Patents Examined by Sean Pryor
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Patent number: 6173632Abstract: Apparatus for cutting single or multiple semiconductor packages from a multilayer substrate wherein the semiconductor packages are partially encapsulated by an elastomer sealant layer disposed on a polymer film layer of the substrate. The apparatus includes upper and lower die assemblies mounted for movement relative to each other on a support base. The upper die assembly includes an actuator and a die block supporting plural sets of cutter blades arranged in patterns to cut rectangular shaped semiconductor packages out of the substrate in a single cutting operation at a single station. The lower die assembly includes plural punch members movable relative to a die block, which includes a support surface for supporting the substrate in a predetermined position as determined by spaced apart locator pins on the lower die assembly registerable with corresponding locator holes in a carrier frame for the substrate.Type: GrantFiled: November 23, 1998Date of Patent: January 16, 2001Assignee: Semiconductor Technologies & Instruments, Inc.Inventor: Tan Huek Choy
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Patent number: 6173633Abstract: A variable length rotary cutting system for cutting sheet material in various desired cut lengths, including a knife roll and an anvil roll between which the sheet material is passed for cutting. A drive system drives the knife roll at varying speeds during a cycle of rotation and includes a drive gear and an offset gear mounted in an off-center mounting so as to be rotated at varying speeds by the drive gear. The rotation of the offset gear is transmitted to the knife roll so as to cause the knife roll to rotate at varying speeds about a cycle of rotation to enable the knife roll to cut varying lengths of the sheet material.Type: GrantFiled: April 9, 1999Date of Patent: January 16, 2001Inventor: James McLaughlin
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Patent number: 6164174Abstract: The invention involves a method and apparatus for automatic portioning of objects. More specifically, the invention utilizes both weighing and imaging data in order to calculate an estimated weight distribution of objects being processed. One or more weighing units, which weigh one or more parts of the objects, are installed before and/or after a cutting unit to obtain the weighing data. A computer system controls cutting based on the imaging data and the weighing data.Type: GrantFiled: February 13, 1998Date of Patent: December 26, 2000Assignee: H. F. Marel, Ltd.Inventors: Arni Sigurdsson, Arni G. Sigurdsson, Helgi Hjalmarsson, Hordur Arnarson
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Patent number: 6164881Abstract: In order to process a solid processed object with a simple construction, and to process a solid and flat work while effectively collecting particulate scraps, in a machine tool for processing work in which a working table on which the work is mounted and a spindle in which a cutter is installed move relatively to each other, a bellow which telescopes freely is provided, one open end of which connects to the spindle head so as to surround the spindle, and the other open end of which connects to a working table in such a manner as to surround the work.Type: GrantFiled: March 3, 1998Date of Patent: December 26, 2000Assignee: Toko, Inc.Inventor: Yoshitaka Shono
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Patent number: 6161460Abstract: The present invention relates to a shearing system. The shearing system includes a die assembly having linear bearings and guide rails for guiding movement of the upper die shoe. Gas springs return the die shoe to the open position.Type: GrantFiled: February 9, 1999Date of Patent: December 19, 2000Assignee: Littell International, Inc.Inventors: Kenneth C. Johnson, Christopher A. Zurek
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Patent number: 6155247Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: March 17, 1999Date of Patent: December 5, 2000Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6148710Abstract: A slitter-and-hole-punch and quick change adapter combination fits a bag machine or the like for punching holes and slits in a web of film material. A hole punch and a slitter blade are unitarily formed on a base member. Left and right resilient arms extend from distal to proximal, and have free ends that project proximally of the base member. The quick adapter can be an extruded block with a T-channel formed on a lower side with a passage or gap to accommodate the hole punch and the slitter blade. The T-channel has inwardly directed flanges that create side recesses to accommodate the resilient arms of the slitter-and-hole-punch. The side recesses have cooperating hollows to receive detents of the associated resilient arm. The slitter-and-hole-punch can be slid in and out of the T-slot, and when slid in, the detents on the resilient arms keep it in position. The slitter-and-hole-punch can be changed out in a few seconds by hand. The slitter-and-hole-punch units can be color coded, e.g., for gap size.Type: GrantFiled: July 12, 1999Date of Patent: November 21, 2000Assignee: Pearl Technologies, Inc.Inventor: Earl T. Pottorff
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Patent number: 6148702Abstract: A method of cutting food products into uniform thickness slices using a rotary cutting wheel fitted with radially extending, circumferentially spaced, tensioned and forwardly pitched bevel sharpened cutter blades rotating in a cutter plane and extending between a central hub and an annular rim and wherein the blades produce a first velocity of advancement of unsliced food product across the cutting plane for each revolution of the cutting wheel and a given slice thickness during slicing of food product advanced through the cutting plane. The method includes fitting an appropriate number of blades to the rotary cutting wheel to produce the given slice thickness of food products at the operation rotational velocity of the cutting wheel and rotating the cutting wheel at an operational rotational velocity to produce the first velocity of advancement of unsliced food products through the cutting plane of the cutting wheel.Type: GrantFiled: April 19, 1999Date of Patent: November 21, 2000Assignee: Urschel Laboratories IncorporatedInventor: Brent L. Bucks
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Patent number: 6142046Abstract: A knife projection sensing system for cutting machines having a rotatable surface adapted to retain a plurality of cutting knives. The system employs a plurality of sensors mountable to the cutting machine to be stationary with respect to the rotatable surface. The sensors generate a signal capable of indicating the position of each cutting knife as the knives rotate past the sensors. A microprocessor in communication with the sensors analyzes the signal generated to determine the projection of each knife from a reference surface and to determine if the projection of at least one of the plurality of cutting knives deviates outside preset desirable limits. The projection status of the knives is communicated to an operator by a light display or paper printout. The system can be used to ensure that knives are correctly installed in the cutting machine and to monitor knife position during normal operation. The system can also be used to determine when knives need changing for sharpening.Type: GrantFiled: August 6, 1996Date of Patent: November 7, 2000Assignee: CAE Machinery Ltd.Inventors: Cameron Dean Mierau, James Gary Irwin
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Patent number: 6141876Abstract: A soil pipe cutting device comprising a pair of pivotally interconnected arm members having jaw ends and actuator ends and a flexible, non-extendable cutter chain adjustably mounted between the jaw ends to circumscribe a pipe to be cut is provided with a screw-type actuating mechanism for displacing the jaw ends in the direction to tension the cutter chain to sever a pipe, and with a handle removably and adjustably mounted on the actuator end of one of the arms for transporting the cutter and for supporting and manipulating the cutter during a pipe cutting operation.Type: GrantFiled: May 4, 1998Date of Patent: November 7, 2000Assignee: Emerson Electric Co.Inventor: James E. Hamm
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Patent number: 6138364Abstract: A hand-held reciprocating power tool, such as a reciprocating saw, wherein the angle of the reciprocation motion axis with reference to the longitudinal axis of the power tool motor housing is adjustable. Within a motor housing there is a motor driving a motor shaft which rotates on a motor shaft axis generally along the longitudinal axis. A nosepiece includes a nosepiece base portion fixed to the motor housing, and a nosepiece movable portion rotably mounted to the nosepiece base portion. The nosepiece moveable portion can be positionally adjusted relative to the nosepiece base portion over an angle of at least 180.degree. by rotation on a nosepiece axis which is perpendicular to the motor shaft axis. A reciprocating element is supported by the nosepiece moveable portion.Type: GrantFiled: November 6, 1998Date of Patent: October 31, 2000Inventor: Jeffrey F. Schmitz
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Patent number: 6125733Abstract: A foam sponge cutting machine with vertical blade strap, including a blade strap rack, a machine body and a blade rotating set. The blade rotating set is disposed on the guide rails of the upper and lower transverse beams of the blade strap rack, whereby the blade strap clamped by the blade rotating set can be kept vertical and moved left and right. The machine body is disposed with a working bench for linearly back and forth moving a work piece placed thereon. By means of numeral controlling method, the positions of the work piece and the blade strap on a plane can be adjusted so as to cut the foam sponge by various irregular or curved lines.Type: GrantFiled: January 13, 1999Date of Patent: October 3, 2000Inventor: Ber-Fong Hwang
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Patent number: 6119675Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: April 29, 1998Date of Patent: September 19, 2000Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6119566Abstract: A gauge plate assembly for a food slicer includes a first plate including a food product contacting side and an attachment side. The attachment side has a plurality of fixed mount studs extending therefrom in an established arrangement, the mount studs attached to the first plate in a non-through manner. A support plate includes a mount side which faces the attachment side of the first plate and has a plurality of stud receiving openings in a mirror image of the established arrangement of the plurality of mount studs for alignment therewith. The attachment side of the first plate is positioned adjacent the mount side of the support plate with the plurality of mount studs inserted within the plurality of stud receiving openings. The studs are secured within the stud receiving openings in a press fit engagement in order to hold the two plate together. This arrangement provides an assembled gauge plate which does not require protruding fasteners to be machined or sealed and otherwise reduces assembly costs.Type: GrantFiled: February 5, 1999Date of Patent: September 19, 2000Assignee: Premark FEG L.L.C.Inventors: Gongpu Yan, Ellis Gale Short
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Patent number: 6116131Abstract: In an apparatus for shearing multi-walled workpieces, such as metal framing studs, a base support defines a blade gap therebetween, and a guillotine-like blade is slidably received within the gap for shearing the workpieces. A pair of first supports are each slidably mounted on a respective base support. A pair of second supports are also each slidably mounted on the base support, and are spaced apart from and face the first supports to thereby define an adjustable-width channel therebetween. Each of the supports defines a blade-like edge for engaging an elongated, multi-walled workpiece, such as a framing stud, which is received within the channel, and the first and second support surfaces are each moved into contact with a respective wall of the workpiece to support the workpiece. The supports can be oriented relative to one another such that the axis of the channel, and a longitudinal axis of the workpiece received within the channel can be oriented at a desired angle relative to the blade.Type: GrantFiled: December 23, 1997Date of Patent: September 12, 2000Assignee: Shear, L.L.C.Inventor: Wayne C. Fasske
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Patent number: 6112418Abstract: Safety shears which include two arms connected by a pin, each arm including a cutting blade and a handle, wherein at least one of the handles includes a weakened portion such that in operation that handle will break before either cutting blade.Type: GrantFiled: April 29, 1998Date of Patent: September 5, 2000Assignee: Plato Products, Inc.Inventor: William H. Strater
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Patent number: 6105255Abstract: A folding knife with a blade having a bottom end edge and a handle grip portion. The blade is pivotally mounted at one end of the handle grip portion. The handle grip portion has a hollow slot. The folding knife includes a leaf spring with first and second ends and a protruding member. The first end of the leaf spring is connected to the handle grip portion and the leaf spring substantially extends along a length of the slot and the second end of the leaf spring is configured to abut against the bottom end edge of the blade and lock the blade firmly in place when the blade is fully extended out of the handle grip portion. The device includes a steel ball positioned on the protruding member and a cover plate having a through bore. The cover plate is mounted on the handle grip portion securing the steel ball between the protruding member and outer edges of the through bore.Type: GrantFiled: April 22, 1999Date of Patent: August 22, 2000Assignee: Kantas Products Co., Ltd.Inventor: Yang-Fu Cheng
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Patent number: 6105262Abstract: A knife and a reversible blade are described. A handle provides a blade mount for an elongated blade having opposed longitudinally overlapping first and second cutting edges. Handle mounting surfaces are provided on the blade, interchangeably engageable with the blade mount to enable selective attachment of the blade to the handle with either first or second cutting edges thereof exposed in an operational position.Type: GrantFiled: March 31, 1998Date of Patent: August 22, 2000Inventor: Thomas A. Rickard
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Patent number: 6102267Abstract: An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.Type: GrantFiled: December 10, 1998Date of Patent: August 15, 2000Assignee: Lucent Technologies, Inc.Inventors: Joseph Michael Freund, William Andrew Gault, George John Przybylek, Dennis Mark Romero, John William Stayt, Jr.
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Patent number: 6098515Abstract: An improved rotary trimmer having a blade biasing member is shown and described. The biasing member biases the blade in an inoperative position in which the blade is retracted inside a housing when not in use. A manual actuating means is used to overcome the bias provided by the biasing member and to move the blade into an operative position in which at least the cutting edge of the blade projects from the housing.Type: GrantFiled: December 11, 1997Date of Patent: August 8, 2000Assignee: Hunt Holdings, Inc.Inventor: Phillip B. Daley, Jr.