Patents Examined by Samuel M. Heinrich
  • Patent number: 11229980
    Abstract: The invention relates to machines and methods for separative machining of plate-shaped workpieces by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit including a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least one support slide arranged to move in the second direction within the gap and including a support slide bearing face.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: January 25, 2022
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Magnus Deiss, Peter Epperlein, Simon Ockenfuss, Frank Schmauder, Dennis Wolf
  • Patent number: 10807200
    Abstract: A laser cutting tool with protective enclosure assembly for manipulating a workpiece on a movable platen includes a frame, a top protection assembly, a middle protection shield, a bottom protection assembly and a laser torch head. The top protection assembly, middle protection assembly, and bottom protection assembly are removably mounted to the frame such that they form a cavity enclosing only substantially the laser torch head.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: October 20, 2020
    Inventors: Bryan J. Timmerman, Cody Umberger
  • Patent number: 10546765
    Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: January 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung Whan Oh, Yeon Woo Choi, Won Yup Ko, Min Seok Moon, Won Ki Park, Seung Hwan Lee, Yong Won Choi
  • Patent number: 10525547
    Abstract: A method is provided for forming a three-dimensional article through successively depositing individual layers of powder material that are fused together so as to form the article, the method comprising the steps of: providing at least one electron beam source emitting an electron beam for at least one of heating or fusing the powder material, where the electron beam source comprises a cathode, an anode, and a Wehnelt cup between the cathode and anode; providing a guard ring between the Wehnelt cup and the anode and in close proximity to the Wehnelt cup, where the guard ring is having an aperture which is larger than an aperture of the Wehnelt cup; protecting the cathode and/or the Wehnelt cup against vacuum arc discharge energy currents when forming the three-dimensional article by providing the guard ring with a higher negative potential than the Wehnelt cup and cathode.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: January 7, 2020
    Assignee: Arcam AB
    Inventor: Christian Ekberg
  • Patent number: 10520674
    Abstract: An optical fiber cleaving apparatus that employs a microchip laser system for cleaving an optical fiber is disclosed. The microchip laser system is operably arranged relative to an optical system that receives an initial laser beam and forms a focused laser beam that includes a focus spot. The focus spot is directed to the outer surface of the optical fiber to create an optical damage zone that includes at least one micro-crack necessary for performing the cleaving operation. Methods of aligning the optical fiber to the focus spot and performing the cleaving operation using the cleaving apparatus are also disclosed.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: December 31, 2019
    Assignee: Corning Optical Communications LLC
    Inventor: Qi Wu
  • Patent number: 10507546
    Abstract: Apparatuses include a laser cutter positioned within an enclosure that is capable of cutting printed sheets; however, this cutting produces debris made up of airborne dust of the sheet material and marking material. An air duct is capable of drawing an air stream of air and the debris out of the enclosure. A dispenser is positioned within the air duct where the air duct connects to the enclosure. The dispenser is capable of dispensing a dry powder of calcium carbonate into the air stream. The dry powder attaches to the debris. The combination of the dry powder and the debris forms waste, and a filter device (that is connected to the air duct) filters the waste. The filter device is capable of separating the air from the waste, to collect the waste and release the air free of the waste to areas outside the filter device.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: December 17, 2019
    Assignee: Xerox Corporation
    Inventor: Mark A. Adiletta
  • Patent number: 10488671
    Abstract: If an optical path length of an optical system is reduced and a length of a laser light on an irradiation surface is increased, there occurs curvature of field which is a phenomenon that a convergent position deviates depending on an incident angle or incident position of a laser light with respect to a lens. To avoid this phenomenon, an optical element having a negative power such as a concave lens or a concave cylindrical lens is inserted to regulate the optical path length of the laser light and a convergent position is made coincident with a irradiation surface to form an image on the irradiation surface.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: November 26, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Koichiro Tanaka, Tomoaki Moriwaka
  • Patent number: 10456868
    Abstract: In some embodiments, a processing system and a method for operating the processing system may include at least one processing area, one control area, one input area and optionally one receiving area and/or one presentation area. Via an input and/or display element, a user can enter a text and/or graphics in an operating software installed therein, which can be passed to a control software running in the control area. Into the input area and/or the control area a database is integrated, in which the data of the blanks or workpieces to be processed are stored.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: October 29, 2019
    Assignee: Trodat GmbH
    Inventors: Jean-Philippe Pinot, St├ęphanie Verrier
  • Patent number: 10457035
    Abstract: Described is a nozzle assembly that includes a body component defining a center axis. The nozzle assembly also includes an energy beam channel and substantially collinear with the center axis. The energy beam channel has an inlet portion and an outlet portion oriented to pass an energy beam therethrough. At least one side-feeding powder tube extends through the body component at an angle with respect to the center axis. The side-feeding powder tube discharges a powdered material into a focus point of the energy beam. The angle is selected to generate a powder concentration spot diameter that is about twice a beam focus point diameter of the energy beam focus point.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: October 29, 2019
    Assignee: General Electric Company
    Inventors: Kemal Mehmet Coskun, Robert Trent Hullender
  • Patent number: 10449644
    Abstract: A laser-transmitting machining tool is disclosed. The laser-transmitting machining tool has a plurality of faces including an entrance face, a rake face, a flank face connected to the rake face, a rake side face extending between the entrance face and the rake face, and a flank side face extending between the entrance face and the flank face. The connection of the rake face to the flank face defines a cutting edge. The rake face extends away from the rake side face to define a rake angle. The entrance face is configured to receive and refract a laser beam to the rake face, the flank face, and the cutting edge for causing the laser beam to refract into and heat the workpiece at a compression region extending proximate at least the rake face and a tensile region extending proximate the flank face. A system for machining a workpiece is disclosed. A method for machining a workpiece is also disclosed.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: October 22, 2019
    Assignee: Micro-LAM, Inc.
    Inventors: Deepak V M Ravindra, Sai Kumar Kode
  • Patent number: 10442032
    Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: October 15, 2019
    Inventors: Saneyuki Goya, Kenji Muta, Toshiya Watanabe, Takashi Ishide
  • Patent number: 10414000
    Abstract: A laser welding apparatus according to the present invention includes a diffractive optical element, an incident-point changing unit, and a controller. The diffractive optical element includes a first region where there is formed a diffraction grating that radiates a radiated beam having a first distribution profile of a power density that is different from a distribution profile of a power density of the incident beam. The diffractive optical element further includes a second region that has a surface profile different from a surface profile of the first region, and radiates a radiated beam having a second distribution profile of the power density that is different from the first distribution profile of the power density. The controller carries out a joining control to move at least one point in the incident point across a boundary between the first region and the second region during the emission of the laser beam.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: September 17, 2019
    Inventor: Akira Tsukui
  • Patent number: 10350704
    Abstract: The object of the present invention is to achieve the combination processing that accelerates the processing speed while keeping the accuracy of finishing. In the combination processing consisting combination of stationary processing and synchronization processing, the processing of the section in the rows in an processing area is performed from a first end to a second end of a row, and then from the second end to the first end of the next row so that the processing is performed from side to side. The stationary processing is performed in sections having relatively low processing densities and the synchronization processing is performed in the other sections than the sections for the stationary processing.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 16, 2019
    Assignee: Via Mechanics, Ltd.
    Inventors: Haruaki Otsuki, Kyosuke Suzuki, Satoshi Fukushima
  • Patent number: 10350691
    Abstract: A laser brazing system including a torch body, a wire feed tip, a laser processing head, and a cooling collar. The torch body includes nozzle, mounting, and cooling sections. The nozzle section has a nozzle wall and a feed wire conduit. The cooling section has a cooling barrel, a coolant supply connection, and a coolant return connection. The wire feed tip has a feed wire outlet and is connected to one end of the torch body. The laser processing head directs laser light toward the feed wire outlet. The cooling collar is disposed on the nozzle section and includes a collar body and a coolant conduit. The collar body has a through-bore that receives the nozzle wall. The coolant conduit has an end portion attached to the collar body and a leg portion that transports coolant to and from the end portion.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: July 16, 2019
    Assignee: FCA US LLC
    Inventors: David R Williamson, Patrick Rota
  • Patent number: 10343235
    Abstract: A laser welding method of the present invention is a laser welding method for irradiating with a laser beam a groove portion 6 formed along a circumferential direction by butting axial end portions of cylindrical bodies 5a, 5b together to weld the groove portion, the method comprising: a welding process S2 of irradiating the groove portion 6 with the laser beam over the entire circumference to weld the groove portion; and a strain correction process S4 of irradiating the groove portion 6 with the laser beam over the entire circumference, the laser beam having a heat input amount smaller than a heat input amount per unit area of the laser beam emitted in the welding process S2.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: July 9, 2019
    Inventors: Keisuke Kamitani, Shuho Tsubota, Takafumi Aoyama, Yasuyuki Fujiya
  • Patent number: 10335902
    Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: July 2, 2019
    Assignee: Corning Incorporated
    Inventors: Dana Craig Bookbinder, Stephan Lvovich Logunov, Albert Roth Nieber, Garrett Andrew Piech, Pushkar Tandon, Sergio Tsuda
  • Patent number: 10337273
    Abstract: There are provided high power laser systems for performing decommissioning of structures in land based boreholes, and wells, offshore, and other remote and hazardous locations, and using those system to perform decommissioning operations. In particular embodiments the laser system is a Class I system and reduces emission of materials created during laser cutting operations. The laser systems can include lifting and removal equipment for removing laser sectioned material.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: July 2, 2019
    Assignee: Foro Energy, Inc.
    Inventors: Brian O. Faircloth, Daryl Grubb, Scott A. Marshall, Mark S. Zediker, Kenneth L. Havlinek
  • Patent number: 10328530
    Abstract: Systems and methods according to one or more embodiments are provided for a flexible and local laser shroud that conforms to a contoured work surface and confines laser light energy from a laser end effector to the work surface. In one example, a system includes a laser end effector coupled to a robotic arm to provide laser light energy to a work surface. The system also includes a shroud coupled to the end of the robotic arm and extending to the work surface. The system further includes, as part of the shroud, a flexible laser light seal to conform to the work surface to substantially prevent the laser light energy from passing between the shroud and the work surface as the laser end effector travels along the work surface.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: June 25, 2019
    Inventors: Scott E. Krajca, Cooper A. Wessells
  • Patent number: 10328529
    Abstract: Employing laser scanning directions (20) that are oblique to and against a predominant gas flow direction (25) equalize the quality and waviness characteristics of orthogonal scribe lines (26) made by the laser scans. Positioning and sequence of multiple scan passes to form a feature wider than the width of a scribe line (26) can be controlled to enhance quality and waviness characteristics of the edges of the feature.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: June 25, 2019
    Inventors: Daragh Finn, Robert A. Ferguson
  • Patent number: 10328520
    Abstract: A side trimming apparatus including a cutting unit which is installed on at least one side of a steel plate being transferred and trims a side of the steel plate by mechanical cutting and a laser processing unit which is installed in front of the cutting unit and emits a laser beam to a portion of the steel plate to be cut to form a groove at the portion to be cut or preheat the portion to be cut, and a side trimming method using the same are provided.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: June 25, 2019
    Assignee: POSCO
    Inventors: Choong Soo Lim, Hyeong Jun Huh, Sung Joon Kwak, Sang Ho Park