Abstract: The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

Abstract: An unfastening device for unfastening pipe fasteners includes a base and a first clamp plate extends from a top of an end of the base. A movable member is slidably mounted to the base and movable between the two ends of the base. A second clamp plate and a third clamp plate extend from a top of the movable member. A cable unit includes a head which extends through one of two ends of the base and is stopped by an end of the movable member. A flexible cable extends through the head and has a first end fixed to the first board of the base. By pulling the second end of the flexible cable, the movable member is moved along the base and the distance between the first clamp plate and the second and third clamp plates can be adjusted.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: A tool for gripping ophthalmic lenses including a vacuum gripper, a shaft associated with said vacuum gripper, the shaft having two ends and being slidably attached at one end thereof to a support structure, a resilient member which biases the vacuum gripper in a direction away from said support structure and a locking member which locks the shaft in a desired position during a lens gripping operation. Another embodiment of the present invention includes a lens hold down mechanism for holding lenses in a lens tray. Another embodiment of the present invention includes an electronic communications scheme for a robotic manufacturing operation. Another embodiment of the present invention includes an ophthalmic lens manufacturing cell layout wherein ophthalmic edging machines have an opening that faces away from a robotic arm. Another embodiment of the present invention includes an arrangement for holding an ophthalmic edging machine within an ophthalmic manufacturing cell.

Abstract: The present invention features a reciprocating wire saw particularly adapted or configured for cutting hard materials. In one aspect, the reciprocating wire saw comprises (a) a flexible wire; (b) a plurality of cutting segments fittable onto the flexible wire, wherein each of the cutting segments comprises an outer surface; and a (c) plurality of superabrasive particles braze bonded onto the outer surface of the cutting segments to form a cutting wire. In another aspect, the reciprocating wire saw comprises a plurality of superabrasive particles braze bonded directly to the wire itself to form a cutting wire. The cutting wire is unique in that it comprises a pre-determined superabrasive particle concentration and is configured to cut various materials, such as granite, in a reciprocating manner.

Abstract: A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.

Abstract: A chemical-mechanical polishing (CMP) method includes applying a solid abrasive material to a substrate, polishing the substrate, flocculating at least a portion of the abrasive material, and removing at least a majority portion of the flocculated portion from the substrate. Applying solid abrasive material can include applying a CMP slurry or a polishing pad comprising abrasive material. Such a method can further include applying a surfactant comprising material to the substrate to assist in effectuating flocculation of the abrasive material. Such surfactant comprising material may be cationic which includes, for example, a quaternary ammonium substituted salt. Also, for example, the surfactant comprising material may be applied during polishing, brush scrubbing, pressure spraying, or buffing.

Abstract: An apparatus (10) for tightening a hexagon head bolt (13) includes a vertically movable automatic robot arm (16), a screwing mechanism (18) having a rotational part (19), a shaft member (20) mounted to the rotational part, a socket portion (21) mounted to the shaft member for receiving therein a head (14) of the bolt, and a retention means (22) for retaining the head received in the socket portion or retaining the head released from the socket portion. When the arm moves vertically with the head received in the socket portion, the rotational part is rotated along with the shaft member and the socket portion to screw the bolt into a threaded aperture (12) of a crankcase (11) of an engine.

Abstract: The invention provides a method of polishing a substrate, which method comprises the steps of (i) providing a polishing composition, (ii) providing a substrate comprising at least one metal layer, and (iii) abrading at least a portion of the metal layer with the polishing composition to polish the substrate. The polishing composition comprises an abrasive and a liquid carrier, wherein the abrasive comprises metal oxide particles having a surface with a silane compound adhered to a portion thereof and a polymer adhered to the silane compound and wherein the polymer is selected from the group consisting of water-soluble polymers and water-emulsifiable polymers. The invention also provides a polishing composition as described above, wherein the total amount of abrasive particles present in the polishing composition is no greater than about 20% by weight of the polishing composition, and the metal oxide particles do not comprise zirconia.

Abstract: A method and apparatus for a circular grinding of a workpiece having first and second workpiece faces which are rotationally symmetrical with respect to the workpiece axis and which form a circular transition edge between them are provided. The workpiece rotating about its axis and a grinding wheel rotating about a grinding-wheel axis are advanced towards one another. During grinding, an auxiliary abrasive tool, which rotates about an auxiliary-tool axis and has a plane abrasive surface arranged at right angles to the auxiliary-tool axis, is pressed against the workpiece in such a way that the abrasive surface is arranged in a tangential plane to the second workpiece face and touches the second workpiece face along a contact line. The plane abrasive surface projects in the direction of the contact line away from the second workpiece face beyond the transition edge.

Abstract: According to one aspect, the invention provides a blocking apparatus and a blocking method for precisely aligning a button holder against a block during blocking process of lens manufacturing. According to another aspect, the invention provides a blocking apparatus a blocking method for automatically applying a wax material on a button. In one embodiment, the blocking apparatus includes an automatic wax delivery system having an automatic retractable dispensing nozzles for wax delivery.

Abstract: The scouring pad comprises a wad (10) of looped scouring wire. The wad is constituted by substantially concentric windings of the wire (12) such that it presents substantially the form of a toroidal ring. The pad has means for holding the windings together, said means comprising at least one binding strap (20) going around a section of the ring and disposed substantially on a meridian of the torus formed by the ring.

Abstract: A cutting tool having a hard tip is pressed with a uniform pressure against a surface of a vehicle wheel as the wheel is rotated to smooth and seal the surface. The smoothed and sealed wheel surface is then chrome plated with a process that includes applying a nickel layer directly upon smoothed and sealed wheel surface and a chromium layer over the nickel layer.

Abstract: A liquid suspension for planarizing an outer surface of a material comprises a liquid suspension medium of a specific liquid density; and a plurality of solid, contact-sensitive abrasive particles of a constant solid density and suspended in the liquid suspension medium. The liquid and solid densities are approximately the same so that the abrasive particles freely and stably suspend in the liquid suspension medium, without gravitational separation by settling down or floating up. In this way, damaging contacts of the solid abrasive particles with one another are minimized.

Abstract: In a method for honing a bore having first and second sections sequentially arranged in an axial direction of the bore, wherein the first section is hardened so that the first and second sections have different hardness, a honing tool is radially supported by positioning guides of the honing tool on the second bore section. first section is machined with honing stones arranged on the honing tool to remove material from the first section. During machining of the first section, the honing tool is expanded by feeding the honing stones according to a defined feeding mode against a surface of the first section by a force-guided electro-mechanical advancement. During machining of the first section, the working stroke of the honing tool is adjusted continuously at least toward the end of the honing process. Feeding of the guides is realized independently of feeding of the honing stones.

Abstract: A magnetorheological fluid delivery system includes a mixing and tempering vessel. Fluid is admitted to the vessel via a plurality of tangential ports, creating a mixing of the fluid in the vessel and promoting homogeneity. Fluid may be reconstituted in the vessel by metered addition of carrier fluid. A fixed-speed centrifugal pump disposed in the vessel pressurizes the system. Fluid is pumped through a magnetic-induction flowmeter and a magnetic flow control valve having solenoid windings whereby MR fluid is magnetically stiffened to restrict flow. A closed-loop feedback control system connects the output of the flowmeter to performance of the valve. A nozzle having a slot-shaped bore dispenses MR fluid for re-use in the work zone.

Abstract: A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictional force of the samples is measured during the lapping to calculate the friction and Preston coefficients of the plate. The samples are held in place while the plate rotates and the sensor measures the distance to the plate. The plate rotates for a specific time so that adequate removal of the pad material has occurred. The lapping rate is determined from a change in the gap distance over a time interval. The lapping rate and friction are then assessed to determine if the plate is lapping worthy.

Abstract: Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.

Abstract: A hand-held cleaning tool for foam buffing pads includes a paddled cleaning wheel mounted for rotation on a shaft attached to the end of a pistol grip handle. The paddle cleaning wheel grips the foam buffing pad. The cleaning tool is operated by holding the same in operative contact with the rotatably driven pad.

Abstract: The polishing machine processes a workpiece put on table of body by four-directional control and is provided with a pair of columns. It comprises: first carrying unit having both ends fixed to pair of columns and having carrying part mounted on upper side; a second carrying unit being fixed to the carrying part in the direction orthogonal to the first carrying unit; third carrying unit being fixed to one end of the second carrying unit in the direction orthogonal to the second carrying unit; a tool head unit being mounted to lower side of the third carrying unit to be inclinable at predetermined angle by a tilting unit rotating at a constant angle and having driving means for rotating a polishing tool mounted at one side; and automatic constant pressure regulating means providing a predetermined virtual pressure with respect to the polishing tool mounted on the tool head unit.