Abstract: An electronic device is provided. The electronic device includes a flexible circuit board and a conductive adhesive material. The flexible circuit board includes a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer has a top surface, a bottom surface parallel to the top surface and a first side connected between the top surface and bottom surface. The adhesive layer is disposed on the top surface of the first conductive layer. The cover layer is disposed on the adhesive layer. The conductive adhesive material is disposed on the first conductive layer. In addition, the conductive adhesive material is in contact with the first side.

Abstract: In an electrical cable of the type having an outer sheath enclosing a conductor assembly comprising a plurality of insulated conductors disposed within a binder, the binder having a crush resistance for protecting the insulated conductors, an improvement in which a strength enhancer is applied such that the binder can be removed without decreasing a crush resistance of the electrical cable.

Abstract: A printed wiring board includes an insulating substrate, a first conductor layer formed on a first surface of the substrate, a second conductor layer formed on a second surface of the substrate, and through-hole conductors formed through the substrate and connecting the first and second conductor layers. The substrate has openings formed such that each opening extends from the first to second surfaces of the substrate, and magnetic material filling the openings and forming through holes such that each through hole extends from the first to second surfaces of the substrate, the through-hole conductors are formed on sidewalls of the through holes in the magnetic material, and the magnetic material includes resin and particles including magnetic metal such that the particles include a group of particles forming the sidewalls of the through holes and that each particle in the group has a substitution plating film formed on a surface thereof.

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

Abstract: A fitting for a fiber trough. The fitting includes a bottom cable support surface and a pair of opposite side walls extending from the bottom cable support surface that define a channel. The fitting is mounted to a fiber trough so that the channel is positioned within another channel defined by the fiber trough, isolating a cable routing path defined by the fitting channel from a cable routing path defined by the trough channel.

Abstract: A flush mount electronic device includes a housing cover defining a bottom opening, a housing base forming an internal volume when positioned within the bottom opening of the housing cover, and a mounting structure. The mounting structure includes two pairs of wing-shaped members. The wing-shaped members of the first pair are positioned opposite one another and fastened to the housing base. The wing-shaped members of the second pair are positioned opposite one another and are interleaved with the wing-shaped members of the first pair. Each wing-shaped member of the second pair is partially biased into the internal volume of the housing base and includes a deflected portion defining a hole and slot aperture combination. The hole and slot aperture combination is configured to receive a screw or stud fastened to and extending from a planar mounting bracket to which the mounting structure is to be mounted.

Abstract: An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.

Abstract: An optical unit includes a movable body including an optical module, a fixed body, a support mechanism, a flexible printed circuit board, and a positioning part. A bent part of the flexible printed circuit board has a first bent portion closest to a connection part between the connection part and the positioning part along an extension direction, and a second bent portion close to the connection part next to the first bent portion between the connection part and the positioning part along the extension direction. The second bent portion is located on a reference plane or on a side different from the side where the connection part is located with respect to the reference plane.

Abstract: An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

Abstract: The present disclosure relates to a battery connection module and a battery device. The battery connection module includes a carrying tray, a plurality of busbars and a flexible circuit board. The plurality of busbars are provided to the carrying tray.

Abstract: The present disclosure is concerned with bus bars that are provided with protrusions that allow them to be brought directly or indirectly in contact with a cooling system to remove heat generated in the bus bars themselves. The disclosure further provides a method of cooling a bus bar. The method includes providing at least one bus bar with at least one protrusion, and connecting the at least one protrusion to a cooling element.

Abstract: While laying a subsea cable, an exposed cut off end of the cable is exposed to water prior to permanently sealing off this cable end. To prevent damage to the cable due to contact with the often salt water, due to for example oxidation, a temporarily watertight seal is to be applied to the cut off end. A method for applying this seal is provided which comprises applying a mouldable sealant to the exposed end wherein the sealant acts as a watertight barrier between the water and the cut off end of the cable. The sealant may comprise an intermediate layer between the cut off end and a watertight outer layer arranged to increase adhesion between the cut off end and the outer layer. This allows a broader range of outer layer materials to be used as the outer layer material does not need to adhere directly with the cable.

Abstract: An embodiment of a printed circuit board includes a first insulating layer, a metal layer disposed above the first insulating layer, a second insulating layer disposed above the metal layer, and signal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction. The metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions. In another embodiment, the open areas are replaced with metal meshes.

Abstract: Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a PCB by overlapping multiple laser drilled vias. The trenches may be filled with conductive material using electroplating process(es). Buried vias may be formed through the core layers of the PCB by mechanical drilling. The buried via may be filled with solid conductive material using a combination of electroless plating and electrolytic plating of conductive material. Various PCB structures are disclosed that implement combinations of these trenches and/or these buried vias filled with conductive material.

Abstract: An electronic device is provided. The electronic device includes a foldable housing configured to include a hinge structure, a first housing structure that has a first face that is connected to the hinge structure and is directed in a first direction, a second face that is directed in a second direction opposite to the first direction, and a first lateral member that at least partly surrounds a space between the first face and the second face, and a second housing structure that has a third face that is connected to the hinge structure and is directed in a third direction, a fourth face that is directed in a fourth direction opposite to the third direction, a second lateral member that at least partly surrounds a space between the third face and the fourth face, and that is folded about the hinge structure onto the first housing structure, a flexible display, a first magnet a second magnet and at least one electrical path.

Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.

Abstract: A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

Abstract: A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

Abstract: A display device includes a driver including flexible circuit boards connected to a display panel. The driver includes a first source circuit board, a second source circuit board, a main circuit board including a controller that generates a power source voltage and applying the power source voltage to each of the first source circuit board and the second source circuit board, and a connector connecting the first source circuit board and the second source circuit board. The connector is electrically connected to a first voltage line that is the most adjacent to the second source circuit board among the voltage lines of the first source circuit board and a second voltage line that is the most adjacent to the first source circuit board among the voltage lines of the second source circuit board.

Abstract: A cavity elongated in one direction is formed in a protective film covering the conductive pattern of the topmost conductive layer of a multilayer wiring substrate. The cavity exposes part of the conductive pattern. A first via-conductor extends downward from the conductive pattern of the topmost conductive layer at least until that of a second conductive layer. Second via-conductors extend downward from the conductive pattern of the second or third conductive layer at least until that of a conductive layer one below. As viewed from above, the first via-conductor and the cavity partially overlap each other. At least two second via-conductors are disposed to sandwich the cavity therebetween. The difference between the smallest gap between the cavity and the second via-conductor at one side and that between the cavity and the second via-conductor at the other side is smaller than the smallest gap between the cavity and the second via-conductors.