Abstract: In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device 1 which focuses a laser beam on the inside of a transparent medium 60, aberration of a laser beam is corrected so that a focal point of the laser beam is positioned within a range of aberration occurring inside the medium. This aberration range is not less than n×d and not more than n×d+?s from an incidence plane of the medium 60, provided that the refractive index of the medium 60 is defined as n, a depth from an incidence plane of the medium 60 to the focus of the lens 50 is defined as d, and aberration caused by the medium 60 is defined as ?s.

Abstract: An apparatus for processing a micro-component by using laser which defines a hole by using laser irradiated to a surface of an object to be processed, the apparatus includes a laser irradiation part irradiating the laser, an optical axis horizontal movement part horizontally moving an optical axis of the laser irradiated from the laser irradiation part, an optical axis angle adjustment part adjusting an angle of the optical axis of the laser horizontally moved by the optical axis horizontal movement part, a reflection part reflecting the laser of which the angle of the optical axis is adjusted by the optical axis angle adjustment part, and a light collecting lens collecting the laser reflected by the reflection part on the surface of the object to be processed.

Abstract: A method and an apparatus for thinning a wafer are provided. The method for thinning a wafer, according to one embodiment of the present invention, comprises the steps of: irradiating a line beam focused at a specific depth of the wafer; scanning the wafer by using the line beam so as to form an interface at the specific depth of the wafer; and cleaving the wafer on which the interface is formed into a pattern wafer and a dummy wafer.

Abstract: An apparatus for generating extreme ultraviolet light used with a laser apparatus and connected to an external device so as to supply the extreme ultraviolet light thereto includes a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element provided inside the chamber; an etching gas introduction unit provided on the chamber through which an etching gas passes; and at least one temperature control mechanism for controlling a temperature of the at least one optical element.

Abstract: A controller performs gap control such that a Z-axis position of a tip of a cutting head of the machine is not below a preset lower limit position while keeping the distance between the tip of the cutting head and a workpiece constant. The numerical controller calculates a substantial lower limit position based on a detected state of the workpiece and the preset lower limit position. If the Z-axis position of the tip of the cutting head is below the calculated substantial lower limit position, it is compensated so as not to be below the substantial lower limit position.

Abstract: The invention relates to a for a targeted shaping of the magnetic field of a single permanent magnet or an arrangement of a plurality of permanent magnets, wherein magnetic material from selected locations of the single permanent magnet or at least one of said permanent magnets of the arrangement is removed by means of at least one of the following removal procedures for shaping the magnetic field: laser ablation using laser radiation, high-pressure waterblasting using high-pressure water jets and mechanical ablation using a non-magnetic tool.

Abstract: A laser welding method of the present disclosure has a first step and a second step. In the first step, a first workpiece and a second workpiece are overlaid in a first machining region. In the second step, the first workpiece and the second workpiece are irradiated with laser beam in the first machining region while the laser beam is moved in a spiral path. Moreover, in the second step, the first workpiece and the second workpiece are melted by irradiation of the laser beam to form a liquid phase portion. Furthermore, in the second step, the laser beam is moved so that the liquid phase portion is not irradiated with the laser beam again.

Abstract: A welding apparatus radiates a laser beam to a welding position in a state where a focal spot of the laser beam is in a near-focusing state. The welding apparatus radiates the laser beam to the welding position in a state where the focal spot of the laser beam is in a far-focusing state. The welding apparatus radiates the laser beam to the welding position in the state where the focal spot of the laser beam is in the far-focusing state. The welding apparatus radiates the laser beam to the welding position in a state where the focal spot of the laser beam is in the near-focusing state.

Abstract: A method of forming an internally-arranged laser-beam weld from within a composite structure. The method includes arranging a welding apparatus within an internal passage of the composite structure, and emitting a laser beam from the welding apparatus to form the internally-arranged laser-beam weld between layers of the composite structure.

Abstract: According to one embodiment, a welding apparatus includes an irradiation device and a nozzle device. The irradiation device irradiates a target with laser light while scanning the laser light. The nozzle device includes an ejection port and ejects inert gas to an irradiation position of the laser light on the target through the ejection port located at a forward side in a scanning direction of the laser light relative to the irradiation position.

Abstract: A welding mode determination device that determines a welding mode when laser beam welding is performed includes an obtaining unit that obtains an image in an infrared wavelength region and an image in a short wavelength region of visible light from a laser irradiation area and its vicinity. An extraction unit extracts a light emitting image from the image in the infrared wavelength region and a light emitting image from the image in the short wavelength region of visible light. A determination unit compares the light emitting image of the image in the infrared wavelength region and the light emitting image of the image in the short wavelength region of visible light and determines the welding mode when the laser beam welding is performed based on a comparison result.

Abstract: Systems and methods are disclosed herein for laser kerfed veneers. A laser may be used to produce kerf lines in thin veneers. The settings of the laser may be adjusted to adjust the width and depth of the kerf lines. The width and depth of the kerf lines may be selected in order to provide sufficient strength to the veneer while decreasing telegraphing.

Abstract: Embodiments of the present disclosure relate to thermal processing of substrates. More specifically, embodiments described herein relate to flash on spike annealing processes and apparatus suitable for performing such processes. In one embodiment, a thermal processing apparatus may include a lamp radiation source, a laser source, and a reflector plate disposed between the lamp radiation source and the laser source. One or more apertures may be formed in the reflector plate and the laser source may be positioned adjacent to the reflector plate such that a laser beam emitted from the laser source propagates through the one or more apertures. In one embodiment, the reflector plate may be substantially circular and the one or more apertures may approximate a sector of the reflector plate.

Abstract: A management method of a powder supply head in which supplied cladding metal is stabilized, and a method and apparatus for forming an erosion shield. The powder supply head has a double tube that supplies the cladding metal to a cladding portion and includes an inner tube that sprays a cladding metal used for cladding by welding and an outer tube that concentrically overlaps the inner tube and sprays a shielding air. The method including: spraying the cladding metal from the powder supply head to a test region; measuring a width of the cladding metal sprayed onto the test region; in a case where the measured width of the cladding metal is an allowance or smaller, determining that the powder supply head is usable, and in a case where the measured width of the cladding metal is greater than the allowance, determining that the powder supply head is unusable.

Abstract: Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.

Abstract: Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.

Abstract: The invention relates machines and methods for separative machining of workpieces. The machines include a first movement unit to move the workpiece in a first direction, a second movement unit including a machining head to emit the processing beam, and a third movement unit. The second movement unit moves the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap. One or more of at least a part of the first workpiece support unit, at least a part of the second workpiece support unit and at least one support element are configured to move with respect to one another in the first direction to vary the width of the gap.

Abstract: An embodiment is to provide a laser light irradiation apparatus and a laser peening treatment method, by which even a member to be processed, existing in a narrow portion, can be easily processed by laser peening. The laser light irradiation apparatus 1 according to the embodiment includes: an optical fiber 2 through which laser light is guided; a condensing lens 3 that is placed on one end of the optical fiber, the condensing lens and the optical fiber defining the light path of the laser light; a guide 4 that retains the optical fiber; and a movement mechanism 5 for changing the position of the optical fiber, wherein the light path of the laser light guided through the optical fiber is emitted at an angle changed to more than 0° and less than 90° with respect to the central axis of the optical fiber by the condensing lens.

Abstract: An aperture plate for a welding apparatus includes a body defining an aperture. The body of the aperture plate includes a first end and a second end that is opposite the first end. In addition, the body includes a first surface intersecting the first and second ends. Moreover, the body includes a second surface formed opposite the first surface. The second surface is nonparallel to the first surface.

Abstract: The invention relates to machines and methods for separative machining of a plate-shaped workpiece by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit configured to move a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least two support slides configured to move in the gap in the second direction mutually independent of one another.