Patents Examined by Ronald Hinson
  • Patent number: 11610714
    Abstract: A slow wave inductive structure includes a first substrate. The slow wave inductive structure further includes a first conductive winding over the first substrate. The slow wave inductive structure further includes a second substrate over the first substrate, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (?m) to about 2 ?m, and the second substrate comprises polysilicon or doped silicon. The slow wave inductive structure further includes a second conductive winding on an opposite side of the second substrate from the first conductive winding.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: March 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiao-Tsung Yen, Cheng-Wei Luo
  • Patent number: 11610721
    Abstract: An inductor includes a magnetic body, and a conductor embedded in the magnetic body. The conductor includes a first conductor, and a second conductor covering a periphery of the first conductor.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: March 21, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takayuki Matsumoto, Tsukasa Nakanishi
  • Patent number: 11605489
    Abstract: An integrated magnetic element is provided, including a first magnetic-core frame, three second magnetic-core frames, and three coil windings. The first magnetic-core frame has a first side pillar and a second side pillar opposite to the first side pillar. The three second magnetic-core frames are arranged on the side corresponding to the first side pillar of the first magnetic-core frame, and are arranged in parallel with the axis of the first side pillar of the first magnetic-core frame. Each of the second magnetic-core frames has a first side pillar adjacent to the first side pillar of the first magnetic-core frame, and a second side pillar opposite to the first side pillar of itself. The three coil windings connect to a three-phase grid, and wind around the first side pillar of the first magnetic-core frame and the corresponding first side pillar of the second magnetic-core frame respectively.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: March 14, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Tsung-Nan Kuo, Lei-Chung Hsing
  • Patent number: 11605491
    Abstract: A core main body includes: an outer peripheral iron core, and at least three iron cores coupled to an inner surface of the outer peripheral iron core, in which a gap is formed between adjacent iron cores among the at least three iron cores, the gap being magnetically connectable, and a plurality of notches are formed on an outer circumferential surface of the outer peripheral iron core, the plurality of notches extending in an axial direction of the outer peripheral iron core. The reactor includes such a core body.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: March 14, 2023
    Assignee: Fanuc Corporation
    Inventor: Kenichi Tsukada
  • Patent number: 11600425
    Abstract: One object is to increase the filling factor of magnetic particles and increase the evenness of distribution of the magnetic particles in a magnetic main body of a coil component. A coil component includes: a magnetic main body containing a resin and magnetic particles; and a coil conductor embedded in the magnetic main body. The magnetic particles include large-sized magnetic particles, middle-sized magnetic particles, and small-sized magnetic particles. The proportion of the volume of the large-sized magnetic particles to the total volume of all the magnetic particles is 70 vol % to 85 vol %, the proportion of the volume of the middle-sized magnetic particles to the total volume is 2 vol % to 28 vol %, and the proportion of the volume of the small-sized magnetic particles to the total volume is 2 vol % to 28 vol %. The particle size distribution of the small-sized magnetic particles overlaps that of the middle-sized magnetic particles.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: March 7, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Koichiro Wada, Motoki Matsui, Hideki Ogawa, Tomoo Kashiwa
  • Patent number: 11600423
    Abstract: The present disclosure provides a transformer including at least one magnetic core each having at least one window; one primary side winding passing through the at least one window, a wire forming the primary side winding being sequentially covered with a first solid insulating layer, a grounded shielding layer and a second solid insulating layer from inside to outside along a radial direction of the wire, the grounded shielding layer being connected to a reference ground; and at least one secondary side winding, each passing through the at least one window, the primary side winding having a first voltage with respect to the reference ground, the secondary side winding having a second voltage with respect to the reference ground, and the second voltage being greater than 50 times of the first voltage.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: March 7, 2023
    Assignee: Delta Electronics, Inc.
    Inventors: Peng Ma, Yicong Xie, Lin Lan, Weiqiang Zhang
  • Patent number: 11569018
    Abstract: A reactor includes a coil having a winding portion, and a magnetic core including a core piece having an inner core portion disposed inside the winding portion. The core piece is a compact made of a composite material that contains a magnetic powder and a resin. The reactor further includes: a first projection that is integrated with and projects from an outer peripheral face of the inner core portion, and comes into contact with an inner peripheral face of the winding portion so as to position the winding portion in a diameter direction of the winding portion, and a second projection that is integrated with and projects from the core piece at a position opposing an end face of the winding portion, and comes into contact with the end face of the winding portion so as to position the winding portion in an axial direction thereof.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: January 31, 2023
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Kazuhiro Inaba, Kouhei Yoshikawa
  • Patent number: 11538626
    Abstract: Embodiments for a multifilar inductor with at least three windings that are switchable, having a power assigned winding denoted as P1, a suppression assigned winding denoted as B, a containment assigned winding denoted as T, a switching apparatus to switch assignments between the P1, B and T windings; and a capacitor bank, wherein B suppresses the back EMF generated by a pulse power, T contains field emitted EMF generated by the pulse power, and wherein the input pulse power input is converted to a constant current output into the capacitor bank such that its time duration is extended by the combination of the inductor windings plus the capacitor bank to thereby minimize the peak inductance below the inductor's saturation point.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: December 27, 2022
    Assignee: Richard H. Sherratt and Susan B. Sherratt Revocable Trust Fund
    Inventor: Brian Elfman
  • Patent number: 11538617
    Abstract: A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: December 27, 2022
    Assignee: Intel Corporation
    Inventors: Krishna Bharath, Adel Elsherbini
  • Patent number: 11521784
    Abstract: A coil component includes a body having one surface and another surface opposing each other in one direction, an internal insulating layer embedded in the body, and a coil portion disposed on the internal insulating layer and forming at least one turn. First and second external electrodes are disposed on the one surface of the body to be spaced apart from each other, and first and second connection electrodes respectively penetrate through the body to connect the coil portion and the first and second external electrodes to each other. A support electrode extends from the coil portion to be exposed to the other surface of the body to support the coil portion and the internal insulating layer.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: December 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Jong Min Lee
  • Patent number: 11515081
    Abstract: An object of the present invention is to provide a coil component in which leakage of magnetic flux from a magnetic gap is reduced. A coil component includes: a drum-shaped core 20 having a winding core part 30 with a gap G formed therein and first and second flange parts 31 and 32; a plate-like core 40 fixed to the first and second flange parts 31 and 32; and wires W1 to W3 wound around the winding core part 30 and each having one end connected to a terminal electrode provided on the first flange part 31 and the other end connected to a terminal electrode provided on the second flange part 32. According to the present invention, the gap G formed in the winding core part 30 functions as a magnetic gap, and magnetic flux leaking from the magnetic gap is shielded by the plate-like core 40.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: November 29, 2022
    Assignee: TDK CORPORATION
    Inventors: Hideomi Takahashi, Toshifumi Komachi, Toshio Tomonari
  • Patent number: 11515079
    Abstract: One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: November 29, 2022
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Takashi Nakajima, Keiko Shiroki
  • Patent number: 11515072
    Abstract: An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: November 29, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Hsiao-Tsung Yen
  • Patent number: 11501913
    Abstract: A gatedriver circuit for controlling a power electronic switch. The circuit provides a galvanic separation and is magnetically immune. The gatedriver circuit comprises a transformer arranged with two separate cores of magnetically conductive material each forming a closed loop. A first electrical conductor has windings around a part of both cores, and a second electrical conductor also has windings around part of both cores. The two cores are positioned close to each other to allow mutual magnetic interaction. The windings of the first and second electrical conductors around the first core have the same winding direction, and the windings of the first and second electrical conductors around the second core have opposite winding direction of the windings of the first and second electrical conductors around the first core, so as to counteract electric influence induced by a common magnetic field through the closed loops of the first and second cores.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: November 15, 2022
    Assignee: VESTAS WIND SYSIEMS A/S
    Inventor: Stig Lund Pallesgaard
  • Patent number: 11501908
    Abstract: New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: November 15, 2022
    Assignee: nanoHenry, Inc.
    Inventor: Osman Ersed Akcasu
  • Patent number: 11495392
    Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ye Eun Jeong, Jin Ho Hong
  • Patent number: 11495391
    Abstract: An inductor includes a body including a plurality of insulating layers and a plurality of coil patterns are disposed on each of the plurality of insulating layers, and first and second external electrodes disposed on an external surface of the body. The plurality of coil patterns are connected to each other by coil connecting portions and both end portions thereof are electrically connected to the first and second external electrodes through coil lead portions, respectively, to form a coil. The plurality of coil patterns include coil patterns disposed on an outer portion of the body and coil patterns disposed on an inner portion of the body, the coil patterns disposed on the inner portion of the body include first coil patterns electrically connected in parallel, and at least one of the first coil patterns includes an internal side portion having a shape different from shapes of remaining coil patterns.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Jae Song, Sang Jong Lee, Su Bong Jang, Seung Hee Hong, Min Ki Jung
  • Patent number: 11495396
    Abstract: A surface mount inductor includes a coil including a winding portion and extension portions that extend from the outer circumference of the winding portion, a molded body which contains a metal magnetic powder and in which the coil is embedded, and outer terminals. The molded body is a rectangular parallelepiped. Each end portion in the longitudinal direction of the principal surface has an outer terminal connected to the extension portion. A resin coating is formed on the molded body except regions in which the outer terminals are provided, and W1 is less than W0, where the width between ridges opposite to each other in a lateral direction of the principal surface is denoted as W0 and the width of each outer terminal in the lateral direction is denoted as W1, and neither end in the width direction of each outer terminal is in contact with the ridges.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: November 8, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masato Koike
  • Patent number: 11495395
    Abstract: An inductor includes a body including a support member including a through-hole, an internal coil disposed on the support member, and an encapsulant encapsulating the support member and the internal coil; and an external electrode disposed on an external surface of the body and connected to the internal coil. The external electrode includes a conductive resin layer and a double conductive layer of a first conductive layer and a second conductive layer, disposed between the conductive resin layer and the internal coil.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Song, Hwan Soo Lee, Yoon Hee Cho, Yong Choon Park
  • Patent number: 11488762
    Abstract: A chip inductor includes a body having a coil and an insulating member on which the coil is disposed, and external electrodes disposed on external surfaces of the body. The insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member. The insulating member and the insulating layers constitute a multilayer structure. The coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively. The top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: November 1, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Gul Ryu, Mi Geum Kim