Abstract: A cable includes a plurality of electric wires, which are laid helically around a center of the cable and along a central axis of the cable, and a sheath provided to cover respective peripheries of the plurality of electric wires together. The sheath includes an inner layer sheath made of a urethane resin, and an outer layer sheath provided around an outer periphery of the inner layer sheath to protect the inner layer sheath. The cable may further include a core member at its center. The sheath may be composed of a single layer instead of plural layers.

Abstract: An adjustable junction box is provided that allows a technician to selectively adjust the distance between an outer surface of the junction box and an outer surface of a stud to which the junction box is interconnected. A selectively-removable cover is also provided that allows an outlet, for example, to be interconnected to a power supply and later removed for inspection.

Abstract: Provided are a substrate with a functional fine line having excellent optical properties and excellent adhesion of the functional fine line, and a method for forming the functional fine line. The substrate with a functional fine line according to the present invention has an undercoat layer including a hydrophobically modified polyester resin on the substrate, and has a functional fine line including a deposit of functional microparticles and having a line width of 1 ?m or more and 10 ?m or less on the undercoat layer. The method for forming a functional fine line according to the present invention includes forming an undercoat layer including a hydrophobically modified polyester resin on a substrate, and then forming a functional fine line including a deposit of functional microparticles and having a line width of 1 ?m or more and 10 ?m or less on the undercoat layer.

Abstract: Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

Abstract: A vehicle control apparatus is disposed inside a housing for accommodating a transmission. The vehicle control apparatus includes a metal base, a resin case, a printed circuit board on which an electronic component mounts, and an oil-tight seal member. The metal base is made of metal. The resin case is attached to the metal base to form an interior space. The printed circuit board is disposed in the interior space. The oil-tight seal member is disposed between the metal base and the resin case to surround the printed circuit board. The electronic component is included in a control circuit for the transmission. The metal base and the oil-tight seal member are at a hydrogen bonding state, and the rein case and the oil-tight seal member are at a covalent bonding state.

Abstract: A disclosed display apparatus may include a display panel configured to display an image, and a first back cover at a rear surface of the display panel and supporting the display panel. The display apparatus may additionally include a roller configured to wind or unwind the display panel, and an adhesive part between the display panel and the first back cover and fixed to the roller.

Abstract: A wire harness system having a wire harness and a connection unit is provided. The connection unit includes a circuit network configuring a part of circuit lines for realizing selectively added specification in the wire harness. Selection circuit lines of an optional sub-harness branched from the trunk line of the wire harness are connected to the circuit network of the connection unit. Thus, connection or disconnection between the selection circuit lines and switching of connection among branches or the like of the selection circuit lines can be easily realized by changing the circuit network of the connection unit.

Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

Abstract: The present disclosure describes an expansion card interface for a printed circuit board. The expansion card interface includes a substrate having an edge. The expansion card interface further includes a plurality of signal pins configured to communicate one or more signals to and from the printed circuit board. The expansion card interface further includes a plurality of ground pins adjacent to the plurality of signal pins configured to provide a ground. At least one signal pin of the plurality of signal pins extends closer to the edge of the substrate than at least one ground pin of the plurality of ground pins.

Abstract: High-voltage insulators are disclosed that are capable of handling diverse requirements, such as providing high standoff voltages, high temperature cycling, and the ability to withstand flexural stress. One high-voltage insulator includes a first piece formed from a first material, a second piece formed from a second material, and an interface section where the first piece contacts with and forms a seal with the second piece. The interface includes a first groove located that accommodates a first gasket, sets of matching threads on the first and second pieces. The interface section further accommodates a second gasket. In this multi-piece high-voltage insulator, the first material can have a first set of flexural, heat resistance, and electrical standoff characteristics suitable for a first environment, and the second material can have a second set of flexural, heat resistance and electrical standoff characteristics suitable for a second environment.

Abstract: An electrical box having an enclosure and a conduit hub adapter that is configured to engage a portion of the enclosure. The enclosure defines an opening that is configured to receive an electrical power conductor. The conduit hub adapter is movable with respect to the enclosure from a disengaged position to an engaged position. A retainer may be positioned adjacent the opening to engage the conduit hub adapter when in the engaged position and secure the conduit hub adapter to the enclosure. The conduit hub adapter may be configured for engagement with the enclosure in a single orientation. The retainer may be configured so that it may only be disengaged from the conduit hub adapter from within an interior space of the enclosure. The enclosure may have a second opening with a second conduit hub adapter configured to engage the enclosure adjacent the second opening.

Abstract: Disclosed herein are a stretchable display panel and device and a manufacturing method thereof. The stretchable display panel comprises: a lower substrate having an active area and a non-active area surrounding the active area; a plurality of individual substrates disposed on the lower substrate and located in the active area; a plurality of pixels disposed on the plurality of individual substrates; and a connection line disposed between the plurality of individual substrates and the lower substrate, wherein the modulus of the plurality of individual substrates is higher than that of at least one part of the lower substrate, and wherein the connecting line extends to the bottom surface of the individual substrates, such that the connecting line electrically connects a pad disposed on the individual substrates without a step in the top surface of the connecting line. That is, the connecting line has a uniform height from the lower substrate for its entire length.

Abstract: A power semiconductor module has a base plate, a housing affixed to the base plate, a DC busbar affixed to the base plate and the housing, and AC busbar affixed to the base plate and the housing, control electronics positioned in an interior of the housing and connected to the AC and DC busbars, and a sealant material applied to seams between the base plate in the housing, to seams between the DC busbar and the housing, and to seams between the AC busbar in the housing. The sealant material is applied such that the control electronics of the power semiconductor modules are in an air-tight environment.

Abstract: A power semiconductor module has a base plate with a heat sink affixed thereto, a housing affixed to the base plate, a DC busbar affixed to the base plate and to the housing, an AC busbar affixed to the base plate and to the housing on a side of the housing opposite the DC busbar, and control electronics positioned in an interior of the housing and connected to the DC busbar and to the AC busbar. The heat sink has a plurality of pins affixed to one side of the base plate and extending outwardly therefrom. Each of the plurality of pins is of a forged or impact extruded pure aluminum material.

Abstract: An electrically insulated electrical conductive strip (1), especially for electric motors and transformers, having an electrical conductor (2) in strip form that has an upper face (2a) and a lower face (2b), two lateral edge faces (2c) and one end edge face at each end, and having an electrical insulation (3) disposed on at least one face of the strip (2a, 2b). The insulation (3) has an enamel layer (3a) and an adhesive strip (3b) bonded to the lower face (2b) and/or the upper face (2a) of the electrical conductor (2) in strip form, in each case at least in a region (4) that directly adjoins a lateral edge face (2c).

Abstract: A process for manufacturing finished wire and cable having reduced coefficient of friction and pulling force during installation, includes providing a payoff reel containing at least one internal conductor wire; supplying the at least one internal conductor wire from the reel to at least one extruder; providing the least one extruder, wherein the at least one extruder applies an insulating material and a polymerized jacket composition over the at least one internal conductor wire, wherein the polymerized jacket composition comprises a predetermined amount by weight of nylon; and at least 3% by weight of a silica providing a cooling device for lowering the temperature of the extruded insulating material and the polymerized jacket composition and cooling the insulating material and the polymerized jacket composition in the cooling device; and, reeling onto a storage reel the finished, cooled, wire and cable for storage and distribution.

Abstract: A modular device backbone may include a controller and two or more backplates configured to be distributed throughout a user space and further configured to couple with swappable devices. Any of the two or more backplates may include a configuration storage device to store backplate-based configuration information including a backplate identifier and a controller address for communicating with the controller, and a communication unit to transmit the backplate-based configuration information. Upon coupling of a particular swappable device to a particular backplate, the particular swappable device may receive the backplate-based configuration information from the particular backplate and further communicate with the controller using the controller address to receive controller-based configuration information from the controller, which may include information for communicating with additional swappable devices.

Abstract: A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.

Abstract: A device substrate includes a first substrate, a second substrate, a plurality of first bonding pads, a plurality of second bonding pads, a plurality of first leads, and a plurality of second leads. The first and second bonding pads are separated from each other. The first bonding pads are arranged in a first column. The second bonding pads are arranged in a second column. The first and second leads respectively overlap the first and second bonding pads. The first lead includes a first extension portion and a first branch portion. The first extension portion extends from the first column to the second column. The first branch portion is connected to an end of the first extension portion close to the second column. An angle is present between the first extension portion and the first branch portion.

Abstract: A circuit board assembly allowing a higher population density of electronic components on the board includes a first circuit board, a second circuit board, and an interposer electrically connecting the first circuit board and the second circuit board. The interposer includes a substrate sandwiched between the first circuit board and the second circuit board, the substrate includes a first surface facing the first circuit board, a second surface facing the second circuit board, and a lateral surface connecting the first circuit board and the second circuit board. It is the lateral surface which carries a test pad, allowing all testing of components to be done on the test pad.