF) cavities arranged in rows and columns. A probe laser source may be configured to generate a time delayed probe beams for respective ones of the rows of Rydberg QRF cavities. An RF signal source may be configured to generate time delayed RF signals for respective ones of the columns of Rydberg QRF cavities.
    Type: Grant
    Filed: September 12, 2024
    Date of Patent: September 1, 2026
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Victor G. Bucklew, James A. Drakes
  • Patent number: 12710404
    Abstract: A detector for use with a gas chromatography device includes a column input for receiving a sample, a gas inlet for introducing a carrier gas, and a gas mixing area for mixing the sample with the carrier gas. A measurement chamber is in fluid communication with the gas mixing area and includes a gas inlet line and a gas outlet line. A scintillator crystal is positioned to interact with the mixed gases and to emit photons to generate an optical signal. A photodetector receives the optical signal and generates a corresponding electrical signal. The scintillator crystal may have an uncoated or conductive-coated outer surface. A fixing apparatus supports the scintillator crystal and/or photodetector and transmits the electrical signal to a data output line.
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: August 18, 2026
    Assignee: FOX ROBOTICS LABORATUVAR TEKNOLOJI HIZMETLERI SANAYI LIMITED SIRKETI
    Inventors: Bora Kökova, Muhammed Tevfik Kaplanoǧlu
  • Patent number: 12704542
    Abstract: Methods and systems of testing microelectromechanical (MEMS) devices are disclosed. A method includes mechanically coupling a wafer including MEMS devices to a test system and electrically coupling one of the MEMS devices through a probe card to a pulse measure unit (PMU) of the test system. The method includes driving, through the PMU, drive nodes of the MEMS device with an applied time-varying electrical signal to cause a resonance condition of the MEMS device, and sensing, through the PMU, an electrical signal generated across sense nodes of the MEMS device responsive to the resonance condition. A resonance frequency and quality factor of the MEMS device are determined based on the sensed electrical signals across the sense nodes of the MEMS device, and whether the MEMS device passes a quality factor test is made based on the calculated quality factor.
    Type: Grant
    Filed: November 16, 2023
    Date of Patent: August 11, 2026
    Assignee: Kethley Instruments, LLC
    Inventors: Jin Kwang Yu, Alexander N. Pronin
  • Patent number: 12704526
    Abstract: The present disclosure relates to a rubber socket formed by assembling a plurality of individually manufactured electrically-conductive blocks, the blocks having a plurality of elastic electrically-conductive parts and an insulating part, respectively, are individually manufactured, a lower protruding portion, having a thickness smaller than that of the support member, of each electrically-conductive part is inserted into the through hole of the support member, the electrically-conductive block is coupled to the support member by adhering a lower surface of the insulating part to an upper surface of the support member to enable a large-area rubber socket to be manufactured.
    Type: Grant
    Filed: February 23, 2024
    Date of Patent: August 11, 2026
    Inventors: Jong Cheon Shin, Dong Ho Ha
  • Patent number: 12704540
    Abstract: A method for measuring the state of health, of at least one semiconductor-based power electronics, comprising: a—determining, at an initial time t0, a first current value I(t0)=I,ZCP0 when the voltage V is equal to a voltage V(t0)=V,ZCP0, the power electronics component then being in an “initial time” state; b—measuring a value of the current I at each subsequent time ti for which the user wishes to ascertain the quantitative indicator D(ti), when the voltage V at the time ti is equal to the voltage V,ZCP0, the power electronics component then being in a “time ti” state; c—the processor computing a quantitative indicator D(ti) of the degradation of the power electronics component at each subsequent time ti, the value of which indicator depends on the variation in the value of the current I between the “initial time” state and the “time ti” state.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: August 11, 2026
    Assignee: UNIVERSITE GUSTAVE EIFFEL
    Inventors: Zoubir Khatir, Richard Lallemand, Ali Ibrahim
  • Patent number: 12693143
    Abstract: A system for monitoring flow of fluid through a pipeline is disclosed. The system includes a ferromagnetic strip mounted on an outer surface of the pipeline. A solenoid coil is wound around the ferromagnetic strip and is connectable to a power source. A plurality of magnets is positioned over the solenoid coil, wherein each of the plurality of magnets are positioned at a pre-defined orientation with respect to longitudinal axis of the pipeline. A processing unit is communicatively coupled to the solenoid coil. The processing unit generates a plurality of wave modes in the pipeline by supplying power to the solenoid coil in concurrence with the plurality of magnets and the ferromagnetic strip. The processing unit is configured to receive a plurality of wave signals reflected and are then compared with pre-defined wave signals by the processing unit to monitor flow of fluid through the pipeline.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: July 28, 2026
    Assignee: INDIAN INSTITUTE OF TECHNOLOGY MADRAS (IIT MADRAS)
    Inventors: Krishnan Balasubramanian, Nishanth R.