Patents Examined by Robert Dawson
  • Patent number: 7521519
    Abstract: The invention relates to novel crosslinkable copolymers of formula wherein the variables are as defined in the claims. The copolymers of the invention are especially useful for the manufacture of biomedical molding, for example ophthalmic moldings such as in particular contact lenses.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: April 21, 2009
    Assignee: Novartis AG
    Inventors: Thomas Hirt, Jacalyn Marie Schremmer, Troy Vernon Holland, Dieter Lohmann
  • Patent number: 7105598
    Abstract: The present invention discloses compositions as well as methods of making and using said compositions, having improved stability which, when applied to a variety of substrates and cured, form transparent coatings which have abrasion resistant properties, a matched refractive index to that of the substrate, and which can be tailored to control the extent of tint absorption (vide infra). The compositions comprise an aqueous-organic solvent mixture containing a mixture of hydrolysis products and partial condensates of an epoxy-functional silane, a carboxylic acid functional compound selected from the group consisting of carboxylic acids, multifunctional carboxylic acids, anhydrides, and combinations thereof, a metal oxide composite colloid, and a disilane. The coating compositions may further include a mixture of hydrolysis products and partial condensates of one or more silane additives, a colloidal silica material, and a tetrafunctional silane.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: September 12, 2006
    Assignee: SDC Technologies, Inc.
    Inventors: Karl W. Terry, Bryan S. Lembo
  • Patent number: 7041771
    Abstract: Encapsulated electrical component assemblies and methods of electrically connecting an electrical component having a plurality of component electrical terminations to a component carrying substrate having a plurality of substrate electrical terminations at surface mount reflow soldering conditions is described. The electrical and substrate components have an encapsulant-forming composition sandwiched therebetween and encasing said pluralities of component and substrate electrical connections. The described invention relates to using an encapsulant-forming composition comprising a thermosetting resin (preferably an epoxy resin) and a cross-linking agent (preferably an anhdride) for said resin that cross-links said resin and that also acts as a fluxing agent and optionally includes a catalyst for initiating cross-linking at required conditions. The gel point of the encapsulant-forming composition is reached after solder melt.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: May 9, 2006
    Assignee: KAC Holdings, Inc.
    Inventor: Kenneth John Kirsten
  • Patent number: 6916539
    Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: July 12, 2005
    Assignee: Fujitsu Limited
    Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
  • Patent number: 6869683
    Abstract: An electromagnetic wave (EM) absorber is constructed by integrally laminating an EM-absorbing layer having an EM-absorbing filler dispersed in a silicone resin on at least one surface of an EM-reflecting layer having an electrically conductive filler dispersed in a silicone resin. It has satisfactory EM-absorbing and shielding abilities and is workable, flexible, weather resistant and heat resistant due to the nature of the silicone resin itself. The use of the silicone resin in both the EM-absorbing and reflecting layers ensures that a firm bond is established between the layers. In a preferred embodiment wherein a heat conductive filler is blended, the absorber has a satisfactory heat transfer ability as well.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: March 22, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Ikuo Sakurai, Hironao Fujiki
  • Patent number: 6858309
    Abstract: The present invention provides improved methods for conducting living/controlled polymerization on polymeric solid supports. The improved methods allow polymerization to occur directly from the non-functionalized surface of a bulk support. In addition, polymerization may be re-initiated to provide co-polymers. The disclosed methods may employ the non-nitroxide-based RAFT and ATRP control agents that allow controlled polymerization to proceed at relatively low temperatures (<80° C.). Furthermore, these improved methods may provide graft polymers with decreased levels of “in-growth” of the bulk solid support. The invention also provides substrate polymers, with improved properties for solid phase synthesis and diagnostic applications, which may be made by the disclosed methods.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: February 22, 2005
    Assignee: Polymerat Pty. Ltd.
    Inventors: Peter Kambouris, Michael Whittaker, Tom Davis, Idriss Blakey, Gary M. Day
  • Patent number: 6858304
    Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: February 22, 2005
    Assignee: Honeywell International Inc.
    Inventors: Thomas F. McCarthy, David Schwind, Gordon Smith
  • Patent number: 6830815
    Abstract: The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts made from a low softening point materials with an anti-friction and anti-wear hard coating composition. The coating composition comprises a mixture of (i) solid lubricants comprising boron nitride, graphite and molybdenum disulfide, (ii) a thermoset resin system, (iii) catalyst for curing the resin system and (iv) a solvent system comprising highly volatile solvents. The coating composition is applied to the part and cured to form a coating on the part.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: December 14, 2004
    Assignee: Ford Motor Company
    Inventor: V. Durga Nageswar Rao
  • Patent number: 6828028
    Abstract: A medical material having a surface which is safe and excellent in stability with the lapse of time and has a high durability as needed in establishing a long-lasting surface lubricity in a wet state and an excellent compatibility with blood, and a method for producing the same. These materials are obtained by forming a coating layer with a coating material containing a polymeric substance (A) having a heterocyclic group represented by the formula (1) on at least a part of a surface of a medical material base, and then ring-opening the heterocyclic group remaining in the coating layer by a nucleophilic compound (N): wherein X represents O, NH or S; and R1 represents H or CH3.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: December 7, 2004
    Assignee: NOF Corporation
    Inventors: Hiroki Fukui, Ken Suzuki, Kenshiro Shuto, Nobuyuki Yamamoto, Kazuhiko Ishihara, Nobuo Nakabayashi
  • Patent number: 6824878
    Abstract: A thermoplastic film comprising a core layer comprising a polyolefin wherein the core layer comprises the interior of the film; a first transition layer comprising a polyolefin and a silicone additive, wherein the first transition layer is exterior to the core layer; and a first skin layer comprising a polyolefin wherein the first skin layer is exterior to the first transition layer and the core layer.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: November 30, 2004
    Assignee: ExxonMobil Oil Corporation
    Inventors: Robert A. Migliorini, Karen A. Sheppard
  • Patent number: 6777088
    Abstract: A multilayer packaging material comprising (a) at least one layer of a gas-permeable material, and (b) at least one layer of a gas-barrier coating comprising a polymeric polyol made by copolymerizing a multifunctional epoxide resin and water in the presence of an amount of acid effective for polymerizing the epoxide resin and the water, the amount of water being sufficient to avoid gelation, the polymeric polyol optionally reacted with a crosslinking agent for hydroxyl functionality, especially an amino resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Frank Ralph Pepe, John Bartram Dickenson
  • Patent number: 6777474
    Abstract: By reacting a sulfide chain-bearing organosilicon compound having the formula: (R1O)(3−p)(R2)pSi—R3Sm—R3—Si(OR1)(3−p)(R2)p wherein R1 and R2 each are a monovalent C1-4 hydrocarbon group, R3 is a divalent C1-10 hydrocarbon group, 2<m≦6, and p is 0, 1 or 2, an alkali or alkaline earth metal, a halogenoalkyl group-bearing organosilicon compound having the formula: (R1O)(3−p)(R2)pSi—R3—X wherein X is halogen, and optionally, sulfur, a sulfide chain-bearing organosilicon compound having the formula: (R1O)(3-p)(R2)pSi—R3—Sn—R3—Si(OR1)(3-p)(R2)p wherein 2≦n<6, and m>n, that is, having a shorter sulfide chain can be prepared in high yields and at a lost cost.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: August 17, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hideyoshi Yanagisawa
  • Patent number: 6762251
    Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: July 13, 2004
    Assignee: Tohto Kasei Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano, Hiroshi Sato
  • Patent number: 6753040
    Abstract: A curable composition comprising a) an epoxy resin having on average more than one epoxide group per molecule and b1) an alkyldipropylenetrimine of general formula (I) and/or b2) an adduct of an alkyldipropylenetrimine of general formula (I) with b3) an epoxide compound having on average at least one epoxide group per molecule in which R is hydrocarbon radical 8 to 22 carbon atoms, and the use of this composition for mineral and metallic substrates.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: June 22, 2004
    Assignee: Vantico GmbH & Co. KG
    Inventors: Wolfgang Scherzer, Jörg Volle
  • Patent number: 6750270
    Abstract: Nanoparticle-modified binders obtainable by reacting binders produced in the presence of nanoparticles provided with a reactive functionality, said binders having a reactive functionality complementary to the reactive functionality of the nanoparticles, with the nanoparticles, production thereof, coating compositions containing them and use thereof.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: June 15, 2004
    Assignee: E. I. du Ponte de Nemours and Company
    Inventors: Peter Klostermann, Volker Rekowski, Dietrich Saatweber
  • Patent number: 6749786
    Abstract: A continuous process provides a devolatilized liquid injection moldable silicone composition. In the process, a filler, treating agent and silicone polymer are introduced into an extruder having a length to diameter ratio of at least greater than 50. The filler, treating agent and silicone elastomer are continuously compounded in the extruder into a devolatilized liquid injection moldable silicone composition. A system for preparing a liquid silicone rubber composition comprises a mixer to prepare a concentrate of filler and silicone polymer, a long extruder having an L/D ratio of greater than 50, connected to the mixer to receive the concentrate from the mixer and to compound and devolatilize the concentrate, a treating agent and silicone polymer into a liquid silicone rubber composition containing volatiles and a cooler to receive the liquid silicone rubber composition to cool, homogenize and further devolatilized the composition.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: June 15, 2004
    Assignee: General Electric Company
    Inventors: Bruce Boudreau, Teresa Grocela-Rocha, Edward M. Jeram, August O. Liermann, Gerardo Rocha-Galicia, David A. Williams
  • Patent number: 6747071
    Abstract: The invention concerns dental compositions. Said composition comprises (1) a silicon crosslinkable and/or polymerizable by cation process; (2) an efficient amount of at least an initiator such as onium borate; (3) at least a photosensitizer; and (4) a dental filler present in the composition in a proportion of at least 10 wt. % relative to the composition total weight. Said dental compositions are useful for making dental prostheses or for dental restoration.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: June 8, 2004
    Assignee: Rhodia Chimie
    Inventor: Jean-Marc Frances
  • Patent number: 6747123
    Abstract: Template-based methods fabricate organosilicate materials with mesoscopic structures. The methods include providing solutions of amphiphilic template molecules, mixing amphiphilic organosilicate precursors into the solutions to form mixtures, and evaporating solvent from the mixtures. The evaporation steps produce composites in which the amphiphilic organosilicate precursors have nontrivial mesoscopic structures.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: June 8, 2004
    Assignee: Lucent Technologies Inc.
    Inventors: Cheng-Hsuan Chen, Shu Yang
  • Patent number: 6746771
    Abstract: Bodies made of expanded graphite are impregnated with low-viscosity, solvent-free, storage-stable, polymerizing resins from the group of isocyanates and their co-reactants and/or epoxy resins up to resin contents of 50% by weight. A primary product is made of expanded graphite with an open pore system, with a particularly preferred range of bulk densities of from 0.5 to 1.3 g/cm3 and with an ash value of not more than 4% by weight. Such bodies can also contain a proportion of additives. Sealing elements, components in fuel cells and heat-conducting elements are formed of the impregnated, shaped and rapidly curable graphite bodies. A process for producing such bodies is also provided.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: June 8, 2004
    Assignee: SGL Carbon AG
    Inventors: Oswin Öttinger, Jürgen Bacher, Werner Langer
  • Patent number: 6740417
    Abstract: The invention relates to a surface treated mineral material and a process for producing the same by means of laser treatment and water proofing. A preferred planned use of the invention relates to the surface and wall coverings, made of natural and artificial stones for indoor and outdoor areas, optimized, in particular with respect to wear resistance, stain resistance and slip resistance.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: May 25, 2004
    Inventors: Thomas Sievers, Herbert Fahrenkrog