Patents Examined by Ronald Hinson
  • Patent number: 11842833
    Abstract: A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion, and outer electrodes electrically connected to the coil conductor. The average particle diameter of the metal particles in the magnetic portion is 1 ?m or more and 5 ?m or less, and the CV value of the metal particles is 50% or more and 90% or less.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 12, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takuya Ishida, Gota Shinohara
  • Patent number: 11830665
    Abstract: A coil electronic component includes a body, an insulating substrate disposed in the body, first and second coil portions respectively disposed on a first surface and a second surface of the insulating substrate opposing each other, first and second lead-out portions each disposed on the first surface of the insulating substrate and exposed to at least two external surfaces of the body, first and second connection conductors disposed on the first surface of the insulating substrate and connecting the first lead-out portion and the first coil portion and connecting the second lead-out portion and the second coil portion, respectively, wherein the first connection conductor and the second connection conductor respectively include a plurality of first connection conductors and a plurality of second connection conductors, and the plurality of first connection conductors are spaced apart from one another and the plurality of second connection conductors are spaced apart from one another.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Byeong Cheol Moon
  • Patent number: 11830653
    Abstract: A coil electronic component includes a body having a first surface and a second surface opposing each other and a third and a fourth surface opposing each other, an insulating substrate disposed inside the body, first and second coil portions respectively disposed on opposing surfaces of the insulating substrate, a first lead-out portion connected the first coil portion and exposed from the first and third surfaces, a second lead-out portion connected to the second coil portion and exposed from the second and third surfaces, and first and second external electrodes respectively covering the first and second lead-out portions. The insulating substrate includes a support portion supporting the first and second coil portions, a first tip exposed from the first and third surfaces and supporting the first lead-out portion, and a second tip exposed from the second and third surfaces and supporting the second lead-out portion.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Byung Soo Kang, Yoon Mi Cha, Byeong Cheol Moon
  • Patent number: 11830663
    Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and wall surfaces, and including a metal magnetic powder particle and an insulating resin; a coil portion disposed in the body and including first and second lead-out portions exposed from the one surface of the body to be spaced apart from each other; first and second external electrodes arranged on the one surface of the body to be spaced apart from each other and respectively connected to the first and second lead-out portions; a cover insulating layer covering the other surface of the body and extending to at least portion of each of the wall surfaces of the body; and an oxide insulating film disposed on a surface of the metal magnetic powder particle exposed from the one surface of the body and including metal ions of the metal magnetic powder particle.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Byeong Cheol Moon, Ju Hwan Yang, Yoon Mi Cha, Tai Yon Cho, Tae Jun Choi
  • Patent number: 11830656
    Abstract: A transformer device includes a first coil and a second coil. The first coil includes a number of first circles. The second coil includes a number of second circles. A first side of a first one of the first coil is adjacent to one of the first coil, and a second side of the first one of the first coil is adjacent to one of the second coil. A first side and a second side of a second one of the first coil are adjacent to one of the second coil, respectively.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: November 28, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Ka-Un Chan
  • Patent number: 11823822
    Abstract: An improved structural arrangement for mounting winding packages in the air core reactor is provided. Disclosed embodiments make use of structural properties, such as hoop tensile properties, of a filament roving 130 that may be arranged to surround structural features (e.g., inclined surfaces 108) formed in a disclosed mounting plate 110.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: November 21, 2023
    Assignee: SIEMENS ENERGY GLOBAL GMBH & CO. KG
    Inventors: Kamran Khan, Andrew Lang
  • Patent number: 11817250
    Abstract: A broadside coupled coplanar inductor device includes first and second coplanar inductors in which the conductors of the first and second coplanar inductors are broadside coupled. The conductors are located one above the other at a first distance and the return paths are located to the side of the respective first and second conductor signal paths at a second distance. One or both of the dimensions of the first and second first distances is defined so as to maximize a mutual inductance between the conductors. First and second driver circuit apply voltages across each conductor. The input pulse width modulation signals applied to the first and second driver circuits are 180 degrees out of phase.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: November 14, 2023
    Assignee: International Business Machines Corporation
    Inventors: Todd E. Takken, Xin Zhang
  • Patent number: 11804326
    Abstract: A coil component includes an element body having a rectangular main surface; a coil provided within the element body, wherein the coil having a lower coil portion and an upper coil portion; terminal electrodes provided at positions corresponding to corners of the main surface; extracting conductors connected within the element body to both end portions of the coil, wherein the extracting conductors extending from the end portions of the coil to terminal electrodes provided on the main surface; and a dummy electrode provided on the main surface at a position different from those of the terminal electrodes, wherein the dummy electrode is conducted to neither of the extracting conductors.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: October 31, 2023
    Assignee: TDK CORPORATION
    Inventors: Masamichi Taniguchi, Makoto Endo
  • Patent number: 11804325
    Abstract: An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Cu, further contains Fe, and is in contact with the resin and the magnetic metal powder.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: October 31, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinji Otani, Hiroki Imaeda, Namiko Sasajima, Tomohiro Sunaga, Masami Okado, Yoshimasa Yoshioka
  • Patent number: 11785724
    Abstract: A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: October 10, 2023
    Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hiroshi Ueda, Kousuke Miura, Yoshihito Yamaguchi, Yuka Urabe
  • Patent number: 11783989
    Abstract: A transformer includes: an upper primary substrate (110) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns; a lower secondary substrate (120) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns, in which the lower secondary substrate is positioned below the upper primary substrate (110) in such a way that the lower secondary substrate comes into contact with the upper primary substrate (110) or is spaced apart from the upper primary substrate (110); and a secondary coil element (200) of a planar shape to produce an induced current by a current applied to the upper primary substrate (110) and the lower primary substrate (120).
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 10, 2023
    Assignees: SOLUM CO., LTD., ATUM CO., LTD.
    Inventors: Eun Sik Kim, Jun Kyu Lee, Changyong Kwon, Dong-kyun Ryu, Sang-keun Ji, Taeksoo Han, Jung Soo Lee
  • Patent number: 11783991
    Abstract: An inductor device includes a first inductor and a second inductor. The first inductor has a first winding and a second winding. The second inductor has a third winding and a fourth winding, and the second inductor is disposed adjacent to the first inductor, and the second inductor is coupled to the first inductor in an interlaced manner.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: October 10, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Ka-Un Chan
  • Patent number: 11763976
    Abstract: An integrated magnetic core is provided. The integrated magnetic core includes a first plate and a second plate. The first plate includes a plurality of legs extending outwardly from a first surface of the first plate. The plurality of legs includes first and second oppositely disposed legs and third and fourth oppositely disposed legs. The second plate is coupled to at least the third and fourth legs of the first plate.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 19, 2023
    Assignee: ABB Power Electronics Inc.
    Inventors: Ke Dai, Lanlan Yin, Tom Sun
  • Patent number: 11763974
    Abstract: An Isolating Transmission Line Transformer (ITLT) for use in a data communications system is provided, the transformer comprising: a substantially planar substrate formed of electrically insulative material having opposed first and second surfaces; a first port formed of two separate terminals provided at one part of the substrate; a second port formed of two separate terminals provided at a second part of the substrate; a first conductor connected in series to the first port and arranged as a single loop; a second conductor which is electrically isolated from the first conductor and connected in series to the second port, the second conductor being arranged as a single loop in a substantially opposite orientation to the first conductor; wherein the first and second ports and at least part of the first and second conductors are provided on the substrate surface (s); and a core arranged between the first and second ports to cover the majority of the first and second conductors.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: September 19, 2023
    Assignee: UWB X LIMITED
    Inventors: Glenn Richard Lacey, Andrew Stephen Ackland
  • Patent number: 11749443
    Abstract: A coil component includes a multilayer body in which a plurality of resin insulation layers is laminated, a spiral-shaped coil conductor layer disposed on main surface of one of the resin insulation layers, and a close contact layer disposed at interfaces between two of the resin insulation layers and not connected to the coil conductor layer. The close contact layer contains a metal having desired adhesion to the resin insulation layers.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: September 5, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kazunori Annen
  • Patent number: 11742131
    Abstract: A coil component includes a body, a coil portion disposed inside the body, a first external electrode and a second external electrode spaced apart from each other on one surface of the body and connected to the coil portion, a first insulating layer and a second insulating layer respectively connected to the one surface of the body, respectively disposed to side surfaces of the body to extend upwardly of the one surface of the body, and a third insulating layer and a fourth insulating layer respectively connected to the one surface of the body, respectively disposed on end surfaces of the body and each extending upwardly of the one surface of the body. A portion of each of the first and second external electrodes, exposed from the first to fourth insulating layers, is spaced apart from each of a plurality of edges of the one surface of the body.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Yong Hui Li, Seung Mo Lim, Byeong Cheol Moon
  • Patent number: 11742133
    Abstract: Provided is an electronic component including a secondary side coil including a plurality of coil parts, in which each of the coil parts includes: a plate-like base part; a leg part formed on the base part; and a pin part formed at a tip of the leg part.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: August 29, 2023
    Assignee: SONY CORPORATION
    Inventor: Hirofumi Nakazawa
  • Patent number: 11735353
    Abstract: An inductor component comprising an insulating layer containing no magnetic substance, a spiral wiring formed on a first principal surface of the insulating layer and wound on the first principal surface, and a magnetic layer in contact with at least a portion of the spiral wiring.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 22, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Hirai, Koki Okamura, Akinori Hamada, Tomohiro Kido
  • Patent number: 11735347
    Abstract: A pair of terminal electrodes 4 and 5 have electrode parts 4a and 5a and electrode parts 4b and 5b when viewed from a stacking direction, respectively. A plurality of connection conductors are disposed at positions not overlapping a plurality of coil conductors when viewed from the stacking direction. At least two of the plurality of connection conductors are disposed in a first region A1 or a second region A2 between the terminal electrodes 4 and 5 and an outer edge 9a of a coil 9 when viewed from the stacking direction. The first region A1 and the second region A2 overlap the electrode parts 4a and 5a when viewed from the facing direction of a pair of end surfaces 2a and 2b and overlap the electrode parts 4b and 5b when viewed from the facing direction of a pair of main surfaces 2c and 2d.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 22, 2023
    Assignee: TDK CORPORATION
    Inventors: Yuto Shiga, Hajime Kato, Kazuya Tobita, Youichi Kazuta, Noriaki Hamachi, Makoto Yoshino
  • Patent number: 11721473
    Abstract: A coil component includes a body, an insulating substrate embedded in the body and including an insulating resin, and first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic. A coil portion includes first and second coil patterns respectively disposed on the first and second substrate protection layers. Each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Gul Ryu, Ji Man Ryu, Byeong Cheol Moon