Patents Examined by Roshn K Varghese
  • Patent number: 12291822
    Abstract: The present disclosure is directed to a curb for providing electricity to one or more devices on a street or a sidewalk. The curb includes a rigid curb housing for storing at least one power source or power source connector configured to be electrically coupled to a power source. The curb additionally includes a top plate removably attached to the rigid curb housing, the top plate configured to electrically couple at least one power outlet to the at least one power source or power source connector.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: May 6, 2025
    Assignee: Terreform ONE
    Inventors: Vivian Kuan, Mitchell Joachim, Axel Kilian
  • Patent number: 12289832
    Abstract: There is provided a circuit board. The circuit board includes a signal hole array matched with a terminal array of a connector, and at least part of signal holes in the signal hole array are first signal holes (20); the first signal holes (20) are blind holes, are communicated with part of wiring layers of the circuit board, and are connected to auxiliary conductive structures (30) through auxiliary lines (03) located in auxiliary wiring layers; the auxiliary conductive structures (30) are at least communicated with the auxiliary wiring layers and a wiring layer not communicated with the first signal holes (20), and are connected to signal lead-out lines (04) located in a main wiring layer; and the signal lead-out lines (04) extend out of a region where the signal hole array is located.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: April 29, 2025
    Assignee: NANJING ZTE NEW SOFTWARE CO., LTD.
    Inventor: Li Zhao
  • Patent number: 12283720
    Abstract: Provided is a busbar capable of keeping a joint strength high at a joint between dissimilar metals. The busbar (2) joins terminals of a plurality of battery cells, the terminals each including a dissimilar metal. The busbar includes: a copper portion (2e) to be connected to a first terminal (1n) of a first battery; an aluminum portion (2f) to be connected to a second terminal (1p) of a second battery; and a joint (2x) including the copper portion bonded to the aluminum portion. The aluminum portion is placed so as not to overlap the bonding region between the first terminal and the copper portion, and has arms (2f1) extending in a direction from the second terminal to the first terminal. The joint includes the copper portion bonded to the arms, and the arms have a width such that a proximal end portion is wider than a distal end portion of the arms.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: April 22, 2025
    Assignee: Vehicle Energy Japan Inc.
    Inventors: Nobuyoshi Tanaka, Kazuaki Urano, Tatsuhiko Kawasaki
  • Patent number: 12283397
    Abstract: The present disclosure describes a grommet formed of a polymeric material and adapted for securing a cable within a cable hanger. The grommet includes a main body having a generally cylindrical profile, the main body further having a length, a thickness, and a longitudinal axis, a plurality of spokes extending radially inward from the main body at an oblique angle relative to the main body, and an annular inner wall coupled to the plurality of angled spokes and surrounding an interior cavity, wherein the annular inner wall extends the length of the main body. Other grommets and cable hanger assemblies are described herein.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: April 22, 2025
    Assignee: OUTDOOR WIRELESS NETWORKS LLC
    Inventor: Ronald A. Vaccaro
  • Patent number: 12250773
    Abstract: A wiring board includes a base material, a through hole that is formed in the base material, a magnetic member that is embedded in the through hole, and a plating film that covers end faces of the magnetic member exposed from the through hole. The magnetic member includes a conductor wire that is covered by a magnetic body. A wiring board manufacturing method includes forming a through hole in a base material, forming a magnetic member by covering a conductor wire by a magnetic body, embedding the magnetic member in the through hole, and forming a plating film that covers end faces of the magnetic member exposed from the through hole.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: March 11, 2025
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Toshiaki Aoki, Toyoaki Sakai
  • Patent number: 12246660
    Abstract: The grommet also includes an annular opposing portion that opposes a portion of the vehicle body panel surrounding the insertion hole, and is sandwiched between the vehicle body panel and a bracket fixed to the vehicle body panel. Furthermore, the grommet includes a coupling portion that couples the insertion portion and the opposing portion so as to close a gap between the insertion portion and the opposing portion. The opposing portion includes an annular sealing portion to be in intimate contact with the vehicle body panel. The coupling portion includes a plurality of pleat portions that extend along a circumferential direction of the opposing portion, and are adjacently arranged in a radial direction of the opposing portion, when viewed from an axial direction of the opposing portion.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: March 11, 2025
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Taiki Kobayashi
  • Patent number: 12232248
    Abstract: A sample holder includes a base comprising a support structure and a printed circuit board (PCB) in contact with the base. The PCB has a through hole. The PCB has a cavity in at least a part of the base below the through hole. The support structure that supports a surface of a chip and is electrically connected to the base. The support structure is disposed in the cavity. At least a part of the section supporting the chip in the support structure is not parallel to the back surface of the chip.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: February 18, 2025
    Assignee: NEC CORPORATION
    Inventors: Yoshihito Hashimoto, Tsuyoshi Yamamoto, Kohei Matsuura
  • Patent number: 12219710
    Abstract: A display apparatus includes a display panel, a printed circuit board, a first film electrically connected to the display panel and the printed circuit board, and a second film electrically connected to the display panel and the printed circuit board. The display panel includes panel pads of a first row electrically connected to the first film, panel pads of a second row electrically connected to the second film, and panel connecting lines electrically connecting the panel pads of the first row to the panel pads of the second row.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: February 4, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Wontae Kim, Jae-Han Lee
  • Patent number: 12217107
    Abstract: This document describes apparatuses that include integrated memory card ejector and sensor ports. A first described aspect of an apparatus includes a memory card connector, a housing, and a carriage. The memory card connector includes a receiver configured to receive a memory card and an ejector assembly configured to eject the memory card from the receiver. The housing includes a sidewall that includes a memory card slot and an integrated port. The integrated port defines an outside opening of the housing. The carriage includes a slide portion slidably positioned in the integrated port and is accessible through the outside opening of the housing. The carriage includes a carriage body having an outer port, a sensor port, and an acoustic chamber defined within the carriage body. The carriage includes an ejector connector configured for contacting the ejector assembly and a sensor assembly mounted on the carriage at the sensor port.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: February 4, 2025
    Assignee: Google LLC
    Inventors: Trevor Matthew Cardiff, Brandon Raphael Collins-Smoot, Cindy Xinzi Wang, Warren Zachary Jones, Jeffrey Yukio Hayashida
  • Patent number: 12207407
    Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.
    Type: Grant
    Filed: July 19, 2023
    Date of Patent: January 21, 2025
    Assignee: GOOGLE LLC
    Inventors: John Martinis, Bob Benjamin Buckley, Xiaojun Trent Huang
  • Patent number: 12195068
    Abstract: A simulated track inductor mount including a base configured to be fixed against a supporting surface and an inductor hub attached to and extending from the base. The inductor hub includes one or more surfaces defining a margin and being configured to engage with an inner surface of the simulated track inductor, and the one or more surfaces are fixed to a camming tab configured to flex to removably seat the simulated track inductor on the inductor hub.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: January 14, 2025
    Assignee: C.D.L. Electric Company, Inc.
    Inventors: Marco Antonio Ibarra, Devin Steven Sage
  • Patent number: 12191241
    Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: January 7, 2025
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
  • Patent number: 12176691
    Abstract: A reversible thermosensitive early-warning environment-friendly flame-retardant protective sleeve is provided, which includes an outer protective sleeve. A cushioning mounting block is mounted on one side of the outer protective sleeve. A flame-retardant layer is provided on a surface of the cushioning mounting block. A first splicing block and a second splicing block are mounted on an inner wall of the outer protective sleeve. Expansion blocks are mounted on surfaces of both the first splicing block and the second splicing block. A sharp block is mounted at a bottom of each of the expansion blocks. A flame-retardant device is provided at a bottom of the sharp block.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: December 24, 2024
    Assignee: Anhui Efarad Electric Power Technology Co., Ltd
    Inventors: Wenzhong Dai, Nikolai Konkodievich Zaitsev, Wenzong Xu, Youqun Wang, Mian Dai, Zhang Dai, Yujuan Wu, Chao Dai, Liang Li
  • Patent number: 12165785
    Abstract: One aspect of the present disclosure provides a grommet that can improve water sealing property. A grommet main body according to one aspect of the present disclosure includes an opposing portion that opposes a circumferential portion of an attachment hole of a vehicle body panel and an annular seal portion that is provided in the opposing portion and is brought into tight contact with the vehicle body panel. The seal portion includes an annular first lip portion that extends from the opposing portion toward the vehicle body panel and an annular second lip portion that extends from the opposing portion toward the vehicle body panel and is provided radially inward of the first lip portion. The first lip portion is inclined radially outward toward the tip end of the first lip portion, and the second lip portion is inclined radially inward toward the tip portion of the second lip portion.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: December 10, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Yusuke Ando
  • Patent number: 12150245
    Abstract: An electronic apparatus includes a window that includes a substantially planar base and an edge portion that protrudes from an edge of the base, a display panel disposed on the base of the window, and a flexible printed circuit board disposed on and electrically connected to the display panel. The flexible printed circuit board includes a neck portion in contact with the display panel, a body portion connected to the neck portion and that has an area greater than that of the neck portion, and a first slit formed in the body portion.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: November 19, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinhyuk Park, Youngmyung Lee, Jongnam Lee
  • Patent number: 12144117
    Abstract: A flexible circuit board including: a body area including a plurality of wirings; a bonding area combined with a first side of the body area; and an extension area combined with a second side of the body area opposite to the first side. The body area includes a first sub-body area and a second sub-body area located on a side of the first sub-body area close to the extension area; the plurality of wirings at least include a first wiring, a second wiring and a third wiring all extend in the first sub-body area, and the first wiring and the second wiring extend in the second sub-body area. The first sub-body area includes a multi-layer board structure, the second sub-body area includes a single-layer board structure or a double-layer board structure, and a thickness of the second sub-body area is smaller than a thickness of the first sub-body area.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: November 12, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Fan Li, Wenxiao Niu, Ji Wang, Yunhan Xiao, Hengzhen Liang
  • Patent number: 12133329
    Abstract: Provided are a printed circuit board and a method for manufacturing the same, the printed circuit board including: an insulating member; a first pad disposed in the insulating member; a plurality of first vias respectively disposed on a lower side of the first pad in the insulating member and connected to the first pad; and a second via disposed on an upper side of the first pad in the insulating member and connected to the first pad.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: October 29, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Su Min Song
  • Patent number: 12125614
    Abstract: A wiring member includes: a base member; and a plurality of wire-like transmission members fixed to the base member, wherein the plurality of wire-like transmission members are fixed to the base member along a route in which a branch wire part branches from a main wire part, the base member includes a main wire fixing part to which the main wire part is fixed and a branch wire fixing part to which a base end part in the branch wire part is fixed, the branch wire part extends to a further outer side from a tip end portion of the branch wire fixing part, and the branch wire part further includes an end portion protection part covering a part of the branch wire part extending from the tip end portion of the branch wire fixing part.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 22, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Ryusuke Kudo, Masaki Mizushita, Kenta Arai, Haruka Nakano, Tetsuya Nishimura
  • Patent number: 12119603
    Abstract: A grounding clamp for connecting a cable to an electrical ground includes first and second clamping elements, which tightly abut against one another in an assembled state so that the cable is clampable therebetween. A contact is arranged on the first clamping element to contact a conductive section of the cable in the assembled state. An opening extending through the clamping elements is configured such that a fastener is guidable therethrough and the grounding clamp is connectable to the ground using the fastener. Mutually complementary first and second locking means are also provided. The first locking means are arranged on two opposite sides of the first clamping element and the second locking means are arranged on two opposite sides of the second clamping element. In the assembled state, the locking means are engaged with one another and are arranged on both sides along the cable.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: October 15, 2024
    Assignee: MD ELEKTRONIK GMBH
    Inventors: Thomas Hofmann, Robert Kefer
  • Patent number: 12114419
    Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: October 8, 2024
    Assignee: Dell Products L.P.
    Inventors: William Andrew Smith, Mallikarjun Vasa, Bhyrav M. Mutnury