Abstract: An improved destructive and visual measurement automation system and a method for measuring a web thickness of a microdrill are provided. When a dual-axis motion platform module moves the microdrill to a first position, a reflection module reflects a first image in a first direction toward a second direction. A vision module receives the reflected first image in the second direction and outputs the received first image to a computer. According to the first image, the computer performs a positioning procedure and a grinding procedure to drive a drill grinding module to grind the microdrill to a sectional position to be measured of the microdrill. When the microdrill is moved to a second position, the vision module outputs a second image to the computer. According to the second image, the computer performs an image computing procedure to obtain the web thickness at the sectional position to be measured.

Abstract: A method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafer uses a double-side polishing device. The device has an annular lower polishing plate and an annular upper polishing plate, each covered with a polishing pad, as well as a rolling device for carrier disks. The method for conditioning polishing pads includes disposing at least one conditioning tool having external teeth and at least one spacer having external teeth in a working gap formed between the first and second polishing pad, where the thickness of at least one of the conditioning tools differs from the thickness of at least one of the spacers. At least one conditioning tool and one spacer are set, simultaneously, in a revolving movement about the axis of the rolling device and in rotation themselves so as to generate material abrasion of at least one of the polishing pads.

Abstract: [Problem] A mortar peeling method which can keep a sound generated during a peeling work to an allowable quiet sound and can peel a mortar off a concrete framework smoothly. [Solution] In a mortar peeling method, by gradually extending a piston rod 42 of a hydraulic jack 13 in a mortar peeling device 10A forward in one direction, a cutter 14 is gradually advanced forward in one direction so as to execute a mortar peeling process of peeling a mortar 21 with a predetermined thickness off a concrete framework 20 by using the cutter 14. In the mortar peeling method, after the piston rod 42 of the hydraulic jack 13 is extended forward in one direction and the mortar 21 is peeled, by retreating the piston rod 42 rearward in one direction, a session of the mortar peeling process is completed.

Abstract: A system for dressing centrifugal clutches has a drum tool with an internal abrasive surface, and a flap tool with abrasive flaps. The drum tool can replace the clutch drum on the clutch driven shaft to dress the clutch shoes, or the flap tool can replace the clutch shoes and mechanism on the clutch drive shaft, which may be the engine crankshaft, to dress the clutch drum. In either case, the tool being used and the component being dressed can accurately simulate the engagement of the clutch shoes and clutch drum in operation, so that the clutch drum and shoes can be accurately dressed to the correct shape, matching each other, for use.

Abstract: A grinding wheel machining device includes a movable platform and a grinding wheel machining mechanism. The grinding wheel machining mechanism includes a mounting assembly, a tool holder mounted on the movable member, a machining tool mounted on the tool holder, and an adjusting assembly. The mounting assembly includes a fixing base mounted on the movable platform, a movable member mounted onto the fixing base, and a rotation shaft received into the fixing base and the movable member. The machining tool includes a cutting edge. The adjusting assembly includes a reference member and an adjusting member. The reference member is fixed on the movable member and includes a reference surface. The reference surface is coplanar with a central axis of the rotation shaft. The adjusting member is received into the tool holder and threaded into the reference surface.

Abstract: A method for controlling the residue clearing process of a chemical mechanical polishing (“CMP”) process is provided. Dynamic in-situ profile control (“ISPC”) is used to control polishing before residue clearing starts, and then a new polishing recipe is dynamically calculated for the clearing process. Several different methods are disclosed for calculating the clearing recipe. First, in certain implementations when feedback at T0 or T1 methods are used, a post polishing profile and feedback offsets are generated in ISPC software. Based on the polishing profile and feedback generated from ISPC before the start of the clearing process, a flat post profile after clearing is targeted. The estimated time for the clearing step may be based on the previously processed wafers (for example, a moving average of the previous endpoint times). The calculated pressures may be scaled to a lower (or higher) baseline pressure for a more uniform clearing.

Abstract: An extension frame for a pneumatically actuated buffer, further comprised of an elongated hollow post member; a receptacle removably connected at a distal end of the post member and adapted to releasably hold the buffer thereon; a rod member adapted to be slidably inserted within the post member and having a length that is longer than the post member; a palm handle assembly including an upper part removably connected to a proximal end of the post member, and a bottom part removably connected to a proximal end of the rod member. The palm handle assembly is adapted to push the rod member in a direction toward the receptacle. A biasing member is placed between the bottom part of the palm handle assembly and the receptacle and configured to bias the rod member in a direction away from the receptacle.

Abstract: Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.

Abstract: A grindstone is provided with a base (211) and a plurality of abrasive grains (210) aligned in a row and bonded on a surface (212) of the base (211). Each of the abrasive grains (210) has a relief surface (216) with a relief angle of a predetermined angle (?).

Abstract: The present invention relates to a method of manufacturing a ceramic cutting insert, based on an oxide ceramic or a nitride ceramic or a mixed ceramic material, possibly containing whiskers, in a process comprising the powder metallurgical steps of providing a ready-to-press ceramic powder, pressing the ready-to-press powder into a compact of desired shape, sintering the compact to dense a ceramic blank followed by tumbling the ceramic blank, to remove sinter skin and provide an edge rounding.

Abstract: The present invention discloses a method for producing a golf club head with an ultra-thin crown, relating to a method for processing a golf club head. A grinding rotor, with an abrasive (2) on the surface, is placed in a to-be-grinded area inside a cavity of the golf club head (1). The outside of the golf club head (1) is provided with a rotary working shaft (6) of high-speed rotation, one end of which corresponding to the grinding rotor is provided with driving magnets (4). The driving magnets of the rotary working shaft (6) are driven by a driving device to make the grinding rotor rotate synchronously so that the grinding rotor that is rotating performs multi-point thinning and grinding to the cavity within the to-be-grinded area of the golf club head (1). The present invention, with advantages of uniform thinning of a golf club head and automation control, is applicable to mass industrial production.

Abstract: In a machining method of supporting a workpiece having a cylindrical machined portion such that the workpiece is rotatable and feeding a grinding wheel in a radial direction, a start diameter that is a diameter including a measurement start point on a surface of the machined portion is measured, and, after the measurement start point passes through a machining application portion, an end diameter that is a diameter including a measurement end point is measured. An actual grinding depth at the time when the measurement start point is machined is computed by the equation, U=|D0?D1|, a runout of the machined portion is computed from a relative difference in the actual grinding depth (U) between positions of the machined portion in a rotational direction, and infeed control of the grinding wheel is executed such that the runout is removed.

Abstract: A cutting method of a honeycomb formed body is provided. This is a cutting method of a honeycomb formed body in which, while a kneaded material containing a ceramic raw material is extruded to form a honeycomb formed body with a honeycomb shape having partition walls defining and forming a plurality of cells, the extruded honeycomb formed body is cut before drying by a cutting blade vibrated at a frequency of 0.3 kHz or more in a direction perpendicular to a direction in which this honeycomb formed body moves. It is preferably a cutting method of a honeycomb formed body in which the cutting blade is vibrated at a high frequency of 10 kHz or more.

Abstract: A hone insert is adapted for use in a rotating shaft system that has a segmented stave bearing housing. The stave bearing housing includes multiple stave bearing inserts that retain the rotating shaft. The hone insert is supported by a mounting bar section and a support pad that bears a hone layer against the face of the rotating shaft. Accordingly, as the shaft rotates against the hone layer, the surface of the shaft is made more smooth.

Abstract: In some embodiments, an apparatus comprises: a stage moveable on first and second axes; a material removal tool moveable on a third axis; a linear slide and a guide parallel to the third axis; a mount for an imaging device coupled to the linear slide using carriages; an armature coupled to the material removal tool and the guide that moves the guide along the third axis with the tool; a locking device for fixing the mount along the guide; and a processor that: (a) move a sample to a material removal position; (b) cause the tool to remove a first thickness of the sample along the third axis; (c) move the sample to an imaging position located at a predetermined location with respect to the mounting block; and repeating (a) through (c) until a second thickness of the sample has been removed.

Abstract: The present invention provides a sound level meter that may be removably coupled to a saw blade sharpening apparatus to aid in safe, reliable, reproducible and effective saw blade sharpening. The sound level meter is adapted to be removably attached to the saw blade sharpening apparatus and to provide accurate and reliable indication of interference between the saw blade and the saw blade sharpening stones. The sound level meter is capable of detecting interference even in the often noisy operating environment.

Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: Apparatus and method for sharpening a cutting tool having a cutting edge. In some embodiments, a manual sharpener includes a base housing adapted to be contactingly supported on a base surface, with the base housing having an overall length dimension in a first direction. A support member extends along the overall length dimension of the base housing and is adapted for rotation with respect to the base housing about a central axis extending along the first direction. An abrasive surface covers a top surface of the support member. The support member rotates the abrasive surface responsive to presentation of the cutting edge of the tool thereagainst as the cutting edge is moved along the abrasive surface in the first direction. A biasing mechanism coupled to the support member urges the support member to a neutral rotational position with respect to the base housing.

Abstract: An abrasive article including a substrate in the form of an elongated member having a core and a barrier layer in direct contact with an peripheral surface of the core. The barrier layer consists essentially of tin. A bonding layer is overlying the elongated substrate and abrasive particles are secured in the bonding layer.

Abstract: A method for polishing at least one semiconductor wafer while supplying a polishing agent includes performing a first simultaneous double-side polishing of the front side and the back side of the at least one semiconductor wafer with first upper and lower polishing pads, edge-notch polishing the surface of the at least one semiconductor wafer, performing a second simultaneous double-side polishing of the front side and the back side of the at least on semiconductor wafer with second upper and lower polishing pads, where the upper and lower polishing pads for the first simultaneous double-side polishing are harder and less compressible than the upper and lower polishing pads for the second simultaneous double-side polishing and performing single-side polishing of the front side of the at least one semiconductor wafer.