Abstract: A printed wiring board includes an insulating substrate having openings, a first conductor layer formed on a first surface of the insulating substrate, a second conductor layer formed on a second surface of the insulating substrate, magnetic material portions formed in the openings of the insulating substrate and having through holes extending from the first surface to second surface of the insulating substrate, and through-hole conductors formed on side walls of the through holes such that the through-hole conductors connect the first conductor layer and second conductor layer. The magnetic material portions include magnetic particles and resin such that the magnetic particles include particles forming the side walls and that gaps are formed between the particles and the resin, and each of the through-hole conductors includes a chemical copper plating film such that the chemical copper plating film is deposited in the gaps formed between the particles and the resin.

Abstract: A wiring board of the present disclosure comprises an insulating layer, a first conductor layer located on the surface of the insulating layer and containing any one of nickel and chromium, a metal belonging to group of the periodic table; or a metal belonging to group of the periodic table, a second conductor layer located inside the outer circumferential edge on the first conductor layer and containing copper, a third conductor layer located on the surface of the insulating layer in a state of covering the first conductor layer and the second conductor layer and containing nickel, and a fourth conductor layer located in a state of covering the third conductor layer and containing gold. The third conductor layer has an overhanging part extending outward from the outer circumferential edge of the first conductor layer, and the fourth conductor layer is located between the overhanging part and the insulating layer.

Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Abstract: A protective cover to cover an opening of an electrical box having a threaded bore on inwardly projecting protrusions. In one approach the protective cover may have a back panel and four side panels together defining an interior cavity; a flange connected to a free edge of the side panels; wherein the flange has a pair of keyhole shaped bores defining a pair of openings along a center longitudinal axis of the flange; and wherein the keyhole openings are configured to allow a head of a screw to extend from the threaded bore and through a rounded portion of the keyhole opening and to allow a threaded shaft of the screw to slide along the length of an elongated narrow portion of the keyhole opening, the narrow portion being narrower than the diameter of the screw head.

Abstract: The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

Abstract: An example apparatus includes a first printed circuit board (PCB) having a power layer, a ground layer, and a slot. The slot includes a first power electrical contact that is electrically connected to the power layer and a first ground electrical contact that is connected to the ground layer. The slot extends orthogonally or obliquely through multiple layers of the first PCB. A second PCB includes a second power electrical contact, a second ground electrical contact, and capacitors electrically connected between the second power electrical contact and the second ground electrical contact. The second PCB is configured for insertion into the slot to form an electrical connection between the first power electrical contact and the second power electrical contact and between the first ground electrical contact and the second ground electrical contact.

Abstract: In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.

Abstract: A cavity elongated in one direction is formed in a protective film covering the conductive pattern of the topmost conductive layer of a multilayer wiring substrate. The cavity exposes part of the conductive pattern. A first via-conductor extends downward from the conductive pattern of the topmost conductive layer at least until that of a second conductive layer. Second via-conductors extend downward from the conductive pattern of the second or third conductive layer at least until that of a conductive layer one below. As viewed from above, the first via-conductor and the cavity partially overlap each other. At least two second via-conductors are disposed to sandwich the cavity therebetween. The difference between the smallest gap between the cavity and the second via-conductor at one side and that between the cavity and the second via-conductor at the other side is smaller than the smallest gap between the cavity and the second via-conductors.

Abstract: A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.

Abstract: A printed circuit board includes: an insulating layer having one surface and the other surface; metal layers respectively disposed on the one surface and the other surface of the insulating layer; a through-hole penetrating through the insulating layer and the metal layers; a first plating layer disposed in a center portion of the through-hole in a thickness direction thereof; and a plug disposed in the through-hole.

Abstract: A component carrier includes a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack, and at least one stress relief opening formed in each of the at least one electrically conductive layer structure arranged in the stack on one side of the component so that a portion of the stack extending from an exterior main surface of the component carrier up to a main surface of the component on said side and including the at least one stress relief opening is free of electrically conductive material.

Abstract: Galloping motion disruptors and methods for reducing conductor galloping are provided. A galloping motion disruptor includes a first disruptor rod and a second disruptor rod. Each of the first and second disruptor rods includes a first end portion, a second end portion, and a mid-section between the first end portion and the second end portion. The first end portion includes a helical gripping section. The second end portion includes a hook section. The hook sections of the first and second disruptor rods are connectable to each other.

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

Abstract: Provided is an FPC, including a first row of gold fingers and a second row of gold fingers disposed on a same layer, and multiple first connection lines. The first row of gold fingers includes multiple first gold fingers extending in a first direction and arranged in a second direction. The second row of gold fingers includes multiple second gold fingers extending in the first direction and arranged in the second direction. The multiple first connection lines are disposed in a different layer from the second row of gold fingers, electrically connected to the multiple first gold fingers, and insulated from the multiple second gold fingers and extend to an area where the second row of gold fingers is located. The first connection line includes a first wire and a second wire. The first wire includes a first portion, a second portion and a third portion connected in sequence.

Abstract: An articulated arm assembly for motor vehicles includes first and second arm portions, an electric cable, and a cable carrying structure. The first arm portion is adapted to attach to the motor vehicle. The second arm portion rotates with respect to the first arm portion around an axis of rotation. The electric cable at least partially runs along the first and second arm portions. The cable carrying structure includes at least one first carrying portion associated with the first arm portion and at least one second carrying portion associated with the second arm portion. The first and second carrying portions are adapted such that the electric cable permanently intersects the axis of rotation at an intersection area.

Abstract: A bonded body is formed by bonding a ceramic member formed of an Al-based ceramic and a copper member formed of copper or a copper alloy, in which, in a bonding layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on a ceramic member side, and, the Al concentration is 0.15 at % or less in a thickness range of 0.5 ?m to 3 ?m from an interface of the active metal compound layer on a copper member side toward the copper member.

Abstract: A power supply device (100-1) includes: a substrate (20) on which an electric component (25) is mounted; a chassis (10) including a chassis surface (11) to be a surface facing one surface (20a) of the substrate (20); and cured insulating resin (27-1) to be placed between the one surface (20a) of the substrate (20) and the chassis surface (11) so as to be connected to the one surface (20a) and the chassis surface (11), the cured insulating resin (27-1) having a thermal conductivity between 1 W/mK and 10 W/mK inclusive.

Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

Abstract: An object is to suppress concentration of stress on electrical wires when the electrical wires are bent in the vicinity of a bracket. A bracket-equipped conductive path includes a conductive path main body that is constituted by a plurality of coated wires, a protector that surrounds the conductive path main body, and a bracket that is made of metal and includes a base portion that is embedded in the protector in such a manner that detachment of the base portion from the protector is restricted and an attachment portion that extends from the base portion. The base portion has a flat plate shape and is arranged to face the conductive path main body in a direction that is substantially parallel to a thickness direction of the base portion.