Patents Examined by Robert J. Hoffberg
  • Patent number: 11075506
    Abstract: A switchgear housing for housing an object, such as a circuit breaker, includes: a wall with an access opening for access to a high voltage connector; at least one shutter plate movable parallel to the wall between a closed position, in which the shutter plate covers the opening and an open position, in which the shutter plate exposes the opening; an urging means for urging the at least one shutter plate towards the closed position; an operating mechanism for operating the shutter plate from the closed position to the open position when an object is moved into the housing; and at least one latch movable in a direction perpendicular to the wall with the access opening and between a latched position and an unlatched position. A path of the at least one latch and a path of the shutter plate intersect.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: July 27, 2021
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventor: Willem Lammers
  • Patent number: 11073156
    Abstract: A system and apparatus for a ceiling fan electronics assembly including a housing with an interior for housing an electrical system for the ceiling fan. The electrical system can provide a supply of power to the ceiling fan as well as interpret electrical instruction signals for controlling the operation of the ceiling fan. The housing can include a partition separating the interior into a vent section and an electronics section.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: July 27, 2021
    Assignee: Hunter Fan Company
    Inventor: Phillip Santolucito
  • Patent number: 11076503
    Abstract: Electronic unit comprises an housing comprising a top cover; a printed circuit board mounted inside the housing and comprising at least a first heating source element on the top layer of the printed circuit board; the top cover comprises at least a first opening; the electronic unit comprises at least a first thermally conductive insert element distinct from the housing and extending from its top extremity arranged around the first opening, to its bottom extremity in thermal contact with the first heating source element such that heating dissipation of the first heating source element is allowed; fixing means configured to entirely fix the top extremity of the first thermally conductive insert element with the top cover around the first opening.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: July 27, 2021
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Jakub Korta, Marcel Fruend, Klaus Kaufmann
  • Patent number: 11071238
    Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: July 20, 2021
    Assignee: ICEOTOPE GROUP LIMITED
    Inventors: Neil Edmunds, Andrew Young, David Amos
  • Patent number: 11063410
    Abstract: A switchgear includes: a tank having a first through hole; a fixed contact in the tank; a movable contact capable of reciprocating between a position in contact with the fixed contact and a position separated from the fixed contact; and an operating rod capable of reciprocating in a direction parallel to the direction of movement of the movable contact, and penetrating through the first through hole. The switchgear further includes: a connecting plate connecting the movable contact and the operating rod; a shielding plate disposed closer to the fixed contact than the connecting plate, having a second through hole through which the operating rod penetrates and a third through hole through which the movable contact is capable of passing formed therein; a first bearing disposed in the first through hole to support the operating rod; and a second bearing disposed in the second through hole to support the operating rod.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: July 13, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Osamu Kisanuki
  • Patent number: 11056862
    Abstract: An electrical device connector includes: a bus bar which includes a hollow portion extending in an axial direction and through holes extending in an axis-orthogonal direction, and which electrically connects a plurality of switchgears to each other; terminal members including bus bar support portions in which the bus bar is inserted, and including electrical device connection portions in which the insulation plugs are inserted and fixed; and stud bolts each having one end fixed to the corresponding switchgear, each extending in the axis-orthogonal direction through the corresponding through hole, and each fixing the corresponding insulation plug at the other end. Gaps are each formed between the corresponding stud bolt and the bus bar so as to allow communication between the hollow portion and an internal space of the corresponding terminal member.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: July 6, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shintaro Yamada, Tadahiro Yoshida, Eiji Morito, Shintaro Kuroaki
  • Patent number: 11058031
    Abstract: A vapor chamber that includes a housing composed of a first sheet and a second sheet facing each other and having outer edge portions thereof joined to each other to define an internal space, the second sheet having a plurality of projecting portions on an inner surface thereof that faces the internal space; a pillar between the first sheet and the second sheet and supporting them from the internal space; a wick arranged in the housing, and a working fluid enclosed in the housing. A first flow path and a second flow path are formed in the internal space, and a cross-sectional area of the second flow path is larger than a cross-sectional area of the first flow path.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: July 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD
    Inventors: Tatsuhiro Numoto, Takuo Wakaoka, Atsushi Kishimoto, Osamu Chikagawa
  • Patent number: 11058034
    Abstract: A modular network switch is disclosed. In an embodiment, removable interface modules and a switch circuit board (SMB) are housed in a chassis. Each of the interface modules includes a circuit board that is positioned in parallel with other interface modules. The SMB is oriented in a plane perpendicular to orientation planes of the interface modules, and the circuit boards are connected to the switch circuit board. A switch chip is electrically connected to SMB, and configured to switch network traffic between network connections of the interface modules. The chassis may include airflow regions separated by a divider with respective air intake vents. A power supply is housed in one of the regions and the SMB/interface modules are housed in another region. Power supplies provide power to the interface modules via a bus bar and provide power to the switch circuit board via a connection separate from the bus bar.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: July 6, 2021
    Assignee: Facebook, Inc.
    Inventors: Che Kin Leung, Zhiping Yao, Xu Wang, Lingjun Wu, John Edward Fernandes
  • Patent number: 11044830
    Abstract: A loop heat pipe includes an evaporator configured to evaporate a liquid phase working fluid to generate vapor, the evaporator including first and second inner surfaces that face each other; a comb-like porous body including a plurality of comb teeth, the comb-like porous body being disposed inside the evaporator; a plurality of grooves disposed on one of the first inner surface and second inner surface so as to overlap the plurality of comb teeth; a vapor transport line configured to transport the vapor of the working fluid; a condenser configured to liquefy the vapor of the working fluid; and a liquid transport line configured to transport the liquified vapor as a liquid phase working fluid, wherein each of the liquid transport line and the vapor transport line connects the evaporator and the condenser, such that the vapor transport line and the liquid transport line form a loop-like flow passage.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: June 22, 2021
    Assignee: FUJITSU LIMITED
    Inventor: Takeshi Shioga
  • Patent number: 11039550
    Abstract: A planar fin for use in a heat sink includes turbulent structures extending from the sides of the planar fin. Each turbulent structure defines a longitudinal axis and having a first edge that is parallel to the longitudinal axis and connected to the a planar surface of the fin. Each turbulent structure also includes a second edge opposite the first edged and in free space. The second edge defines a periphery that varies in distance from the first edge along the length of the longitudinal axis. The periphery of each second edge is further shaped such that turbulent flow of a fluid is induced in the flow flowing over the second edge at at least a predefined flow rate.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: June 15, 2021
    Assignee: Google LLC
    Inventor: Xu Zuo
  • Patent number: 11039551
    Abstract: A data center regulates supply air provided to multiple compartments including an information technology (IT) compartment having a cold aisle and a hot aisle and an operation technology (OT) compartment. An environmental subsystem of the data center includes an air handling system that provides supply air to the cold aisle and that draws return air from the hot aisle to moderate or cool a temperature of IT component(s) that may be installed within the IT compartment. Airflow regulation device(s) are positioned in at least one of (i) a supply air passage that guides a portion of the supply air in the cold aisle of the IT compartment into the OT compartment to moderate or cool a temperature of OT component(s) that may be installed within the OT compartment and/or (ii) a return air passage that guides air from the OT compartment(s) to the hot aisle of the IT compartment.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: June 15, 2021
    Assignee: Dell Products, L.P.
    Inventors: Mark M. Bailey, Trey S. Wiederhold, Ty R. Schmitt
  • Patent number: 11032940
    Abstract: A cooling plate includes: first comb tooth flow paths extending from a first common flow path; second comb tooth flow paths extending from a second common path; first vertical flow paths each of which extends from the first comb tooth flow path; second vertical flow paths each of which extends from the second comb tooth flow path; first outer flow paths each of which extends from the first vertical flow path; second outer flow paths that are alternately adjacent to the first outer flow path; first coupling flow paths each of which extends from the first comb tooth flow path or the first outer flow path; second coupling flow paths that are alternately adjacent to the first coupling flow path; and heat receiving flow paths each of which communicates with the first coupling flow path and the second coupling flow path to receive heat of the heat receiving surface.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: June 8, 2021
    Assignee: FUJITSU LIMITED
    Inventor: Takayoshi Matsumura
  • Patent number: 11018479
    Abstract: Provided is a distribution board which includes a plurality of breaker units which are disposed so as to be inserted and removed, through a front side of a housing, in a front-rear direction, relative to a vertical bus disposed on an inner depth side of the housing so as to extend in an up-down direction, the plurality of breaker units being electrically connected to and disconnected from the vertical bus by insertion and removal operation. In the distribution board, the breaker units include a first breaker unit and a second breaker unit that are aligned in line in a horizontal direction and that can be individually inserted and removed, and the vertical bus includes a first vertical bus corresponding to the first breaker unit and a second vertical bus corresponding to the second breaker unit.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: May 25, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Toshifumi Ogai, Masato Ohara, Daijiro Kondo
  • Patent number: 11017919
    Abstract: A medium-voltage or high-voltage electrical device comprising a sealed enclosure in which are located electrical components covered with a solid dielectric layer and a gaseous medium ensuring electrical insulation and/or extinguishing electrical arcs, the gaseous medium comprising heptafluoroisobutyronitrile and a dilution gas, the thickness of the solid dielectric layer being less than 1 mm and being produced from a material comprising a polyepoxide or polyurethane resin optionally containing a filler or aluminum oxide.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 25, 2021
    Assignee: General Electric Technology GmbH
    Inventors: David Gautschi, Robert Luescher, Yannick Kieffel, Fran├žois Biquez
  • Patent number: 11013134
    Abstract: A power control unit includes a power module, a water jacket, and a power supply connection module. The water jacket has a through hole passing through the water jacket from one side surface thereof to the other side surface thereof. The power supply connection module includes a connection conductor passing through the through hole and configured to connect an internal power supply path to an external power supply path and a conductor housing configured to hold at least a part of the periphery of the connection conductor on the external power supply path side. A seal member configured to seal the periphery of the through hole is disposed between the water jacket and the conductor housing.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: May 18, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Hiroshi Kunii
  • Patent number: 10993351
    Abstract: An electronic device and a heat-dissipation device for an electronic device are provided. The heat-dissipation device comprises an airflow channel; an airflow source located in the airflow channel; a plurality of elongated heat-dissipation fins arranged in the airflow channel; and a plurality of heat-dissipation flow-guiding devices arranged in the airflow channel and between the airflow source and the plurality of elongated heat-dissipation fins, wherein the plurality of heat-dissipation flow-guiding devices include a first heat-dissipation flow-guiding device in a central position of the airflow channel and a second heat-dissipation flow-guiding device on two sides of the airflow channel, and a longitudinal distance between the first heat-dissipation flow-guiding device and the airflow source is less than the distance between the second heat-dissipation flow-guiding device and the airflow source.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: April 27, 2021
    Assignee: Harman International Industries, Incorporated
    Inventors: Wenbing Tang, Guanting Huang, Haifeng Lu, Liang Tan
  • Patent number: 10986755
    Abstract: A heat transfer apparatus includes a first chamber horizontally offset from a second chamber to form an upper housing and a lower housing. The upper housing may be stacked on top of and fastened to the lower housing. The heat transfer apparatus may include a heat exchange interface fixed to a bottom surface of the lower housing. The heat exchange interface may absorb heat from a proximate heat source and transfer the absorbed heat to an inner surface of the lower housing. The apparatus includes a pump including an impeller and a stator disposed therein. The lower housing may separate the impeller from the stator so that the stator is isolated from the impeller by a surrounding casing. A liquid coolant may be circulated from an inlet, over the heat exchange interface and out to an outlet to remove heat from a processer proximate to the heat exchange interface.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: April 20, 2021
    Assignee: ARCTIC (HK) LTD
    Inventors: Vincent Andre, Magnus Huber
  • Patent number: 10986751
    Abstract: An external air baffle nozzle has a top surface, a bottom surface, and a pair of sidewalls separating the top surface from the bottom surface. An end of the pair of sidewalls, an end of the top surface and an end of the bottom surface define an inlet. An opposite end of the pair of sidewalls, an opposite end of the top surface, and an opposite end of the bottom surface define an outlet. The outlet has a smaller cross section than a cross section of the inlet.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: April 20, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Jen-Mao Chen, Wei-Te Wang, Shuo-Ting Jian
  • Patent number: 10986752
    Abstract: An electronic device includes persistent storage enclosed within a housing. The housing is configured to protect the persistent storage during shipment of the electronic device by a common carrier. The electronic device may include at least one security door, which when in an open-state, may provide access to at least one of a data port, an aperture, a portion of a display, and/or the persistent storage. When the security door is in a closed-state and possibly locked, the persistent storage may be protected from environmental factors, such as dirt, weather, and tampering. In some embodiments, the aperture may enable airflow though the housing and may be fitted with a filter to remove debris from air that circulates into the housing.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: April 20, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Strickland Beall, Frank Charles Paterra, Darin Lee Frink
  • Patent number: 10980151
    Abstract: A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 13, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sunil Rao Ganta Papa Rao Bala, Richard Bargerhuff, Nabeel Fathi