Patents Examined by Sam Heinrich
  • Patent number: 5158228
    Abstract: There is disclosed a method for arranging a plurality of line filaments above the grid electrode supported on the base plate of a conventional fluorescent displaying tube. The inventive method employs a temporary mounting plate for temporarily supporting the filaments with tension until they are completely arranged above the grid electrode. The mounting plate comprises a plurality of cutting-off lines and a pair of weld portions at opposite ends thereof. The arrangement of the filaments accomplished, the temporary mounting plate is cut along the cutting-off lines so as to remove all the other portions except the weld portions.
    Type: Grant
    Filed: January 16, 1990
    Date of Patent: October 27, 1992
    Assignee: Samsung Electron Devices Co., Ltd.
    Inventor: Namshin Park
  • Patent number: 5141145
    Abstract: A metal matrix composite is produced by forming a rapidly solidified aluminum base alloy into wire. The wire is arc sprayed onto at least one substrate having thereon a fiber reinforcing material to form a plurality of preforms. Each of the preforms has a layer of the alloy deposited thereon, and the fiber reinforcing material is present in an amount ranging from about 0.1 to 75 percent by volume thereof. The preforms are bonded together to form an engineering shape.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: August 25, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Santosh K. Das, Michael S. Zedalis, Paul S. Gilman
  • Patent number: 5106012
    Abstract: Two pieces of metal are bonded together at a surface by placing the two pieces into contact at the surface and forging the two pieces in a die which causes substantial displacement of the metal originally at the surface in a direction parallel to and outwardly from the edges of the surface. In this way, many of the defects which are potentially present at the original surface are displaced with moving metal away from the original contact between the two pieces of metal into sacrificial ribs and the remaining defects are exposed to significant strain. A portion of the displaced metal which contains many of the defects and which forms the sacrificial ribs is removed from the resulting bonded work piece as the sacrificial ribs are removed from the work piece. The result is a bond with superior properties and with a bond surface which can be located very precisely.
    Type: Grant
    Filed: July 29, 1988
    Date of Patent: April 21, 1992
    Assignee: Wyman-Gordon Company
    Inventors: John M. Hyzak, Timothy E. Howson, Wilford H. Couts, Jr., Steven H. Reichman, Hugo E. Delgado, Daniel D. Kruger, Michael E. Sauby, Sulekh C. Jain, Bruce P. Bardes, Richard G. Menzies, Swami Ganesh
  • Patent number: 5100050
    Abstract: An article of manufacture having at least a first and a second part, each part having different mechanical properties, compositions, microstructures or combinations thereof, being joined together using a forging process to yield a substantially defect-free joint region. The article in the form of a turbine disk is particularly suited for use in a gas turbine engine in which the hub or inner portion must be resistant to low cycle fatigue and have high strength, while the rim or outer portion must be resistant to stress rupture failure and creep failure.
    Type: Grant
    Filed: October 4, 1989
    Date of Patent: March 31, 1992
    Assignee: General Electric Company
    Inventors: Daniel D. Krueger, Michael E. Sauby, Sulekh C. Jain, Bruce P. Bardes
  • Patent number: 5060841
    Abstract: A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: October 29, 1991
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Yoshio Oshima, Yasushi Ishii, Hideki Hidaka, Kunihiro Tsuchiya
  • Patent number: 5054679
    Abstract: Apparatus for continuously manufacturing plastic-lined metallic pipe. The apparatus includes an extruder having an output providing a plastic sleeve and further includes a continuous roll-forming tubing mill production line. This production line includes a series of forming rolls which progressively deform a substantially flat steel strip to a generally tubular configuration as the strip move along a straight-line longitudinal path. The production line further includes an electrical resistance or high frequency welder which continuously welds the lateral edges of the moving strip to complete the pipe. The apparatus also includes a feed for the plastic sleeve into the incipient metal pipe upstream of the welder. The plastic sleeve has an outside diameter slightly smaller than the inside diameter of the metallic pipe in its as-formed condition.
    Type: Grant
    Filed: July 26, 1990
    Date of Patent: October 8, 1991
    Assignee: Allied Tube & Conduit Corporation
    Inventors: David A. Shotts, Raffaele Basile
  • Patent number: 5054682
    Abstract: In a method of joining a metal matrix composite (cermet) or ceramic tool material 1 to a metallic holder 2 by diffusion bonding through an intermediate metallic layer, the tool material 1 includes at least one carbide, nitride or boride in the matrix. In one example, the tool material includes titanium carbide and titanium nitride in the metal matrix. The intermediate metallic layer is chosen from a group consisting of nickel, titanium and tungsten. The tool holder metal 2 is a ferrous alloy. The intermediate metallic layer is placed between the tool material and the metallic holder, and heat and pressure are applied for a controlled period to diffusion bond the tool material to the metallic holder. Articles made by the method include a blank holder, a punch, a die and various wear surfaces of a continuous extrusion apparatus.
    Type: Grant
    Filed: September 6, 1989
    Date of Patent: October 8, 1991
    Assignee: CMB Foodcan plc
    Inventor: Pravin Mistry
  • Patent number: 5050790
    Abstract: A metal-made carrier body is fabricated for an exhaust gas cleaning catalyst. At least one sheet-like metal band and at least one corrugated metal band, each of said bands being made of a thin metal sheet, are superposed one over the other so as to establish contacts therebetween, thereby forming a multi-layered composite body defining a number of network-patterned gas flow passages along the central axis thereof. The composite body is dipped in an electroless plating bath capable of forming a brazing coating layer on the composite body so as to form a brazing coating layer at least in the vicinity of each contact except for the contact itself. The composite body is then subjected to a heat treatment so as to braze the contacts between the sheet-like metal band and corrugated metal band. Before dipping the composite body in the plating bath, it may optionally be enclosed in a cylindrical metal casing. The composite body and cylindrical metal casing are also brazed together at their mutual contacts.
    Type: Grant
    Filed: March 19, 1990
    Date of Patent: September 24, 1991
    Assignee: Usui Kokusai Sangyo Kabushiki Kaisha
    Inventors: Kazunori Takikawa, Yuzo Hitachi
  • Patent number: 5048744
    Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: September 17, 1991
    Assignee: International Business Machines Corporation
    Inventors: Chin-An Chang, Nicholas G. Koopman, Judith M. Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh
  • Patent number: 5044542
    Abstract: A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues. The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: September 3, 1991
    Assignee: Electrovert Ltd.
    Inventor: Carlos A. Deambrosio
  • Patent number: 5044546
    Abstract: First and second aluminum members are joined by the steps of(a) dissolving and removing completely the aluminum oxide layer from the surface of each of the first and second members to be joined and replacing each of the aluminum oxide layers with a layer consisting essentially of zinc;(b) plating at least one of the zinc layers with a non-alloy cadmium;(c) assembling and retaining together the first and second aluminum members so that the surfaces to be joined are held in contact with one another and placing the aluminum members in a vacuum; and(d) heating the members while in the vacuum thereby forming a bond between the first and second aluminum members.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: September 3, 1991
    Assignee: Hazeltine Corporation
    Inventor: Charles E. De Clerck
  • Patent number: 5038996
    Abstract: Two metallic surfaces are bonded together by coating each of the metallic surfaces with a layer of a first material and a layer of a second and different material contacting the layer of the first material. The first material and second material are chosen so that a eutectic liquid layer will form at the interface between them. The layers of the second material on each of the metallic surfaces are abutted together and then the layers are heated above the eutectic temperatures to form a localized liquid, which upon solidification results in an interconnection between the surfaces.
    Type: Grant
    Filed: July 17, 1989
    Date of Patent: August 13, 1991
    Assignee: International Business Machines Corporation
    Inventors: James R. Wilcox, Charles G. Woychik
  • Patent number: 5037024
    Abstract: A method of splicing together metal webs for use in planography with the ends thereof being butted or lapped against each other. In the metal web splicing method, the ends of the metal webs are spliced together in a butted manner, the splice portion thereof is welded, and the welded splice portion is rolled. According to the splicing method, there is left no level difference in the welded splice portion, which eliminates the possibility of the spliced metal webs being broken during the movement thereof and also has no ill effect on the coating process for the spliced metal webs.
    Type: Grant
    Filed: December 5, 1989
    Date of Patent: August 6, 1991
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Shinichiro Minato, Akio Uesugi, Tsutomu Kakei
  • Patent number: 5031822
    Abstract: A method of brazing a silicon component to a molybdenum and/or tungsten component wherein prior to brazing the surface of the molybdenum and/or tungsten component is first provided with a thin gold coating and then a coating of palladium, platinum or rhodium. This allows satisfactory brazing to be effected using conventional aluminum-based brazes at temperatures below C.
    Type: Grant
    Filed: January 30, 1990
    Date of Patent: July 16, 1991
    Assignee: Marconi Electronic Devices Limited
    Inventors: Giles Humpston, David M. Jacobson, Brian P. Cameron
  • Patent number: 5031821
    Abstract: The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.
    Type: Grant
    Filed: August 16, 1989
    Date of Patent: July 16, 1991
    Assignees: Hitachi, Ltd., Hitachi Microcomputer Engineering Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Tsuyoshi Kaneda, Susumu Okikawa, Hiroshi Mikino, Hiroshi Watanabe, Toshihiro Satou, Atsushi Onodera, Michio Tanimoto
  • Patent number: 5031817
    Abstract: An electric soldering iron includes a barrel and a head portion with a center hole being pivoted to a front end of the barrel. A piston and a piston rod are disposed in the front end of the barrel. A spring embraces the piston rod and bears against the piston. A solenoid is disposed in a rear end of the barrel. A button is disposed at a rear end of the barrel for controlling the solenoid. The piston is pushed forward by the spring when the solenoid is not actuated. A depression of the button actuates the solenoid to draw the piston rearward.
    Type: Grant
    Filed: August 13, 1990
    Date of Patent: July 16, 1991
    Inventor: Ming Hong Chen
  • Patent number: 5029748
    Abstract: Cast solder preforms, rings or donuts suitable for use in a reflow solder process to interconnect through-hole pins in an electrical connector to plated through holes in a printed circuit board are disclosed. A plurality of solder donuts are cast into an array so that the plurality of donuts are initially formed as a single unit. The donuts can be either cast onto pins in a connector or cast onto a separate carrier for subsequent insertion onto the pins in a connector.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: July 9, 1991
    Assignee: AMP Incorporated
    Inventors: John H. Lauterbach, Leon T. Ritchie
  • Patent number: 5029746
    Abstract: An ultrasonic welding device for mounting wire ends or wire loops on terminal lugs, particularly on terminal lugs or lamellas of drum-shaped commutators for rotating electrical machines, the arrangement comprises a sonotrode, an anvil against which terminal lugs abut during a welding process, and supporting surfaces provided on the anvil and on a free end of each terminal lug for taking up a sonotrode pressure and sonotrode vibrations transverse to a pressure direction. The supporting surfaces abut against one another before a start of a welding process by a relative movement of the anvil and the terminal lugs.
    Type: Grant
    Filed: February 9, 1990
    Date of Patent: July 9, 1991
    Assignee: Robert Bosch GmbH
    Inventors: Arno Altpeter, Carsten Bauer
  • Patent number: 5027996
    Abstract: A method of manufacturing a hollow shaft having internal swellings of revolution is disclosed. Hollow shaft sections, each having at least one internal swelling of revolution, are consecutively formed in a substantially continuous cold extrusion process using a single punch 7. Tubular blank 1a is extruded through narrowed orifice 14 of die 8. Tip 10 of punch 7 is inserted into axial passage 11 of blank 1a and shoulder 13 of punch 7 engages a rear end of blank 1a to push blank 1a partially through narrowed orifice 14 and thereby compress the front end of blank 1a between tip 10 and narrowed orifice 14. Punch 7 is then removed from die 8 and another tubular blank 12 is introduced in die 8 with its front end in abutment with the rear end of deformed blank 1b.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: July 2, 1991
    Assignee: Floquet Monopole
    Inventors: Michel A. Fefeu, Gerard Perrin
  • Patent number: 5027997
    Abstract: An improved silicon chip metallization system for use in attaching silicon chips to substrates. The improvement comprises providing a layer of titanium between the silicon chip backside and the layers of chrome and gold which are conventionally used as the backside metallization. The layer of titanium adjacent to the silicon chip backside reduces silicon dioxide formation during chip attachment procedures carried out in non-vacuum environments.
    Type: Grant
    Filed: April 5, 1990
    Date of Patent: July 2, 1991
    Assignee: Hughes Aircraft Company
    Inventors: Joseph J. Bendik, Stuart C. Billette