Abstract: A solid-state circuit breaker (SSCB) includes an airgap operating mechanism including components and electronics including semiconductors and software algorithms that control the power and can interrupt extreme currents. The SSCB further includes a housing that houses the components of the airgap operating mechanism and the electronics. The housing of the solid-state circuit breaker includes a heat sink that interfaces with a natural air flow such as an existing vertical air channel inside an electrical panel. The heat sink contains a thermally conductive and electrically insulating (TC/EI) plastic.

Abstract: An electronic control device includes a base, a first fan and a second fan provided on one surface, a plurality of first heat-dissipating fins provided on the one surface in a first region including a region between first and second fans such that the plurality of first heat-dissipating fins are provided in the region between the first second fans, and a plurality of second heat-dissipating fins provided on the one surface and in a second region. The plurality of first heat-dissipating fins guide a refrigerant sent by one of the first and second fans toward a remaining one of the first and second fans in the first region, and the plurality of second heat-dissipating fins provided in the second region have a structure for guiding a refrigerant flowing in from the first fan or the second fan away from the first fan and the second fan.

Abstract: A medium voltage switchgear or control gear includes at least one first compartment; a cable compartment; a plurality of main components; and a plurality of auxiliary components. The plurality of main components is housed in at least one part of the at least one first compartment. The plurality of auxiliary components is housed in the cable compartment. The second connector is configured to connect to the first connector to connect a cable in the cable compartment to a component of the plurality of main components. The cable compartment is configured to be disconnected from the at least one first compartment and wherein the cable compartment is configured to be spatially separated from the at least one first compartment.

Abstract: An electrical distribution enclosure includes an electrically insulated panel defining an access portion of the enclosure and a load portion of the enclosure; at least one electrically insulated compartment panel positioned within the access portion; and two or more compartments within the access portion, each compartment separated from an adjacent compartment by an electrically insulated compartment panel, each of the two or more compartments having a front-accessible neutral connection, at least one front-accessible phase connection and a at least rear phase connection.

Abstract: A cooling device cools an electronic component using a plasma actuator provided with a dielectric, a first electrode arranged on one surface of the dielectric to generate an induced flow, and a second electrode arranged on the other surface of the dielectric, in which the electronic component and a third electrode are arranged in a flow direction of the induced flow, and a voltage applied to the third electrode is a voltage that generates a potential difference, which is capable of attracting the induced flow, between the first electrode and the third electrode.

Abstract: In one or more embodiments, one or more systems comprise a heat exchanger comprising a first heat sink coupled to a first portion of a set of heat pipes, a first fan for generating a first airflow in a first direction through the first heat sink, a second heat sink coupled to a second portion of the set of heat pipes and a second fan for generating a second airflow in a second direction through the second heat sink, wherein the first heat sink is separated from the second heat sink by a gap with a distance configured to thermally isolate the first heat sink and the second heat sink and the first direction is opposite the second direction. The heat exchanger may be oriented such that the first fan and the second fan generate airflows perpendicular to a main airflow.

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.

Abstract: The disclosure relates to a housing comprising at least one composite wall comprising woven or braided carbon fibers covered with a thermoplastic or thermosetting resin, an electronic card carrying electronic components, and a heat transfer device having at least one portion facing an electronic component to be cooled of the electronic card, said heat transfer device being inserted inside the composite wall, the heat transfer device comprising at least one cooling conduit containing a cooling fluid.

Abstract: Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.

Abstract: A cooling apparatus includes: a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and radiating fins protruding from the second surface; and a second member including a third surface facing the second surface, a refrigerant flows between the first member and the second member, the second member includes a first protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant, the first protrusion includes a first slope inclined to the third surface, the first slope includes a first end and a second end, the first end is closer to the second surface than the second end, the second end is closer to the third surface than the first end, the first end is positioned downstream in the flow direction from the second end.

Abstract: A self-contained mobile high performance computing platform for cryptocurrency mining is disclosed. The self-contained mobile high performance computing platform includes a mobile cabinet, which includes wheels for easy movement and placement within, for example, a warehouse facility, a garage, a basement, an office tower, or a vehicle such as a truck or van. The cabinet is configured to enclose at least one computing apparatus, which includes computing blades immersed in an oil or other dielectric fluid for immersion cooling. The computing blades are configured to be connected to respective interface boards via connectors that are located within a tank of the dielectric fluid. Each computing blade may be individually removed or replaced, thereby enabling an inoperable or low performance computing blade to be disconnected without affecting the operations of the other computing blades.

Abstract: A heat dissipation device of electronic equipment has a base, a heat dissipation group, and a cover. The base has an opening, a chamber, and a boss formed in the chamber. The heat dissipation group is connected to the base and has a circuit board and a cooling blade. The circuit board is mounted in the chamber, abuts against the boss, and has a heat source area and at least one non-heat-source area. The heat source area has a first surface facing the boss and a second surface facing the opening. The cooling blade is connected to the base and is located at the second surface. The first surface and the second surface of the heat source area respectively correspond to the boss and the cooling blade in location to provide a guiding direction for heat conduction. The cover is connected to the base.

Abstract: An assembly to contain energy from arc flash within a mounting slot of an equipment rack includes a valve panel assembly including a first valve panel body secured to the frame members by a first hinge and a second valve panel body secured to the frame members by a second hinge. The first valve panel body and the second valve panel body are configured to rotate between closed positions and open positions. A method of assembling a system to contain energy from arc flash within a mounting slot of an equipment rack is further disclosed.

Abstract: An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.

Abstract: A power conversion apparatus includes a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space, a resin material having a thermal conductivity, the resin material being provided in the predetermined space, a coil disposed in the predetermined space, a coil case having a shape that fits with the housing part, the coil case being configured to house the coil, and a power semiconductor device disposed along a side wall of the coil case. The power semiconductor device is pressed and fixed between a side wall of the housing part and the side wall of the coil case in a state where a heat dissipation surface is in contact with the side wall of the housing part.

Abstract: Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at least one fan relative to the first end of the chassis. A carrier including a frame may be coupled to the at least one storage media device, where the frame includes an elongated member extending away from the storage media device toward the first end of the chassis. Other aspects, embodiments, and features are also included.

Abstract: A power cabinet, which includes a cabinet body and an electric reactor, a power unit and a switch arranged in the interior of the cabinet body. In the interior of the cabinet body of the power cabinet, the electric reactor is arranged close to a first side in the interior of the cabinet body, and the power unit and the switch are arranged on a second side in the interior of the cabinet body, opposite to the first side. Moreover, these electric reactor, the power unit and the switch are all located in a lower space. In addition, in the power cabinet, the electric reactor and power unit dissipate heat in different chambers from the switch dissipates heat.

Abstract: A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.

Abstract: An uninterruptible power supply device includes a housing having a rectangular parallelepiped shape, a plurality of units vertically stacked and accommodated in housing, and a fan unit having a plurality of fans aligned on an upper surface of housing. Each of the upper surface and the lower surface of housing is formed with an opening through which a wire is led into housing.

Abstract: The power distribution module includes a power busbar, a primary load output module, a secondary load output module, a battery module, and a signal-driven collection module, where each of the primary load output module, the secondary load output module, and the battery module includes a circuit breaker, the power busbar is connected to the circuit breaker, the signal-driven collection module is connected to the circuit breaker to collect a circuit breaker signal, the signal-driven collection module includes a plurality of first signal units sequentially arranged in a first direction, an integer quantity of first signal units are disposed in a connection area in which the signal-driven collection module is connected to each circuit breaker, and each circuit breaker is provided with a second signal unit.