Abstract: A system includes a rack, computing devices coupled to the rack, a rack PDU, and one or more input power cables. The rack PDU includes an enclosure, two or more power input receptacles on the enclosure, and two or more power output receptacles on the enclosure. The output power receptacles supply power to the computing devices. The input power cables are coupled in one or more of the power input receptacles. The input power cables supply electrical power from an electrical power system to the rack PDU.

Abstract: A computer system includes a housing having a base and a door positioned opposite the base and a cooling system. The cooling system includes a support rack that is connected to the base and a first cooling fan that is removably attached to the support rack with a plurality of mounting systems. The mounting systems each include a mount that extends away from the cooling fan in a direction substantially parallel to a rotational axis of the cooling fan and/or the mount extends in a direction substantially parallel to an area, proximate the first cooling fan, of the door. The support rack is configured to position the first cooling fan away from the housing.

Abstract: A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assembly between an microelectronic component package and heat sink with the thermal interface assembly comprising a thermal interface material having phase change properties and a sealing member selected from the group consisting of an o-ring and/or shim in an arrangement such that the thermal interface material is shielded from the atmosphere when the microelectronic component package is operational.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor tube is mounted between the main body and the reservoir and is gradually smaller in diameter from the main body to the reservoir. The shaft connects to the motor, extends into the adaptor tube and has multiple fan blades corresponding to the inside diameter of the adaptor tube. The fan blades blow the air through the adaptor tube into the reservoir to pressurize the air. The pressurized air flows through the delivery tube to contact the electronic component and equalizes to correspond to the atmosphere. The equalizing process of the pressurized air absorbs heat from the electronic component as it expands to cool the electronic component.

Abstract: A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe (220) transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

Abstract: An assembly of devices including at least one switchgear cabinet and a cooling device. The switchgear cabinet has a closed interior, in which electric installations can be housed. The cooling device is attached in the vicinity of or near a lateral surface of the switchgear cabinet that runs vertically with respect to the front face, extending at least over part of the height of the switchgear cabinet and having a spatial connection with the interior via at least one air inlet and at least one vent outlet. The cooling device includes a receiving chamber that houses at least one heat exchanger. This invention facilitates the adaptation of the cooling device in superstructures of this type to modified cooling requirements. To achieve this, at least sections of the receiving chamber of the cooling device are divided into two or more receiving sub-chambers that are situated one above the other and a cooling module is housed in at least one of the receiving sub-chambers.

Abstract: A cooling system for an electronic display may include a heat collector plate with internal gas and liquid phase lines. The cooling plate may be thermally isolated together with electronic components of the display within an enclosure of the display, while external lines carry liquid and gas phase refrigerant outside the enclosure to and from the heat collector plate. The external lines may be similar in size to each other and may be connected to the heat collector outside the heat collector plate by a manifold. The heat collector plate contacts a base plate of the electronic display in a thermally conductive relation to transfer heat from electronic components within the display to the gas phase refrigerant. Fans may be included for additional convective heat transfer. A single compressor may be fluidly connected to multiple heat collector plates in respective electronic displays.

Abstract: A module houses an optical transceiver device and provides a dedicated heat-transfer environment for the device. A fan draws in ambient air and blows it through a heat exchanger and out an exhaust. Heat transfer is by conduction from the device into the heat exchanger through an opening in an EMI shield of the device. In some embodiments the fan is a pluggable unit, allowing quick replacement if status LEDs indicate a fault.

Abstract: An enclosure for housing electronic circuit boards, which enclosure includes a fan tray assembly which may be easily removed from and inserted into the enclosure.

Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.

Abstract: The proposed heat sink assembly mounted on a heat source includes a heat sink including a base with a top surface and a plurality of fins, and a retaining device including a frame with a top, a hole with a size larger than that of the base, an elastic rod connected with the frame, extending into the hole and having and end portion protruding towards the hole and pushing the heat sink and a plurality of retaining plates extending downwards from one of the first two and the second two opposite sides. Each of the retaining plates has a barb mounting the heat sink on the heat source and making the top surface raise through the hole to a same height of the top to facilitate the heat dissipation.

Abstract: A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.

Abstract: A heat dissipating structure for a computer host is disclosed. The heat dissipating structure is fixable to a housing of the computer host and is provided for a heat dissipating fan for dissipating heat. The heat dissipating structure includes a fan fixing housing including a front opening and a hollow network, the fan fixing housing being a hollow frame; a plurality of first fixing portions formed in a peripheral region around the front opening of the fan fixing housing; and a plurality of second fixing portions corresponding to the first fixing portions and formed on a peripheral region of the hollow network of the fan fixing housing.

Abstract: A wind-guiding cover is provided, which is mounted in an electronic device having a heat generating component, a first coupling portion, a first positioning portion and an air inlet, wherein the heat generating component has a fan. The wind-guiding cover includes a main body and a separator. The main body is disposed between the heat generating component and the air inlet, and includes a channel for connecting the heat generating component to the air inlet, and a second coupling portion for being coupled to the first coupling portion, so as to allow the fan to directly introduce cooling air from the air inlet to the heat generating component to dissipate heat generated by the heat generating component. The separator is connected to a side of the main body and has a second positioning portion for being coupled to the first positioning portion.

Abstract: A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling component. The integrated cooling component reduces thermal variation and cools the circuit module. Flex circuitry populated with a plurality of ICs and exhibiting a connective facility that comprises plural contacts for use with an edge connector is wrapped about the edge of the thermally-conductive substrate. Heat from the plurality of ICs is thermally-conducted by the thermally-conductive substrate to the integrated cooling component.

Abstract: A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component to the host device; a heat transfer device having a first end thermally connected to the electronic component; and a heat transfer connector thermally connecting a second of the heat transfer device to the host device. The heat generated by the electronic component is discharged, or transferred, to the host device side through the heat transfer device and the heat transfer connector.

Abstract: A plurality of pouch bodies (14, 16, 18) are supported side-by-side from an assembly that includes a manifold block (26). The manifold block (26) includes an inlet manifold (28) and an outlet manifold (30). A liquid coolant (e.g. water) is delivered into the inlet manifold (28) via an inlet fitting (32). The liquid flows from the inlet manifold (28) into and through inlet passageways (36) which connect the inlet manifold (28) with inlet fittings (22) leading into a common end of the pouch bodies (14, 16, 18). The cooling liquid flows into the pouch bodies (14, 16, 18) and through them to outlet fittings (24) at the opposite ends of the pouch bodies (14, 16, 18). The coolant flows from the outlet fittings (24) through outlet conduits (38) to and into the outlet manifold (30). The coolant flows from outlet manifold 30 out through an outlet port (34). Electronic components to be cooled are placed between the pouch bodies (14, 16, 18).

Abstract: A heat dissipating apparatus includes a heat sink (20) having a base plate (22) for contacting an electronic component (10). A number of main fins (24) extend from the base plate. A cooling fan (30) is mounted on the heat sink. A center of the cooling fan offsets in a first direction from a center of the electronic component, so that a portion of the cooling fan that generates more and stronger airflows than the center of the cooling fan does is aligned with the center of the electronic component.

Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.