Abstract: A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.

Abstract: A skate blade retention mechanism for retaining a skate blade in a sharpening position to be sharpened includes a pair of elongated jaws configured for symmetrical jaw opening and closing movements about a centerline of the skate blade in the sharpening position. A biasing mechanism is configured and operative to apply a bias force to symmetrically bias the jaws toward a closed position with sufficiently high force to retain the skate blade in the sharpening position when the skate blade is located between the jaws as so biased. An actuator is configured to actuate the jaws against the bias force to an open position under user control to permit insertion and removal of the skate blade.

Abstract: A method for beveling a thin glass plate by simultaneously grinding an edge of the glass using multiple abrasive cup wheels, wherein the edge of the glass plate is extended from the fixturing device. The extension of the glass plate allows the glass plate to bend in response to forces applied by the abrasive cup wheels, thereby reducing the sensitivity of the grinding process to variations in position of the abrasive wheels. The axes of rotation of the abrasive wheels are separated by a distance selected to prevent deflection in the glass plate caused by a first abrasive wheel to influence the deflection in the glass plate caused by a second (adjacent) abrasive wheel.

Abstract: A substrate holding apparatus and a polishing apparatus which can reduce vibrations of a top ring in its entirety by damping vibrations transmitted from a retaining ring to a top ring body is disclosed. The substrate holding apparatus includes a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface, a retaining ring configured to surround the substrate and to contact the polishing surface, and a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect the ring member and the central member. The drive ring includes a first material and a second material having a modulus of longitudinal elasticity smaller than the first material.

Abstract: A protective hood device with at least one protective hood basic body is configured to at least partially cover an insertable tool of a portable power tool. The protective hood device has at least one functional recess, and at least one covering unit which is mounted on the at least one protective hood basic body so as to be movable relative to the at least one protective hood basic body. The at least one covering unit is configured to cover the at least one functional recess of the at least one protective hood basic body in at least one first position. The at least one protective hood device further includes a locking unit which is configured to lock the at least one covering unit in the at least one first position relative to the at least one protective hood basic body.

Abstract: According to an embodiment, a polishing device includes a stage, a polishing unit, and a strain measuring unit. The stage is rotatable together with a semiconductor wafer. The polishing unit polishes the rear surface of the semiconductor wafer mounted on the stage beside the stage. The strain measuring unit measures a first strain that is a radial-direction strain of the semiconductor wafer and a second strain that is a circumferential-direction strain of the semiconductor wafer during the polishing.

Abstract: A method of grind hardening a workpiece is provided. The method may include securing the workpiece in a workpiece retainer and a grind tool in a tool retainer, rotating the grind tool in a first angular direction at a first angular speed, controlling the workpiece and tool retainers such that the grind tool engages the workpiece, and controlling the workpiece and tool retainers such that the grind tool is guided along a grinding track of the workpiece. The grind tool may engage and/or disengage the workpiece at portions of sacrificial material disposed thereon. Coolant and cleaning nozzles may be provided and controlled such that at least a portion of the coolant from the coolant nozzle is diverted to the cleaning nozzle in a manner which reduces heat dissipation, improves thermal efficiency of the grind hardening and reduces loading of the grind tool.

Abstract: A material-removing machine for removing material from a cone section of a medical balloon includes a material-removing element operatively connected to a prime mover such that operation of the prime mover imparts rotation to the material-removing element about a rotational axis. The material-removing element includes an interior surface defining a generally conical-shaped cavity extending along the rotational axis and adapted to receive at least a longitudinal portion of a cone section of an expanded medical balloon for removing material from the longitudinal portion of the cone section to reduce a wall thickness of the cone section. Material may be removed continuously around a 360-degree exterior perimeter of the longitudinal portion of the cone section of the medical balloon to reduce the thickness of the balloon wall defining the cone section.

Abstract: The abrasive grinding wheel includes an annular abrasive grain layer formed by a diamond abrasive grain or CBN abrasive grain and fixed to an outer peripheral surface of a cylindrical grinding wheel core by an adhesive agent. The abrasive grinding wheel further includes a waterproof agent applied on both side end surfaces and an inner peripheral surface of the cylindrical grinding wheel core in order to prevent any water ingress into the inside of the core.

Abstract: A mechanical method for producing micro-scale and nano-scale textures that facilitates, for example, the cost-effective production of nanostructures on large-scale substrates, e.g., during the large-scale production of thin-film solar cells. A “scratcher” (multi-pointed abrasion mechanism) is maintained in a precise position relative to a target substrate such that micron-level features (protrusions) extending from the scratcher's base structure are precisely positioned to contact a surface material layer of the target substrate with a predetermined amount of force, and then moved relative to the substrate (e.g., by way of a conveying mechanism) while maintaining the pressing force such that the micron-level features define elongated parallel nano-scale grooves and/or form nano-scale ridges in the surface material layer (i.e., by mechanically displacing) portions of the surface material layer to form the nano-scale grooves/ridges).

Abstract: A circular saw blade indexing assembly includes a frame and a circular saw blade mounting assembly coupled to the frame. The circular saw blade mounting assembly includes a shaft configured to support a circular saw blade and that extends along a longitudinal axis defined by the circular saw blade mounting assembly. The circular saw blade indexing assembly includes an indexing mechanism rotatably coupled to the circular saw blade mounting assembly and having a feed finger disposed at a radial distance from the longitudinal axis. The indexing mechanism is configured to rotate about the longitudinal axis between a first arc position and a second arc position to rotate a saw blade between the first arc position and the second arc position.

Abstract: A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming.

Abstract: The invention concerns a method of grinding a toothed workpiece in which a central axis of the toothed contour profile is defined, wherein the method encompasses at least two work operations. In a first work operation a grinding zone of a grinding tool whose selection is determined by the grinding process to be performed, which rotates about an axis of rotation and is set up for an infeed in the direction of the shortest distance between said central axis and the rotation axis, is brought into grinding engagement with a tooth flank of the workpiece. In a later, second work operation, the tooth flank is brought into grinding engagement with a grinding zone of a grinding tool whose selection is determined by the grinding process to be performed and which is advanced in the infeed direction of the first operation.

Abstract: To provide a apparatus for processing an object by projecting shots thereon that can be downsized and can use shots of appropriate sizes. A pressure tank 42 is disposed below a position 24X where an object to be processed 12 is projected. The shots that have been projected are received by the tank 42. The discharging portion of the tank 42 is communicated with a device for projecting shots. One end of a piping for transporting air for a discharge 54 that can suction shots is connected to a position between the position 24X and the tank 42. The other end of the piping 54 is connected to a separator 68. The separator 68 is connected to one end of the piping for transporting air for a supply 76 that can suction shots. The other end of the piping 76 is communicated with the room for projecting the shots 16.

Abstract: An improved sanding block formed in a manner so as to have a beveled side to remove sanded debris or particles from the area that was just sanded, further comprising an inserted slit to remove knicks from drywall knives integrated into the side opposite from the beveled side, further comprising a strap for ease of use, transportation and preventing the sanding block from being dropped or misplaced.

Abstract: Provided is a resin-coated saw wire that, when used to cut a workpiece, has a shallow depth of a damaged layer and can give a cut article having a smooth surface. The resin-coated saw wire is used in cutting of the workpiece using a sawing machine and includes a steel wire and a resin coating covering the steel wire surface. The resin coating contains substantially no abrasive grain, has a hardness at 120° C. of 0.07 GPa or more, and has a hardness controlled so as to prevent abrasive grains from coming into the resin coating, which abrasive grains are sprayed during workpiece cutting.

Abstract: Provided is a belt-type grinding tool allowing an endless grinding belt replacement operation to be performed without requiring a large force. A belt-type grinding tool has an endless grinding belt wound around a drive pulley provided in a tool body and an idler pulley rotatably supported by a pulley support bar. The grinding tool has a spring urging the pulley support bar forward relative to the tool body, thereby causing the idler pulley to press the endless grinding belt forward to apply a tension to the endless grinding belt, and a spring support member movably attached to the tool body to support and compress the spring, the spring support member being movable between a first position where the idler pulley applies a tension to the endless grinding belt and a second position where the spring support member is displaced from the first position to reduce the amount of compression of the spring to reduce the tension.

Abstract: A cutting platform for supporting a cutter adjacent a concrete pad and a method of making clean cuts into the pad is disclosed. The platform includes a base having an upper surface positioned so that it is level with an upper surface of the pad. The cutter is received on the base's upper surface and is rollable onto the pad's upper surface. One or more support legs extend downwardly from a lower surface of the base and are adjustable in length. At least one arm extends outwardly from the base and rests on the pad's upper surface. A replaceable insert is received in a recess in the first end of the base adjacent the pad. The cutter's blade is actuated and cuts initially into the insert. As the cutter rolls from the base onto the pad, a clean cut is made into the side and upper surface of the pad.

Abstract: A surfacing apparatus supported adjacent a substantially vertical surface of a structure for applying an even and uniform texture to the surface of the structure using a selectively adjustable force exerted on a texturing means to engage the surface of the structure. The surfacing apparatus is suited for horizontal and vertical movement in controlled prescribed paths under controlled and prescribed pressure from the adjustable tensioning means.

Abstract: A containment system the operator to contain, see, blast, and reclaim the grit or abrasives used to strip external surfaces of a pipe, rod, or substantially cylindrical object. The containment chamber or housing is constructed of sections that can be quickly assembled to encapsulate such objects. The grit reclamation or recovery system of the invention is operable to be used in connection with objects that are positioned in a vertical, horizontal, or angled orientation. The containment housing is assembled from sections to encapsulate pipe to contain the dust and grit while blasting. The containment housing has inflatable seals that seal and grip around the pipe. Nozzle control and access as well as vision access are provided to allow the operator to control where the pipe will be blasted and the intensity of the blast. The containment system has a centrifugal grit reclamation design that will work in vertical, horizontal and angular orientation.