Abstract: A light emitting element includes: a substrate; a mesa portion formed on the substrate and including an active layer, a first semiconductor layer, and a second semiconductor layer; a metal layer including a first metal part disposed on a top surface of the mesa portion and connected to the second semiconductor layer and a second metal part formed integrally with the first metal part and extending along a side surface of the mesa portion; an insulating layer formed on the side surface; and a resin layer formed on the insulating layer. The first metal part includes an opening region formed with a light passage opening and a connection region for external connection. The second metal part is formed on the side surface via the insulating layer and the resin layer and overlaps the active layer when viewed in a direction perpendicular to a thickness direction of the substrate.

Abstract: A circuit for sensing radiation with high sensitivity is disclosed. The circuit comprises a first transistor configurable to reset a voltage-level at a circuit node to a voltage reference. The circuit also comprises measurement circuitry configured to measure the voltage-level at the circuit node, and at least one photodiode configured to vary the voltage-level at the circuit node in response to radiation incident upon the photodiode during an integration period. The circuit also comprises processing circuitry configured to control the first transistor to reset the voltage-level at the circuit node and to subsequently configure the measurement circuitry to measure the voltage-level at a start and at an end of the integration period.

Abstract: Described herein are techniques that improve the collection and readout of charge carriers in an integrated circuit. Some aspects of the present disclosure relate to integrated circuits having pixels with a plurality of charge storage regions. Some aspects of the present disclosure relate to integrated circuits configured to substantially simultaneously collect and read out charge carriers, at least in part. Some aspects of the present disclosure relate to integrated circuits having a plurality of pixels configured to transfer charge carriers between charge storage regions within each pixel substantially at the same time. Some aspects of the present disclosure relate to integrated circuits having three or more sequentially coupled charge storage regions. Some aspects of the present disclosure relate to integrated circuits capable of increased charge transfer rates.

Abstract: A sensing system includes a light emission control unit that controls light emission of a light source by using a light emission pattern determined in advance, a pixel array unit in which pixels that detect a change in a received light amount as an event and generate an event signal indicating presence or absence of detection of the event are two-dimensionally arranged, and a signal corrector that performs correction of the event signal on the basis of the light emission pattern.

Abstract: A bias circuit (100) of an avalanche photodiode, APD, comprising: a voltage conversion module (110) connected to the APD, wherein the voltage conversion module (110) is configured to convert an input supply voltage (Vin) to a bias voltage for the APD; an error amplifier (120) connected to the voltage conversion module (110) for implementing a feedback control; a voltage feedback loop (130) configured to provide the error amplifier (120) a first analog signal related to the bias voltage; and a current feedback loop (140) configured to provide the error amplifier (120) a second analog signal related to the APD current; wherein the error amplifier (120) is configured to control the voltage conversion module (110) based on the first and the second analog signals.

Abstract: Systems and methods for pointing photovoltaic arrays for optimal power generation. One or more methods among a plurality of methods for pointing an array may be used by a spacecraft control system to point the array. Example methods to use to point the photovoltaic array relate to analyzing current output, analyzing image data, and analyzing computational knowledge of reflective bodies or light sources. The spacecraft may be further controlled to reduce shadow by re-orienting, receiving light reflected off spacecraft, and orienting a photovoltaic array relative to incoming light sources based on topographic properties of the array such as cell grooves.

Abstract: A high voltage-driven system includes a high voltage optical transformer and a high voltage driven device, where the high voltage optical transformer is located in close proximity to the high voltage driven device. A high voltage connection between the high voltage optical transformer and the high voltage driven device may be shorter than a low voltage connection between the high voltage optical transformer and a low voltage power source used to control the transformer.

Abstract: An electronic device is provided with a display and a light sensor that receives light that passes through the display. The display includes features that increase the amount of light that passes through the display. The features may be translucency enhancement features that allow light to pass directly through the display onto a light sensor mounted behind the display or may include a light-guiding layer that guides light through the display onto a light sensor mounted along an edge of the display. The translucency enhancement features may be formed in a reflector layer or an electrode layer for the display. The translucency enhancement features may include microperforations in a reflector layer of the display, a light-filtering reflector layer of the display, or a reflector layer of the display that passes a portion of the light and reflects an additional portion of the light.

Abstract: An aligner system includes a motor, a rotating device, a control device, and a sensor. The motor generates a rotational drive force. The rotating device 11 is rotated by the rotational drive force generated by the motor, while supporting a wafer. The control device controls rotation of the rotating device, and performs a process of setting a rotational phase of the wafer to a predetermined value. The sensor emits a plurality of light beams traveling in different directions toward an edge of the wafer, and receives the light beams to detect a defect in the edge of the wafer.

Abstract: The present invention is directed to lidar systems and methods thereof. In a specific embodiment, the present invention provides a lidar system that includes a SPAD sensor includes n SPAD pixel rows. Based on the location of a target object on the SPAD sensor, m rows of n SPAD pixels row are selected based at least on the histograms generated using the n SPAD pixel rows. There are other embodiments as well.

Abstract: Methods and apparatus wavelength discrimination in a LiDAR system. An example embodiment, includes illuminating a field of view (FOV) with transmitted light having different wavelengths at different regions in the FOV, focusing incoming light with a lens of the LiDAR system, and diffracting the focused light from the lens with a diffraction optical element to generate signals having the different wavelengths to respective regions of a detector array, wherein each pixel position in the array corresponds to one of the different wavelengths and to a spatial location in the FOV. The data from the pixel array can be processed to discriminate any of the incoming light not transmitted by the LiDAR system.

Abstract: The present disclosure relates to systems, methods, and vehicles that facilitate a light detection and ranging (LIDAR or lidar) system that may take advantage of “dead angles” where the lidar system is oriented toward support structure or another “uninteresting” feature. In such scenarios, light pulses may be redirected toward more-interesting features in the environment. An example system includes a lidar system configured to emit light pulses into an environment of the system so as to provide information indicative of objects within a default field of view. The system also includes a reflective surface optically coupled to the lidar system. The reflective surface is configured to reflect at least a portion of the emitted light pulses so as to provide an extended field of view. The lidar system is further configured to provide information indicative of objects within the extended field of view.

Abstract: An imaging system including a sensor wafer and a logic wafer. The sensor wafer includes a plurality of pixels arranged in rows and columns, the plurality of pixels arranged in rows and columns and including at least a first pixel and a second pixel positioned in a first row included in the rows. The sensor wafer includes a first transfer control line associated with the first row, the first transfer control line coupled to both a first transfer gate of the first pixel and a second transfer gate of the second pixel. The logic wafer includes a first storage capacitor associated with the first pixel and a second storage capacitor associated with the second pixel, a first storage control line coupled to a first storage gate associated with the first pixel and a second storage control line coupled to a second storage gate associated with the second pixel.

Abstract: A microscopy system and method of focusing the same are disclosed herein. The microscopy system may include an objective, and imaging device, an illumination source, an epi-illumination module, and a controller. The imaging device is configured to capture a single image of a specimen positioned on a stage of the microscopy system. The illumination source is configured to illuminate the specimen positioned on the stage. The epi-illumination module includes a focusing mechanism in a first primary optical path of a light generated by the illumination source. The focusing mechanism is tilted in relation to a plane perpendicular to the first primary optical path. The controller is in communication with the illumination source. The controller is configured to focus the microscopy system based on a pattern produced by the focusing mechanism on the single image captured by the imaging device.

Abstract: The present disclosure relates to an integrated chip including a substrate. A photodetector is arranged within the substrate. A trench isolation structure extends into the substrate on opposite sides of the photodetector. The trench isolation structure separates the photodetector from neighboring photodetectors. A first passivation layer is between a sidewall of the substrate and a sidewall of the trench isolation structure. The first passivation layer includes hydrogenated amorphous silicon.

Abstract: An apparatus comprises an array of vertical-cavity surface-emitting lasers. Each of the vertical-cavity surface-emitting lasers is configured to be a source of light. The apparatus also comprises an optical arrangement configured to receive light from a plurality of the vertical-cavity surface-emitting lasers and to output a plurality of light beams.

Abstract: A support device may include a body that includes a surface. The surface may be configured to physically engage with at least a first surface section of a torque tube. In addition, at least a second surface section of the torque tube may be configured to engage with a surface of an attachment structure. The body and the attachment structure may together define an aperture configured to receive the torque tube.

Abstract: A mounting system configured to support a component relative to a mounting surface of a vehicle includes a mounting bracket including a mounting portion configured to be coupled to the mounting surface of the vehicle. The mounting bracket defining a component receptacle configured to support the component. The mounting bracket comprises a first plastic material. The mounting system also includes a seal coupled to the mounting bracket and configured to engage the mounting surface of the vehicle to inhibit ingress of debris between the mounting portion and the mounting surface of the vehicle. The seal comprises a second plastic material, different than the first plastic material. The mounting system may be included in a window assembly where the mounting surface of the vehicle is an inner surface of a transparent pane and the component is a sensor.

Abstract: A sky sensor device for measuring direct normal illuminance (DNE) value is described. One method controls a camera sensor to capture a series of exposure-bracketed images having a first dynamic range and generate an image from the series of exposure-bracketed images, the image having a second dynamic range higher than the first dynamic range. The method controls an illuminance sensor to measure a global illuminance value. The method determines a global horizontal diffuse value based on at least the image. The method determines a direct normal illuminance (DNE) value using the global illuminance value and the global horizontal diffuse value.

Abstract: An exposure apparatus that exposes a substrate to light by using an original in which a pattern is formed includes an illumination optical system arranged to guide illumination light to the original, the illumination light including first illumination light with a first wavelength and second illumination light with a second wavelength different from the first wavelength, and a projection optical system arranged to form a pattern image of the original by using the illumination light at a plurality of positions in an optical axis direction. The illumination optical system is configured to adjust a position deviation in a direction perpendicular to the optical axis direction between a pattern image formed by the first illumination light and a pattern image formed by the second illumination light by changing an incident angle of the illumination light entering the original.