Patents Examined by Robert J. Hoffberg
-
Patent number: 12167569Abstract: A self-contained mobile high performance computing platform for cryptocurrency mining is disclosed. The self-contained mobile high performance computing platform includes a mobile cabinet, which includes wheels for easy movement and placement within, for example, a warehouse facility, a garage, a basement, an office tower, or a vehicle such as a truck or van. The cabinet is configured to enclose at least one computing apparatus, which includes computing blades immersed in an oil or other dielectric fluid for immersion cooling. The computing blades are configured to be connected to respective interface boards via connectors that are located within a tank of the dielectric fluid. Each computing blade may be individually removed or replaced, thereby enabling an inoperable or low performance computing blade to be disconnected without affecting the operations of the other computing blades.Type: GrantFiled: January 11, 2023Date of Patent: December 10, 2024Assignee: DaVinci 3.0 IncorporatedInventors: Patrick J. Sweeney, II, John DeCarlo, Paul Nickelsberg, Ajeet Yadav, Garet Holcomb
-
Patent number: 12156381Abstract: A heat dissipation device of electronic equipment has a base, a heat dissipation group, and a cover. The base has an opening, a chamber, and a boss formed in the chamber. The heat dissipation group is connected to the base and has a circuit board and a cooling blade. The circuit board is mounted in the chamber, abuts against the boss, and has a heat source area and at least one non-heat-source area. The heat source area has a first surface facing the boss and a second surface facing the opening. The cooling blade is connected to the base and is located at the second surface. The first surface and the second surface of the heat source area respectively correspond to the boss and the cooling blade in location to provide a guiding direction for heat conduction. The cover is connected to the base.Type: GrantFiled: November 10, 2022Date of Patent: November 26, 2024Assignee: TECHWAY INDUSTRIAL CO., LTD.Inventors: Fu Hsiang Chung, Hong Fang Chen, Chun Tse Chan
-
Patent number: 12155202Abstract: An assembly to contain energy from arc flash within a mounting slot of an equipment rack includes a valve panel assembly including a first valve panel body secured to the frame members by a first hinge and a second valve panel body secured to the frame members by a second hinge. The first valve panel body and the second valve panel body are configured to rotate between closed positions and open positions. A method of assembling a system to contain energy from arc flash within a mounting slot of an equipment rack is further disclosed.Type: GrantFiled: January 14, 2022Date of Patent: November 26, 2024Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventor: Claus Aabjerg Andersen
-
Patent number: 12144147Abstract: An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.Type: GrantFiled: November 15, 2022Date of Patent: November 12, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Sang Hun Lee, Hyong Joon Park, Se Heun Kwon
-
Patent number: 12137541Abstract: Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at least one fan relative to the first end of the chassis. A carrier including a frame may be coupled to the at least one storage media device, where the frame includes an elongated member extending away from the storage media device toward the first end of the chassis. Other aspects, embodiments, and features are also included.Type: GrantFiled: November 3, 2022Date of Patent: November 5, 2024Assignee: Sanmina CorporationInventors: Odie Banks Killen, Jr., John Albert Bauer, Jr., Daniel Joseph Gregory, Charles Christoper Hill, Xin Wang, Kenneth Dale Van Antwerp, Jr.
-
Patent number: 12137542Abstract: A power conversion apparatus includes a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space, a resin material having a thermal conductivity, the resin material being provided in the predetermined space, a coil disposed in the predetermined space, a coil case having a shape that fits with the housing part, the coil case being configured to house the coil, and a power semiconductor device disposed along a side wall of the coil case. The power semiconductor device is pressed and fixed between a side wall of the housing part and the side wall of the coil case in a state where a heat dissipation surface is in contact with the side wall of the housing part.Type: GrantFiled: December 9, 2022Date of Patent: November 5, 2024Assignee: Panasonic Automotive Systems Co., Ltd.Inventor: Atsushi Yamashima
-
Patent number: 12132299Abstract: A power cabinet, which includes a cabinet body and an electric reactor, a power unit and a switch arranged in the interior of the cabinet body. In the interior of the cabinet body of the power cabinet, the electric reactor is arranged close to a first side in the interior of the cabinet body, and the power unit and the switch are arranged on a second side in the interior of the cabinet body, opposite to the first side. Moreover, these electric reactor, the power unit and the switch are all located in a lower space. In addition, in the power cabinet, the electric reactor and power unit dissipate heat in different chambers from the switch dissipates heat.Type: GrantFiled: February 4, 2022Date of Patent: October 29, 2024Assignee: Sungrow Power Supply Co., Ltd.Inventors: Hao Zheng, Qiyao Zhu, Longlin Sun
-
Patent number: 12133363Abstract: A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.Type: GrantFiled: June 15, 2023Date of Patent: October 29, 2024Assignee: Hamfop Technologies LLCInventor: Mudasir Ahmad
-
Patent number: 12126215Abstract: An uninterruptible power supply device includes a housing having a rectangular parallelepiped shape, a plurality of units vertically stacked and accommodated in housing, and a fan unit having a plurality of fans aligned on an upper surface of housing. Each of the upper surface and the lower surface of housing is formed with an opening through which a wire is led into housing.Type: GrantFiled: December 1, 2020Date of Patent: October 22, 2024Assignee: TMEIC CorporationInventor: Koki Nakamura
-
Patent number: 12119625Abstract: The present invention provides a method for installing circuit breakers of different frame sizes into an electrical distribution device at the at the factory or on the jobsite without having to remove the original factory installed line and load busing and installing new line and load busing for the particular frame size of the circuit breaker to be installed. The invention also provides a means for reducing the number of line and load busing assemblies that the electrical distribution device manufacturer must keep in inventory.Type: GrantFiled: June 17, 2022Date of Patent: October 15, 2024Assignee: Schneider Electric USA, Inc.Inventors: Charles Wesley Travis, Jr., Karthik Sundaramoorthy, James Raymond Ramsey
-
Patent number: 12119622Abstract: The power distribution module includes a power busbar, a primary load output module, a secondary load output module, a battery module, and a signal-driven collection module, where each of the primary load output module, the secondary load output module, and the battery module includes a circuit breaker, the power busbar is connected to the circuit breaker, the signal-driven collection module is connected to the circuit breaker to collect a circuit breaker signal, the signal-driven collection module includes a plurality of first signal units sequentially arranged in a first direction, an integer quantity of first signal units are disposed in a connection area in which the signal-driven collection module is connected to each circuit breaker, and each circuit breaker is provided with a second signal unit.Type: GrantFiled: June 24, 2022Date of Patent: October 15, 2024Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.Inventors: Yanxing Yang, Wei Guo, Tao Feng, Liqiong Yi
-
Patent number: 12108560Abstract: A computing chassis, including hard disk drives positioned at a first end of the chassis; a fan module positioned at a second end of the chassis; a first baffle having acoustic absorbing material, the first baffle extending between a first and a second side of the chassis, wherein the first and second sides of the chassis extend between the first and the second ends of the chassis, the first baffle spaced-apart from the fan module a first distance; a second baffle having acoustic absorbing material, the second baffle extending between the first and the second side of the chassis, the second baffle spaced-apart from the fan module a second distance greater than the first distance, wherein the first and the second baffle extend between the first and second sides of the chassis perpendicular to an airflow, and the acoustic absorbing material of the baffles attenuate acoustic waves.Type: GrantFiled: January 18, 2022Date of Patent: October 1, 2024Assignee: Dell Products L.P.Inventors: Daniel J. Carey, Evangelos Konstantinos Koutsavdis, Chris E. Peterson, Paul Allen Waters
-
Patent number: 12096585Abstract: An interoperable power distribution apparatus and systems includes N power distribution base units having a first configuration as sequentially arranged along a first dimension and secured as removably attached, and a second configuration where each of the N power distribution base units are independently and removably attached to a surface of one of N welding machine support units having various first, second, or third orthogonal dimensions, the N power distribution base units interoperable between the N welding machine support units having varied first, second, or orthogonal third dimensions, wherein N is a positive natural number between 1 and 100.Type: GrantFiled: February 14, 2024Date of Patent: September 17, 2024Inventors: William Matthews, II, Tanner Remondet
-
Patent number: 12095239Abstract: The present disclosure makes it possible to reduce intervals between device units placed in a gas-insulated switchgear, thus achieving size reduction of the gas-insulated switchgear. A gas-insulated switchgear includes: a device housing having an operation door; a sealed container placed inside the device housing; and a circuit breaker unit and a ground switch unit attached to a side surface of the sealed container opposed to the operation door, via flange portions. A distance from the operation door to the side surface of the sealed container opposed to the operation door is different between a part where the circuit breaker unit is attached and a part where the ground switch unit is attached, so as to avoid interference between the circuit breaker unit and the ground switch unit.Type: GrantFiled: April 17, 2020Date of Patent: September 17, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Naoaki Inoue, Takahiro Mori
-
Patent number: 12089371Abstract: A heat pipe, a heat dissipation module, and a terminal device are disclosed. The heat pipe includes a heat pipe body and an ineffective portion that is integrally formed with the heat pipe body when the heat pipe is manufactured, where an inner side of a pipe wall of the heat pipe body has a porous capillary structure layer, the ineffective portion is located in at least a part of the periphery of the heat pipe body, and the ineffective portion is used as a mounting portion for fastening the heat pipe to another object. In a mounting process, a pressure needs to be applied only to the ineffective portion, so that the heat pipe body is not obviously affected. In this way, integrity of the porous capillary structure layer inside the heat pipe body is ensured while the heat pipe is fastened.Type: GrantFiled: November 16, 2020Date of Patent: September 10, 2024Assignee: Honor Device Co., Ltd.Inventors: Yameng Wei, Xianliang Liu, Guangkun Cheng
-
Patent number: 12082373Abstract: A server rack, includes a separation chamber that has an input to receive a mixed two-phase fluid from a server chassis, a vapor output at a top portion of the separation chamber, and a liquid output at a bottom portion of the separation chamber. The server rack includes a condenser that is fluidly connected to the vapor output of the separation chamber to receive and condense the vapor to a liquid, and a main outlet that is fluidly connected to both the liquid output of the separation chamber and to a condenser output of the condenser. The main outlet of the server rack is fluidly connected to an external cooling system which supplies the liquid back to the server rack.Type: GrantFiled: March 21, 2022Date of Patent: September 3, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
-
Patent number: 12080999Abstract: Disclosed are a railway vehicle and a storage battery circuit breaker box thereof. The storage battery circuit breaker box comprises a circuit breaker box body, where mounting bases are arranged on side walls of the circuit breaker box body; a mounting positioning plate and a waterproof protection plate are fixedly mounted on a surface of one side of the circuit breaker box body; the mounting positioning plate is of a rectangular annular structure with an opening provided in the bottom thereof; the waterproof protection plate is located at the inner side of the mounting positioning plate; the waterproof protection plate is of a door-shaped structure; and perspective windows and a switch mounting hole are provided at the circuit breaker box body. The circuit breaker box can be mounted inside a vehicle body, maintenance by maintenance personnel outside the vehicle is facilitated, and the sealing requirements can also be met.Type: GrantFiled: May 26, 2022Date of Patent: September 3, 2024Assignee: CRRC TANGSHAN CO., LTD.Inventors: Mu Tan, Junbin Mu, Xiaojun Li, Jiecun Geng, Fanwei Jiang, Ying Liu, Yanxiang Liu
-
Patent number: 12082369Abstract: A heat sink includes a main body and multiple circular pipes. The main body is in contact with at least one heat emitter. The circular pipes are disposed inside the main body. The circular pipes extend in a shape of helices and are configured to convey refrigerant. The circular pipes are arranged such that the central axes of the helices are adjacent. Each two of the circular pipes of which the central axes of the helices are adjacent to each other are intertwined with each other.Type: GrantFiled: November 4, 2020Date of Patent: September 3, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventor: Masayoshi Tamura
-
Patent number: 12061502Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.Type: GrantFiled: July 7, 2021Date of Patent: August 13, 2024Assignee: Intel CorporationInventors: Jeff Ku, Tin Poay Chuah, Howe Yin Loo, Chin Kung Goh, Yew San Lim, Cora Shih Wei Nien
-
Patent number: 12050788Abstract: Various devices, such as storage devices or storage systems are configured to recycle heat generated during normal operation. This recycled heat can be captured and converted into electricity that can be stored for later discharge and use in cooling the storage devices. The recycling can be done through a variety of energy recycling modules that can be placed on various components within a storage device. These energy recycling modules can be a series of semiconductors that utilize various natural effects to convert heat applied on one side of the module into electricity that can be delivered to various power storing components or used in other areas of the storage device or system. These energy recycling modules can include versions that act as a cooler that can work to accelerate cooling of the storage device upon completion of a period of high usage, thereby reducing cooling costs and increasing device lifespans.Type: GrantFiled: May 17, 2022Date of Patent: July 30, 2024Assignee: Western Digital Technologies, Inc.Inventors: Cono J Sammarco, Gurjit Chadha