Patents Examined by Robert J. Hoffberg
  • Patent number: 10736231
    Abstract: A data center may be organized into modules, wherein the modules are purchased pre-configured to provide certain functionality of an information handling system. The modules may include utility modules, information technology (IT) modules, and air handling unit (AHU) modules. The utility module may provide infrastructure for other modules, such as electrical power service infrastructure. The utility module may be passively cooled through openings to controlled environments in other modules. For example, the utility module may include openings for airflow to and from the warm air aisle and the cool air aisle of an information technology (IT) module that has an attached air handing unit (AHU) module. Space in the utility module may be cooled through airflow to and from the cooled IT module.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: August 4, 2020
    Assignee: Dell Products L.P.
    Inventors: Mark Mcgrath Bailey, Trey S. Wiederhold, Tyler B. Duncan, Ty R. Schmitt
  • Patent number: 10729037
    Abstract: Systems and methods for a hybrid control and cooling module with an independently removable cooling section for a network device. A control module for a network device includes a frame. A printed circuit board is disposed on the frame. Connectors are configured to operably connect the printed circuit board to mid-plane connectors of a shelf of a network device. A control module mounting system is disposed on the frame and is configured to slidably mount the control module to a shelf of a network device. A cooling module guidance system is disposed on the frame and is configured to slidably mount thereon a cooling module for a network device.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 28, 2020
    Assignee: Ciena Corporation
    Inventors: Simon John Shearman, Anthony Mayenburg, Michael Bishop
  • Patent number: 10727553
    Abstract: A method for self-sensing, activating, and regulating thermal management for a rack-mount backup battery unit (BBU) module is disclosed.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: July 28, 2020
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10728999
    Abstract: A printed circuit board (1) comprises a conductive outer layer (2) and at least one conductive inner layer (4, 14). At least one bus bar (7, 8) for conducting high current and at least one power semiconductor (12) for controlling and/or activating the high current are disposed on a side of the outer layer (2) facing away from the at least one inner layer (4, 14). The printed circuit board (1) allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board (1) can be produced economically and flexibly.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: July 28, 2020
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Jörg Kühnl
  • Patent number: 10717366
    Abstract: Presented are electrical capacitors with interleaved busbar architectures, methods for making/operating such capacitors, and electric-drive vehicles equipped with such capacitors. A bulk capacitor includes multiple capacitor devices disposed within an outer housing and operable to modify electric current transmitted between a power source and an electrical load. An interleaved busbar package is interposed between the capacitor devices and outer housing. The interleaved busbar package includes a first busbar plate that electrically connects to first terminals of the capacitor devices and defines a busbar pocket. A second busbar plate is seated within the busbar pocket and electrically connects to second terminals of the capacitor devices. The second busbar plate includes a capacitor basin that seats therein the capacitor devices. An isolator sheet is interleaved between and electrically insulates the first and second busbar plates.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: July 21, 2020
    Assignee: GM Global Technology Operations LLC
    Inventors: Marko Jaksic, Constantin C. Stancu, Dawud S. Abu-Zama
  • Patent number: 10716238
    Abstract: A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: July 14, 2020
    Assignee: AECORSIS B.V.
    Inventor: Dirk Roelof Brink
  • Patent number: 10716236
    Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: July 14, 2020
    Assignee: Google LLC
    Inventors: Christopher G. Malone, Thomas R. Kowalski
  • Patent number: 10716237
    Abstract: The present invention relates to a device for driving a motor, the device comprising: a main housing for accommodating a circuit module therein, wherein a top of the main housing is partially opened to define an open portion; an input/output (IO) cover coupled to the main housing so as to occupy the open portion; and an auxiliary housing coupled to the main housing at an vertical side face of the main housing.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: July 14, 2020
    Assignee: LSIS CO., LTD.
    Inventors: Dong-Sik Kim, Chun-Suk Yang
  • Patent number: 10705578
    Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: July 7, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, William K. Norton, Ernesto Ferrer Medina
  • Patent number: 10706256
    Abstract: Provided are a display module and an electronic device. The display module includes a display screen, the display screen comprising a display surface and a non-display surface opposite to the display surface; a first heat conduction member, the first heat conduction member laminated on the non-display surface, a first through hole defined in the first heat conduction member, the non-display surface comprising an exposed portion exposed in the first through hole; a photosensitive module, the photosensitive module laminated on the exposed portion; and a second heat conduction member contacting each of the photosensitive module and the first heat conduction member; the first heat conduction member comprising a first inner sidewall formed due to formation of the first through hole, and a contact area between the second heat conduction member and the photosensitive module is larger than an area of the photosensitive module directly facing the first inner sidewall.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: July 7, 2020
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Yongxin He, Yuan Ding, Yang Zeng
  • Patent number: 10701825
    Abstract: An electrical housing made from plastic, comprising a bottom housing part with walls forming a housing bottom and a plurality of side walls, wherein the walls form a housing opening, wherein at least one of the walls has a plurality of positions for arranging cable glands, and a top housing part adapted to the bottom housing part for closing the housing opening in a sealing manner, wherein at least one metallic screw connection plate with threads for the attachment of cable glands integrated into the screw connection plate is disposed in the housing interior, wherein the screw connection plate is oriented and arranged such that the threads are oriented so as to correspond to the positions.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: June 30, 2020
    Assignee: Vega Grieshaber KG
    Inventors: Ralf Schätzle, Fabian Witt
  • Patent number: 10698458
    Abstract: A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: June 30, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew Delano, Taylor Stellman
  • Patent number: 10701832
    Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: June 30, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy Joseph Chainer, Pritish Ranjan Parida, Mark Delorman Schultz
  • Patent number: 10693284
    Abstract: A metal-clad compliant grounding/earthing switch device configured for use within conventional switchgear is described. The device is equipped with adequate and compliant insulation of all bus connections, and is configured to close during maintenance outages grounding the live parts of the circuit feed by a particular breaker. The device enables electricians to perform maintenance and repairs in the event of an outage safely, and without the need to manually install a temporary Ground-and-Test Device. An insulated clam shell is present to limit fault propagation from live components until components are confirmed as grounded prior to maintenance of the switchgear.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: June 23, 2020
    Inventor: Seth Benson
  • Patent number: 10690285
    Abstract: A portable electronic device comprising a device body, a first linking member and a supporting member is provided. The first linking member includes a first end and a second end. The first end is rotatably connected to the device body. The supporting member is pivotally connected to the second end. The supporting member moves relative to the device body via the first linking member, the first linking member rotates relative to the device body via the first end, and then the second end moves close to or out from the device body.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: June 23, 2020
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ya-Lin Wu, Shu-Chun Hsiao, Chia-Chang Tsui, Tsung-Ju Chiang, Ming-Hsing Yang
  • Patent number: 10688946
    Abstract: Generally, a switch system for a vehicle including one or more switches electrically coupled to an electrical power distribution module each switch operable to corresponding activate or deactivate one or more accessory devices. In particular, a retrofit switch system including a switch assembly configured to insert within fascia panel pocket of a fascia panel within a vehicle and having one or more switches electrically coupled to an electrical power distribution module each switch operable to corresponding activate or deactivate one or more accessory devices.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: June 23, 2020
    Assignee: Evobic Holdings LLC
    Inventor: Scott R. Bove
  • Patent number: 10693265
    Abstract: A current shaping phase leg bus bar for power electronics systems includes a first terminal connector, a second terminal connector, insulated from the first terminal connector, and a third terminal connector, insulated from the first and second terminal connectors. At least one of the terminal connectors is a current shaping terminal connector that includes one or more layers having a plurality of pre-defined locations for electrical connections, said plurality of pre-defined locations including one or more first locations and a plurality of second locations, and includes one or more gaps within or among its one or more layers, to provide substantially balanced conductive pathways among its one or more first locations and its plurality of second locations.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: June 23, 2020
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Henry Todd Young, Alvaro Jorge Mari Curbelo, Jason Daniel Kuttenkuler, Tiziana Bertoncelli, Sean Patrick Cillessen
  • Patent number: 10694641
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: June 23, 2020
    Assignee: Intel Corporation
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Patent number: 10682773
    Abstract: A cooling device for cooling electrical components of a robot control device with cooling air flow generated by a fan having a first receiving space for first electrical components, a second receiving space for second electrical components, and a cooling body wall fluidically separating the first receiving space from the second receiving space. The cooling body wall has a first separating wall surface facing the first receiving space and an opposite second separating wall surface facing an intermediate space of the cooling body wall. The second separating wall surface includes cooling wall projections that form at least one flow channel. The cooling body wall has a cooling air passage opening that is designed to convey a cooling air flow conveyed by at least one fan of the cooling device from the first receiving space, through the cooling body wall, into the intermediate space.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: June 16, 2020
    Assignee: KUKA Deutschland GmbH
    Inventors: Michael Wagner, Gerhard Werner, Mario Selic
  • Patent number: 10681800
    Abstract: A thermal module mounting structure includes a thermal module having a first bracket with mounting holes fixedly mounted at each of two opposite sides of a bottom wall thereof, a circuit board having one or multiple heat source components located on a top wall thereof and a second bracket with through holes fixedly mounted at each of two opposite sides of the top wall, and a plurality of fasteners respectively inserted through the through holes of the second brackets and fastened to the respective mounting holes of the first brackets to secure the circuit board to the thermal module in a vertically floatable manner and to keep the heat source components in contact with the bottom wall of the thermal module.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: June 9, 2020
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Hua-Feng Chen, Chih-Cheng Chou