Patents Examined by Samuel M. Heinrich
  • Patent number: 10324285
    Abstract: In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device 1 which focuses a laser beam on the inside of a transparent medium 60, aberration of a laser beam is corrected so that a focal point of the laser beam is positioned within a range of aberration occurring inside the medium. This aberration range is not less than n×d and not more than n×d+?s from an incidence plane of the medium 60, provided that the refractive index of the medium 60 is defined as n, a depth from an incidence plane of the medium 60 to the focus of the lens 50 is defined as d, and aberration caused by the medium 60 is defined as ?s.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 18, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Haruyasu Ito, Naoya Matsumoto, Takashi Inoue
  • Patent number: 10322468
    Abstract: An apparatus for processing a micro-component by using laser which defines a hole by using laser irradiated to a surface of an object to be processed, the apparatus includes a laser irradiation part irradiating the laser, an optical axis horizontal movement part horizontally moving an optical axis of the laser irradiated from the laser irradiation part, an optical axis angle adjustment part adjusting an angle of the optical axis of the laser horizontally moved by the optical axis horizontal movement part, a reflection part reflecting the laser of which the angle of the optical axis is adjusted by the optical axis angle adjustment part, and a light collecting lens collecting the laser reflected by the reflection part on the surface of the object to be processed.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: June 18, 2019
    Assignee: T.FRIENDS CO., LTD.
    Inventor: Su Young Yoo
  • Patent number: 10319598
    Abstract: A method and an apparatus for thinning a wafer are provided. The method for thinning a wafer, according to one embodiment of the present invention, comprises the steps of: irradiating a line beam focused at a specific depth of the wafer; scanning the wafer by using the line beam so as to form an interface at the specific depth of the wafer; and cleaving the wafer on which the interface is formed into a pattern wafer and a dummy wafer.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: June 11, 2019
    Assignee: HANWHA PRECISION MACHINERY CO., LTD.
    Inventor: Sung Wook Kim
  • Patent number: 10314152
    Abstract: An apparatus for generating extreme ultraviolet light used with a laser apparatus and connected to an external device so as to supply the extreme ultraviolet light thereto includes a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element provided inside the chamber; an etching gas introduction unit provided on the chamber through which an etching gas passes; and at least one temperature control mechanism for controlling a temperature of the at least one optical element.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: June 4, 2019
    Assignee: Gigaphoton Inc.
    Inventors: Shinji Nagai, Tamotsu Abe, Hitoshi Nagano, Osamu Wakabayashi
  • Patent number: 10300556
    Abstract: A controller performs gap control such that a Z-axis position of a tip of a cutting head of the machine is not below a preset lower limit position while keeping the distance between the tip of the cutting head and a workpiece constant. The numerical controller calculates a substantial lower limit position based on a detected state of the workpiece and the preset lower limit position. If the Z-axis position of the tip of the cutting head is below the calculated substantial lower limit position, it is compensated so as not to be below the substantial lower limit position.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 28, 2019
    Assignee: FANUC CORPORATION
    Inventors: Masaki Oka, Takeshi Mochida
  • Patent number: 10297385
    Abstract: The invention relates to a for a targeted shaping of the magnetic field of a single permanent magnet or an arrangement of a plurality of permanent magnets, wherein magnetic material from selected locations of the single permanent magnet or at least one of said permanent magnets of the arrangement is removed by means of at least one of the following removal procedures for shaping the magnetic field: laser ablation using laser radiation, high-pressure waterblasting using high-pressure water jets and mechanical ablation using a non-magnetic tool.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: May 21, 2019
    Assignee: Rheinisch-Westfällsche Technische Hochschule (RWTH) Aachen
    Inventors: Ernesto Pablo Danieli, Bernhard Blumich, Wasif Zia, Holger Leonards
  • Patent number: 10286486
    Abstract: A welding apparatus radiates a laser beam to a welding position in a state where a focal spot of the laser beam is in a near-focusing state. The welding apparatus radiates the laser beam to the welding position in a state where the focal spot of the laser beam is in a far-focusing state. The welding apparatus radiates the laser beam to the welding position in the state where the focal spot of the laser beam is in the far-focusing state. The welding apparatus radiates the laser beam to the welding position in a state where the focal spot of the laser beam is in the near-focusing state.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: May 14, 2019
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, TOYOTA SHATAI KABUSHIKI KAISHA
    Inventors: Tomoyuki Tanoue, Jyunichiro Makino, Keiichiro Inagaki
  • Patent number: 10286491
    Abstract: A laser welding method of the present disclosure has a first step and a second step. In the first step, a first workpiece and a second workpiece are overlaid in a first machining region. In the second step, the first workpiece and the second workpiece are irradiated with laser beam in the first machining region while the laser beam is moved in a spiral path. Moreover, in the second step, the first workpiece and the second workpiece are melted by irradiation of the laser beam to form a liquid phase portion. Furthermore, in the second step, the laser beam is moved so that the liquid phase portion is not irradiated with the laser beam again.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: May 14, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tatsuyuki Nakagawa, Yasushi Mukai, Atsuhiro Kawamoto, Junji Fujiwara, Noriyuki Matsuoka
  • Patent number: 10286483
    Abstract: A method of forming an internally-arranged laser-beam weld from within a composite structure. The method includes arranging a welding apparatus within an internal passage of the composite structure, and emitting a laser beam from the welding apparatus to form the internally-arranged laser-beam weld between layers of the composite structure.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: May 14, 2019
    Assignee: HYPERLOOP TECHNOLOGIES, INC.
    Inventors: Israel Stol, Kristen Hammer, Daniel Shafrir, Michael Gaunt, Thomas Ronacher, Kyle Cothern
  • Patent number: 10265800
    Abstract: According to one embodiment, a welding apparatus includes an irradiation device and a nozzle device. The irradiation device irradiates a target with laser light while scanning the laser light. The nozzle device includes an ejection port and ejects inert gas to an irradiation position of the laser light on the target through the ejection port located at a forward side in a scanning direction of the laser light relative to the irradiation position.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: April 23, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshitaka Kawada, Naotada Okada, Susumu Yahagi
  • Patent number: 10259074
    Abstract: A welding mode determination device that determines a welding mode when laser beam welding is performed includes an obtaining unit that obtains an image in an infrared wavelength region and an image in a short wavelength region of visible light from a laser irradiation area and its vicinity. An extraction unit extracts a light emitting image from the image in the infrared wavelength region and a light emitting image from the image in the short wavelength region of visible light. A determination unit compares the light emitting image of the image in the infrared wavelength region and the light emitting image of the image in the short wavelength region of visible light and determines the welding mode when the laser beam welding is performed based on a comparison result.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: April 16, 2019
    Assignee: PRIMEARTH EV ENERGY CO., LTD.
    Inventor: Shigeki Saito
  • Patent number: 10259079
    Abstract: Systems and methods are disclosed herein for laser kerfed veneers. A laser may be used to produce kerf lines in thin veneers. The settings of the laser may be adjusted to adjust the width and depth of the kerf lines. The width and depth of the kerf lines may be selected in order to provide sufficient strength to the veneer while decreasing telegraphing.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 16, 2019
    Assignee: GOODRICH CORPORATION
    Inventors: Christopher L. Chapman, Sayan Rakshit, Tommy R. Hawkins, Satya Swaroop Panda
  • Patent number: 10256005
    Abstract: Embodiments of the present disclosure relate to thermal processing of substrates. More specifically, embodiments described herein relate to flash on spike annealing processes and apparatus suitable for performing such processes. In one embodiment, a thermal processing apparatus may include a lamp radiation source, a laser source, and a reflector plate disposed between the lamp radiation source and the laser source. One or more apertures may be formed in the reflector plate and the laser source may be positioned adjacent to the reflector plate such that a laser beam emitted from the laser source propagates through the one or more apertures. In one embodiment, the reflector plate may be substantially circular and the one or more apertures may approximate a sector of the reflector plate.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: April 9, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Joseph M. Ranish, Shashank Sharma, Diwakar N. Kedlaya, Aaron Muir Hunter
  • Patent number: 10245678
    Abstract: A management method of a powder supply head in which supplied cladding metal is stabilized, and a method and apparatus for forming an erosion shield. The powder supply head has a double tube that supplies the cladding metal to a cladding portion and includes an inner tube that sprays a cladding metal used for cladding by welding and an outer tube that concentrically overlaps the inner tube and sprays a shielding air. The method including: spraying the cladding metal from the powder supply head to a test region; measuring a width of the cladding metal sprayed onto the test region; in a case where the measured width of the cladding metal is an allowance or smaller, determining that the powder supply head is usable, and in a case where the measured width of the cladding metal is greater than the allowance, determining that the powder supply head is unusable.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: April 2, 2019
    Assignee: MITSUBISHI HITACHI POPOWER SYSTEM, LTD.
    Inventors: Takehisa Okuda, Motonari Machida, Yasuo Matsunami
  • Patent number: 10239161
    Abstract: Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: March 26, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Wonwoo Choi, Seungho Yoon, Sangbong Lee
  • Patent number: 10232467
    Abstract: The invention relates machines and methods for separative machining of workpieces. The machines include a first movement unit to move the workpiece in a first direction, a second movement unit including a machining head to emit the processing beam, and a third movement unit. The second movement unit moves the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap. One or more of at least a part of the first workpiece support unit, at least a part of the second workpiece support unit and at least one support element are configured to move with respect to one another in the first direction to vary the width of the gap.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: March 19, 2019
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Magnus Deiss, Simon Ockenfuss, Frank Schmauder, Dennis Wolf
  • Patent number: 10232470
    Abstract: Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 19, 2019
    Assignee: LSP Technologies, Inc.
    Inventors: David Sokol, Jeff Dulaney, Allan Clauer
  • Patent number: 10226838
    Abstract: An embodiment is to provide a laser light irradiation apparatus and a laser peening treatment method, by which even a member to be processed, existing in a narrow portion, can be easily processed by laser peening. The laser light irradiation apparatus 1 according to the embodiment includes: an optical fiber 2 through which laser light is guided; a condensing lens 3 that is placed on one end of the optical fiber, the condensing lens and the optical fiber defining the light path of the laser light; a guide 4 that retains the optical fiber; and a movement mechanism 5 for changing the position of the optical fiber, wherein the light path of the laser light guided through the optical fiber is emitted at an angle changed to more than 0° and less than 90° with respect to the central axis of the optical fiber by the condensing lens.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: March 12, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kota Nomura, Itaru Chida, Katsunori Shiihara, Hiroya Ichikawa
  • Patent number: 10226841
    Abstract: An aperture plate for a welding apparatus includes a body defining an aperture. The body of the aperture plate includes a first end and a second end that is opposite the first end. In addition, the body includes a first surface intersecting the first and second ends. Moreover, the body includes a second surface formed opposite the first surface. The second surface is nonparallel to the first surface.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: March 12, 2019
    Assignee: GM Global Technology Operations LLC
    Inventors: Hui-ping Wang, Michael G. Poss, Aaron D. Cox, Blair E. Carlson, Thomas A. Perry
  • Patent number: 10220475
    Abstract: The invention relates to machines and methods for separative machining of a plate-shaped workpiece by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit configured to move a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least two support slides configured to move in the gap in the second direction mutually independent of one another.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: March 5, 2019
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Frank Schmauder, Simon Ockenfuss, Peter Epperlein, Magnus Deiss, Dennis Wolf, Johannes Krampfert