Patents Examined by Robert A. Dawson
  • Patent number: 6706409
    Abstract: An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: March 16, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Nozomu Takano, Tomio Fukuda, Masato Miyatake
  • Patent number: 6706403
    Abstract: A process, system, and materials for lamination of anti-reflective glass to the screen of a CRT display, including a polymerizable adhesive and laminated articles are described. The photopolymerizable adhesive composition including, in certain embodiments, an epoxy resin and a photosensitive initiating system are disclosed.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: March 16, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Peter M. Olofson, Kent W. Morris, Michael C. Palazzotto
  • Patent number: 6706417
    Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: March 16, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Mark M. Konarski, Jeremy J. Bober
  • Patent number: 6706392
    Abstract: A solvent-free adhesive tape with a film based on polyolefins and an adhesive layer which is applied at between 10 and 45 g/m2 and is prepared with a mixture comprising an adhesive acrylic dispersion acquires improved adhesive properties and increased water insensitivity by virtue of the fact that the mixture comprises a second, special acrylic dispersion, the quantitative ratio between the first acrylic dispersion and the second acrylic dispersion being between 99:1 and 90:10 and the second acrylic dispersion comprising the following components: 65-84% by weight of ethyl acrylate units 15-34% by weight of methyl methacrylate units 0.5-2% by weight of acrylic acid units 0.1-1% by weight of propyleneimine units.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: March 16, 2004
    Assignee: tesa AG
    Inventors: Wolfgang David, Stefan Röber
  • Patent number: 6706408
    Abstract: An inorganic substrate with two or more coating layers is provided. The first coating layer is attached to the inorganic substrate and includes the polymeric reaction product formed upon hydrolysis of a silane compound having at least two tri(C1-C3)alkoxysilyl groups. The second and subsequent coating layers include at least one hydrophilic polymer and at least one photoactivatable cross-linking agent. The inorganic substrate can be a medical device suitable for insertion into the body of a mammal. The coatings are tenacious and not easily removed from the inorganic substrate by abrasion.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: March 16, 2004
    Assignee: SurModics, Inc.
    Inventor: Bruce M. Jelle
  • Patent number: 6706799
    Abstract: A conductive silicone rubber composition is provided, which includes (a) 100 parts by weight of an organopolysiloxane represented by an average composition formula of RaSiO(4−a)/2 wherein R is an unsubstituted or substituted monovalent hydrocarbon group which may be the same or different, and a is a positive number of 1.90 to 2.05, (b) 50 to 500 parts by weight of conductive particles comprising carbon coated with Ni, and (c) 0.1 to 10 parts by weight of an organic peroxide. This composition has an adequate pot life, is unlikely to be affected by catalyst poisoning, and is suitable for normal pressure hot air vulcanization. Cured products produced from the composition has a low volume resistivity and excellent electromagnetic interference sealing properties.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: March 16, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Minoru Igarashi, Yoshiaki Koike, Atsushi Yaginuma, Tsutomu Nakamura
  • Patent number: 6706404
    Abstract: Radiation curable coating compositions that are solventless homogeneous blends of a 1,2-polybutadiene oligomer, an acrylated bis-phenol-A derivative, and reactive compatible compounds are disclosed. Such solventless coatings can be used in a variety of applications, including the high speed coating of metal coil.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: March 16, 2004
    Assignee: Strathmore Products, Inc.
    Inventors: Anthony J. Berejka, Anthony Pappano, Laurence S. Larsen, Daniel E. Montoney
  • Patent number: 6706390
    Abstract: In a process for the production of polysiloxane pressure-sensitive adhesive layers with reduced cold flow by means of coating and drying a one-component polysiloxane pressure-sensitive adhesive solution onto a suitable flat-shaped carrier, a complex of a metal ion of the group consisting of calcium, magnesium, zinc, aluminum, titanium, zirconium or hafnium with a low-molecular organic complex former is added to the organic adhesive solution to be coated, whereby the metal ion is only released from the bond to the complex former under the conditions of heating and/or drying of the adhesive solution.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: March 16, 2004
    Assignee: LTS Lohmann Therapie-Systeme AG
    Inventors: Christoph Schmitz, Stefan Bracht
  • Patent number: 6703442
    Abstract: The invention provides a curing agent for two-pack type curable composition use having excellent storage stability, and also provides a curing agent composition which comprises a hydrolyzable silyl group-containing compound (a), a non-phthalic acid ester based plasticizer (b) having no phthalic acid ester structure in its molecule, and a bivalent tin based curing catalyst (c), that satisfies all of mechanical properties, recoverability and adhesiveness to substrate, can be mixed easily when used and has excellent storage stability, and a two-pack type curable composition which hardens when a base resin composition comprising a curable organic polymer (d) having in its molecule a functional group crosslinkable by a reaction catalyzed by a bivalent tin based curing catalyst (c), an epoxy group-containing silane compound (f) and an epoxy compound (g) is mixed with the above curing agent composition.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: March 9, 2004
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ando, Yoshiteru Masaoka, Atsushi Fukunaga, Fumio Kawakubo
  • Patent number: 6703121
    Abstract: Provided is an adhesive sheet for a precision electronic member which generates less amount of gas under high temperature atmosphere and which is suited as a low polluting adhesive sheet for a precision electronic member. The adhesive sheet for a precision electronic member has an adhesive layer comprising an acrylic copolymer obtained by copolymerizing a monomer mixture which comprises alkyl (meth)acrylate having 4 or less carbon atoms in an alkyl group and vinyl acetate in a proportion of 50:50 to 99.5:0.5 in terms of a weight ratio and in which a total content thereof is 80% by weight or more, wherein an amount of gas generated in heating at a temperature of 120° C. for 10 minutes is 1.0 &mgr;g/cm2 or less in terms of a n-decane amount.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: March 9, 2004
    Assignee: Lintec Corporation
    Inventors: Hiroaki Iwabuchi, Kiyoshi Ishiba, Tatsuya Tsukida
  • Patent number: 6703120
    Abstract: The present invention provides silicone-based adhesives, preferably pressure sensitive adhesives, adhesive articles, and methods. Preferably, the articles are cover tapes for analytical receptacles, such as microtiter plates, microfluidic devices, and continuous multi-reservoir carriers, or other analytical receptacles or biosensors, for example. Typically, such analytical receptacles are used in bioanalytical applications and are designed for containing solids and fluids, including liquids, gases, powders, and gels, which may include biological samples or organic solvents, for example.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: March 9, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: John H. Ko, Kurt C. Melancon, Anita L. Schulz
  • Patent number: 6703128
    Abstract: An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: March 9, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: Bruce A. Myers, Arun K. Chaudhuri, Jeffrey H. Burns
  • Patent number: 6699522
    Abstract: An inorganic coating material maintains the properties of high heat resistance and high electrical insulating characteristics of inorganic materials, while enhancing the degree of adhesion with respect to an object to be coated. A water-based suspension with a specific gravity in the range of 1.5 to 2.5 is obtained by using as major raw materials at least two types of metal oxide particles having heat-resistant characteristics at temperatures above 1000° C., distributing diameters of these particles in the range of 0.1 &mgr;m to 30 &mgr;m, adjusting the average value of their particle diameters to 0.2 &mgr;m to 0.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: March 2, 2004
    Inventor: Takeshi Sakakibara
  • Patent number: 6699586
    Abstract: Organosilicon nano/microhybrid systems or microhybrid systems having nanoscale and/or microscale oxide particles (KA—O), and an organosilicon shell with at least one organosilicon constituent of the general formula Ia wherein the organosilicon constituent of the shell B is attached to the oxide particles via one or more covalent linkages of formula Ib A process for preparing a composition comprising organosilicon nano/microhybrid systems or microhybrid systems directly in a synthetic resin composition allows in situ preparation of a curable resin. The compositions may be used as coating materials for producing scratch resistant and abrasion resistant coatings.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: March 2, 2004
    Assignee: Degussa AG
    Inventors: Roland Edelmann, Jaroslaw Monkiewicz, Reiner Mehnert, Hans-Jürgen Gläsel, Helmut Langguth
  • Patent number: 6699351
    Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: March 2, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Hiroaki Yamaguchi, Yuji Hiroshige, Michiru Hata, Tetsu Kitamura
  • Patent number: 6696511
    Abstract: A non-stick polymer coated aluminum foil and method of making it. The polymer coating composition comprises a silicone resin, a silicone release agent, a silicone curing agent, a hindered phenol antioxidant and a solvent. The method of making the non-stick polymer coated aluminum foil includes applying the polymer coating composition on at least a portion of one side of the aluminum foil and partially curing the coating composition to allow handling and future processing of the coated aluminum foil without blocking of the coating composition. The curing of the coating composition is completed by heating the coated aluminum foil in bulk.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: February 24, 2004
    Assignee: Reynolds Metals Company
    Inventor: Bruce Robbins
  • Patent number: 6696161
    Abstract: A silicone composition comprising a first organopolysiloxane containing T units, a second organopolysiloxane, an organohydrogenpolysiloxane, and a platinum catalyst cures into a coating that adheres well to plastic film substrates and even to polyester film substrates which are difficult for conventional solventless silicone compositions to adhere. The cured coating exhibits release properties to pressure-sensitive adhesives, and a film substrate coated with the cured silicone composition provides a release film.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: February 24, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinji Irifune, Masahiko Ogawa
  • Patent number: 6696538
    Abstract: The present invention relates to low a dielectric material essential for a next generation semiconductor with high density and high performance, and more particularly to a low dielectric material that is thermally stable and has good film-forming properties and excellent mechanical properties, a dielectric film comprising the low dielectric material, and a semiconductor device manufactured using the dielectric film. The present invention provides an organic silicate polymer having a flexible organic bridge unit in the network prepared by the resin composition of the component (a) and the component (b).
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: February 24, 2004
    Assignee: LG Chemical Ltd.
    Inventors: Min-Jin Ko, Hye-Yeong Nam, Jung-Won Kang, Myung-Sun Moon, Dong-Seok Shin
  • Patent number: 6696540
    Abstract: An episulfide compound useful as a starting material for optical materials that have a high refractive index and a high Abbe's number is provided. A method for producing the same and an optical product made with the same are also provided. The episulfide compound may be represented by the general formula (1): wherein EP represents and n is an integer of from 0 to 2. A method for producing the episulfide compound represented by the general formula (1) may involve reacting a mercapto group-containing episulfide compound with 2,4,6-trimethylene-1,3,5-trithiane.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: February 24, 2004
    Assignee: Hoya Corporation
    Inventors: Tsuyoshi Okubo, Ken Takamatsu
  • Patent number: 6696104
    Abstract: A substrate carrying a mixed organic conductive polymer coating, has a high index of refraction. On a substrate having SiO2 as a major component, the coating comprises two layers each having SiO2 as a major component. One of the layers comprises a conducting polymer, the other a material having a high index of refraction.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: February 24, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Henricus X. Willems, Bauke H. Zwerver, Gerardus V. A. Aben, Johannes M. A. A. Compen