Abstract: A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).

Abstract: A semiconductor heating apparatus, in which, when measuring the electrical properties of multiple chips formed on a large size wafer, only one or a several chips are heated uniformly, and the other chips are on standby at a low temperature. The semiconductor heating apparatus includes a heating part for mounting and heating the workpiece, a support part which supports the heating part, and a cooling module which contacts the support part. A plurality of heating parts and supporting parts are joined together. The workpiece mounting surfaces of the plurality of heating parts are preferably constructed in the same plane. In addition, there is preferably a thermal insulating material distributed underneath the support part. The heating part is preferably a ceramic heater.

Abstract: A graphite heater and method of forming a graphite heater comprising a graphite body configured to form an electrical heating circuit for at least one heating zone through the graphite encapsulated in a continuous overcoat layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof, wherein prior to being configured to form the electrical heating circuit path, the graphite body is coated with a layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof.

Abstract: A jewelry cleaning device which emits a jet of steam under manually operable control means for the cleansing of various types of small items including jewelry, coins, trinkets, or the like. The jewelry cleaning device of the present invention is lightweight and relatively compact in size thus enabling its use on virtually any conventional tabletop and is easily stored when not in use. The steam generator is powered by conventional electrical power and is controlled by means of a thermostat to maintain the water/steam mixture at a predetermined temperature while in operation. Safety mechanisms include a pressure relief valve to automatically expel steam from the generator when the internal pressure thereof exceeds a predetermined level and a thermal fuse configured in a series connection with the heating element of the steam generator.

Abstract: A substrate heating apparatus is provided, including a base group including a plurality of bases, which are arranged substantially into a plate with a gap interposed between the bases, and which form a substrate mounting surface. A resistance heating element provided for at least one of the bases.

Abstract: A heater is provided including a plate having a heating surface for heating an object to be heated and a resistance heater element provided in the plate. This resistance heater element includes a continuous wiring pattern including a plurality of flexures and a thermal uniform pattern part which improves thermal uniformity. The continuous wiring pattern includes a plurality of folding parts as the flexures. A first distance between the wirings in a first region of the wiring pattern other than a second region proximate the folding parts is substantially constant, and a second distance between the wirings in the second region is greater than the first distance.

Abstract: A volatizer has a case that deforms to interrupt electrical current flow through an internal heating element.

Abstract: A vapor deposition source including a crucible configured to hold a quantity of molten constituent material and at least one nozzle to pass vapor evaporated from the molten constituent material out of the crucible.

Abstract: A substrate heating device is provided, including a ceramic base plate having a heating surface on which a substrate is placed, resistance heating elements buried in the ceramic base plate corresponding to a plurality of zones into which the heating surface is divided, terminals respectively connected to the resistance heating elements, and lead wires respectively connected to the terminals and wired on an outer surface of the ceramic base plate other than the heating surface.

Abstract: An electric radiant hotplate includes a base of electrically insulating material and a peripheral crown extending along the outer rim of the base and projecting upwards. A strip of resistive material is inserted in the base and is formed by a sequence of planar lengths and curved lengths connected to respective planar appendices that are inserted in the insulating base. The appendices can be connected to the planar lengths by respective peduncles applied on to the same side edge of the flat strip of resistive material. The appendices can also be either coplanar or not coplanar to the planar lengths and include a first portion connected to the respective planar length of the strip, and at least a second planar portion that is not coplanar with the first portion and is joined to the first portion via a rectilinear border, the first portions being applied on a same side edge of the flat strip of resistive material.

Abstract: A device warns that a surface is temperature excessive. A light guide receiving light from a light source sufficiently distant from the surface to avoid becoming dangerously hot or cold is oriented so that the light guide is in the path of the light beam and transmits the light beam through the light guide to a point outside the light guide. The light source is controlled by a controller. A predetermined warning symbol typically outside the light guide is illuminated when the surface is dangerously temperature excessive because a sensor connected to the controller ascertains and transmits the surface temperature to the controller controlling the light source and an observer sees that the surface is temperature excessive. In certain embodiments, the light guide is flexible and/or its second end movable. The symbol can illuminate a border to warn against entry into an area in which the surface is located.

Abstract: An electric heating assembly includes a cooking plate (4) having a lower surface (6) relative to which is supported an electric heater (10) and an upper surface (8) adapted to receive a cooking utensil (12) on a heating zone (14) overlying the electric heater. The electric heater incorporates an electric heating element (22) and a temperature-responsive device (32) adapted to monitor temperature of the cooking utensil through the cooking plate at a predetermined region (34) of the overlying heating zone. The predetermined region is provided with visual identification (44) on the upper surface of the cooking plate for location of the cooking utensil at least partially over the visual identification.

Abstract: A heater plate manufactured by receiving a sheath heater within a groove portion formed in a base member made of aluminum or aluminum alloy, placing a joint member made of aluminum or aluminum alloy into said groove portion so as to fix said sheath heater in the groove portion, and press-forging said base member and said joint member to be metal-bonded with said sheath heater fixed in place therebetween, wherein a cross section of said joint member comprises a rectangle, and a width of said rectangle is same as or a little larger than a width of a cross section of the groove portion.

Abstract: A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on the heating plate, the control mode for heater modules for heating the heating plate on power supply module is switched from a PID control by a regulating part in a controller of the apparatus to a MV control by a fixed-pattern output part in the controller. Next, at a predetermined timing since the substrate has been mounted on the heating plate, the MV control is switched to the PID control. Consequently, it becomes possible to quickly restore a reduce temperature of the heating plate prior to the mounting of substrate on the heating plate and also possible to quickly stabilize a so-raised temperature of the heating plate, accomplishing a heating process with high accuracy and shirt time.

Abstract: The present invention is directed to a device for releasing a controlled amount of a volatile substance into an environment while isolating the non-released amount of such a substance from the environment. The device includes a housing having an interior region, a volatile substance cartridge associated with the housing, wherein the cartridge can be replaced, or, alternatively, refilled with a desired fluid. A mechanism is provided for releasing a pre-determined amount of fluid from the housing, which is activated, as desired, by a user of the device.

Abstract: Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part 1a for controlled heating of a wafer placed on its top face, and block part 3a provided to be shiftable relative to said heater part, for varying heat capacity in total with heater part 1a by abutting on or separating from the reverse surface of heater part 1a. By having the heat capacity of block part 3a be 20% or more of the total heat capacity of heater part 1a and block part 3a, the heater cooling speed can be made 10° C./min or more.

Abstract: A sealed line structure equipped with a heater block for a process chamber for use in manufacturing a semiconductor device is provided. The structure includes a housing member, a movement prevention member is constructed of a lock nut, a clamp ring and an elastic unit, and a power line or a thermocouple line is sealed by the configuration of the housing member, the movement prevention member, a cover member, and a connector member.

Abstract: Disclosed herein is a device for heating a scented candle so as to release scent therefrom in the absence of an open flame. The device includes a housing for retaining the candle. The housing is fabricated from a material having a low thermal conductivity. The device further includes an electrical heater in thermal communication with the housing. The heater warms the candle, and the low thermal conductivity housing aids in retaining heat in the candle thereby causing scent to be released therefrom.

Abstract: A radiant electric heater includes at least first (7) and second (11) adjacent heating zones. The first heating zone (7) includes a first heating element portion (5) and the second heating zone includes a second heating element portion (9). An electrical terminal (19) is provided at a periphery of the heater for connecting the first and second heating element portions to a source of electrical energy. The heating element portions (5, 9) are integral with conjoined ends connected to a first electrical connector (21), with one free end connected to a second electrical (23) connector, and with another free end connected to a third electrical connector (25). The first, second and third electrical connectors include means for connecting to the heating element portions in such a way that the heating element portions are not deflected from their intended path to any substantial extent.

Abstract: A ceramic heater is provided including a ceramic sintered body and a heat resistor embedded in the substrate, wherein a change in the temperature uniformity on the heating face is reduced. The heat resistor contains a metal comprising one or more metal elements selected from the group consisting of Group IVa, Group Va and Group VIa elements of the Periodic Table and a carbide of the metal. A ratio (Ic/Im) of a total strength (Ic) of main peak of the metal carbide to a total strength (Im) of main peak strength of the metal is not larger than 0.2. Alternatively, the ratio (Rb?Ra)/Ra is not larger than 30 percent, where “Ra” is the resistance of the heat resistor before sintering and “Rb” is the resistance of the heat resistor after sintering.