Abstract: A method for manufacturing a sculpture having simulated hair includes forming a rigid body of an animal figure having a plurality of small holes, cutting a plurality of lengths of metallic link chain to the desired length of hair strands for the body, soldering at least some of the chain links together with a metallic matrix having a lower melting temperature than the metal of the chain links, orienting the bonded chain links to style the chain into a preferred hair pattern, finishing the styled hair pattern chain with decorative metal plating or patina, and bonding the styled and plated chain hair pattern into the holes of the animal body.

Abstract: A method of making a composite tubular product which comprises inner and outer tubes of different chemical compositions and in which the stresses produced at the interface between the outer and inner tubes during cooling from a diffusion bonding temperature are such that the interface between the two tubes remains intact during such cooling. The method comprises the step of inserting into the interior of the inner tube a core of a material whose transformation and/or contraction characteristics are sufficient to counteract at least to a substantial amount interfacial stresses which arise during cooling because of differences in the transformation and contraction properties of different materials from which the inner and outer tubes of the composite product are formed.

Abstract: Apparatus for remotely placing and welding a patch over an underwater breach in the hull of a ship. The apparatus is lowered into position over the side of the ship by a winch and cable, then held against the ship's hull by electromagnets. The apparatus has a generally streamlined frame containing a chamber within which a patch plate is carried. Wheels are disposed on the frame to permit the frame to be driven along the hull and positioned over the breach. The patch plate is then moved into position against the hull and welded into place. Operation of the apparatus is viewed through video cameras and is remotely controlled by an operator on board the ship.

Abstract: A wire bonding method in which a bonding wire is pressed against bonding surfaces by a bonding tool so that bonding is performed by applying ultrasonic vibrations to the bonding tool which makes scrubbing actions to smoothen the bonding surfaces while the bonding is being performed.

Abstract: A method of forming solder bumps includes the steps of applying a thick layer of solder resist to a substrate. The resist is selectively removed to provide wells at solder pads on the substrate. The solder paste is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps on the pads. A socket for a solder bumped member is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist is applied to the substrate. The resist is selectively removed to provide wells at the metalized pads of the substrate. Solder paste is then deposited in the wells. The solder bumped member can then be positioned so that the solder bumps are located in the wells. The solder paste is reflowed to bond to the solder bumps and the metalized pads. The solder paste can be selected to have a lower melting temperature than the solder bumps.

Abstract: A desoldering vat has a central, elongated solder pot which is filled to the brim with solder in use, so that depending component contact pins inserted through and soldered to a circuit board can be immersed in the meniscus of the liquid solder mass to melt the solder and permit removal of the component from the circuit board. A moat is defined around the central solder pot to catch the inevitable spills of solder and permit its replacement into the vat, and multiple adjustable brace bars defined on opposite sides of the central vat are used to support the hands or the circuit board itself while the unit is being used.

Abstract: A method is described of diffusion bonding and superplastic forming components made of aluminium or an aluminium alloy to form a composite formed article. The method involves applying stopping-off material to selected areas of the components to prevent diffusion bonding in those areas, the stopping-off material being applied by plasma spraying.

Abstract: The thermal expansion of parts to be welded to each other is reduced in that one or more of the parts are modified to include expansion slots in the welding area. This limits thermal expansion to the remaining small areas only which are allowed to expand within the slots. Total expansion of such welded parts is thus reduced after solidfication. In most applications, such slots do not effect the total design of the welded parts. If required, such slots can be sealed after welding.

Abstract: A flip-chip solder bonding structure having first and second components. Each component is made from a substrate haivng on one surface an array of solderable pads. Selected pads have solder bumps deposited thereon with each surface having a plurality of alignment marks formed thereon whereby when the components are positioned face to face, the arrays register with one another to enable a solder bond to be formed. The respective pluralities of alignment marks may be inspected to assess their relative positions in order to determine the accuracy of the solder bond. The solderable pads and the alignment marks on each surface are formed during the same processing stage as metallized regions. The solder bumps are applied to the metallized regions forming the alignment marks.

Abstract: A method and apparatus for applying variable pressure to selected areas of a bonding assembly jig to shape a face plate to conform to the contours of contoured heads and hold the face plate in place for welding comprises two inverted U-shaped support frames including two spaced apart elongated vertical support members each having a bottom end and a top end, an elongated horizontal top beam extending between and connecting the top ends of the vertical support members, a track extending between and adjustably fastened to the horizontal top beam, and at least one hydraulic press slidably suspended from the track and adapted to apply pressure to a bonding assembly jig. The support frames are provided with wheels and one of the support frames has vertical support members spaced at a distance less that of the other support frame. This arrangement allows the tracks of each frame to be positioned proximate to each other above a bonding assembly jig.

Abstract: A bonding method including the steps of dividing a substrate into a plurality of regions along its length, storing substrate feeding data and bonding pattern data for the respective regions into a data memory, feeding the substrate underneath a bonding tool in accordance with the substrate feeding data, and then successively performing bonding for the respective regions in accordance with the bonding pattern data.

Abstract: Inert non-magnetic metals are adhesively bonded to surfaces of metal oxides, for example ferrites, by means of a water vapor-hydrogen atmosphere. Reduction of the metal oxide only takes place at the interface of the inert metal and the metal oxide, after which the metal formed is partly dissolved in the inert metal.

Abstract: A method of lining an exhaust manifold is disclosed, comprising the steps of applying a thin layer of a heat-resistant compound to the interior of an exhaust manifold and bonding the compound to the manifold. The manifold may be in two or more sections when the compound is applied and the sections may subsequently be joined together to form the manifold. The compound may contain zirconium and/or may be a ceramic material.

Abstract: A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.

Abstract: In a method for producing workpieces of metal having profiled outer and/or inner contours which have any desired shape contours and are or can be profiled in thickness, the workpiece (R) is to be divided in terms of construction into simple part-profiles (4, 7, 13, 14), which are then produced by precision blanking and then fitted together and joined to one another by lamination to form the finished part.

Abstract: The soldering apparatus using at least one resistance heated stirrup electrode that is place onto soldering locations on a printed circuit board includes a pivotable suspension of the stirrup electrode. The pivotable suspension is such that a dislocated rotational axis of pivotable suspension lies in a plane of the working surface and extends perpendicular to a long side of the rectangular working surface of electrode and at the center thereof. The working surface of the stirrup electrode thus achieves reliable contact with parts to be soldered. Embodiments having two or four soldering stirrups, each individually pivotly suspended, are also possible.

Abstract: The present invention discloses an improved method and apparatus for dissipating heat from printed circuit boards and electronic devices mounted thereon. Printed circuit boards are provided with apertures therethrough for receiving thermal conductor pads. The thermal conductor pads may be secured in the apertures through the use of glue or by means of an interference fit. Glue may also be deposited on top of the thermal conductor pad to secure an electronic device thereto. The glue is cured in a manner that limits its thickness to a minimum value. The electronic device may be further secured to the printed circuit board by wave soldering. The opposite end of the thermal conductor pad contacts the cold plate.

Abstract: A method lining a component of a vehicle which may contact exhaust gases is disclosed, including the steps of applying a thin layer of a heat-resistant compound to an inner surface of the component to form a liner therein and bonding the liner to the surface. The manifold may be in two or more sections when the compound is applied and the sections may subsequently be joined together to form the component. The compound may contain zirconium and/or may be a ceramic material.

Abstract: A wire bonder for bonding semiconductor packages that require a deep access to bond between the semiconductor device bond pads and the bonding area on the package to avoid interference between the bond head and the package pins, the bonder including a bellows actuated wire clamp, a reverse venturi to remove slack from the bonding wire, and a lengthened bonding tool.

Abstract: A face-down connecting an electrode formed on a semiconductor device surface and an electrode on a circuit substrate using an insulating resin, is arranged such that after positioning the electrode of the circuit substrate and the electrode of the semiconductor device, they are pressed from the side of semiconductor device or circuit substrate, and, in this state, a light-stiffening insulating resin is applied to the side surface of the semiconductor device, and then the light-stiffening insulating resin is stiffened. Since the light-stiffening insulating resin is applied and injected between the semiconductor device and circuit substrate with the electrodes of the semiconductor device and circuit substrate pressed together, the light-stiffening insulating resin intervenes between the two electrodes, and the problems of failure of the electrical contact between the two electrodes or a high electrical connection resistance will be avoided.