Patents Examined by Stanley Tso
  • Electronic package comprising a decoupling layer structure
    Patent number: 11083081
    Abstract: An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: August 3, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Mikael Tuominen, Seok Kim Tay
  • Feedthrough assembly
    Patent number: 11058883
    Abstract: A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: July 13, 2021
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, Andrew J. Thom
  • Weather protecting (WP) housing for coaxial cable connectors
    Patent number: 11056824
    Abstract: A productive housing for a coaxial cable connector comprising an elastomeric housing disposed over and engaging a connector and having a plurality of longitudinal slots formed into the inner mold line (IML) surface of the elastomeric housing. The longitudinal slots function to reduce the surface area of frictional engagement between the intermediate surface and the corresponding peripheral surface of the coaxial cable connector. The longitudinal slots serve as a longitudinal passageway for the movement of trapped air from one IML surface to another so as to prevent the built-up of air and/or inducing a pocket of suction resisting the separation of the housing from the jumper cable.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: July 6, 2021
    Assignee: John Mezzalingua Associates, LLC
    Inventors: Nikhil B. Meshram, Adam T. Nugent, Christopher P. Natoli, Brandon Stevens
  • Vehicle interleaved busbars
    Patent number: 11056871
    Abstract: In at least one embodiment, a busbar assembly for a vehicle is provided. The assembly includes a printed circuit board (PCB), a first plate, a second plate, and a third plate. The first plate supported on the PCB and is configured to enable a first current to flow in a first direction. The second plate is supported on the PCB and includes a first portion positioned below the first plate to enable a second current to flow in a second direction. The third plate is on the PCB and is positioned below the second plate to enable the first current to flow in the first direction. The second current that flows through the second plate is increased through an effective cross-section of the second plate when the flow of the second current in the second direction is different than the flow of the first current in the first direction.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: July 6, 2021
    Assignee: Lear Corporation
    Inventors: Miguel Angel Aceña, Josep Maria Roset Rubio, Ramon Sanchez Rovira, Youssef Ghabbour, Enric Aparicio Rollan, Antonio Martinez Perez, Antonio Tomas Amenos
  • Flexible display device
    Patent number: 11058000
    Abstract: The present disclosure provides a flexible display device including a flexible display panel, a flexible printed circuit board, and a reel. The flexible printed circuit board includes a first binding area provided with a first pad and an element area provided with an integrated circuit. The flexible display panel includes a display area, and a second binding area provided with a second pad. The first pad is bound to the second pad. The reel has a cavity, and the reel includes an inner surface facing towards the cavity and an outer surface facing away from the cavity. The inner surface includes a first surface, and the first surface is flat. The element area of the flexible printed circuit board is provided on the first surface, and the display area of the flexible display panel is rollable along the outer surface of the reel.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: July 6, 2021
    Assignee: WuHan TianMa Micro-electronics CO., LTD.
    Inventors: Shunqi Tang, Congyi Su, Jian Jin
  • Adjustable mount for contacting probes to a dense pattern of pads in a circuit board
    Patent number: 11057989
    Abstract: Embodiments described herein relate to a system. The system may include a base configured to be removably coupled to an electrical component. The base may include a first plurality of crossbar alignment features arranged in a first pattern. The system may also include a crossbar configured to be removably coupled to the base using a portion of the first plurality of crossbar alignment features. The crossbar may include a first plurality of adapter plate alignment features arranged in a second pattern. The system may also include an adapter plate configured to be removably coupled to the crossbar using a subset of the first plurality of adapter plate alignment features. The adapter plate may include a plurality of measurement device mounting features.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: July 6, 2021
    Assignee: Arista Networks, Inc.
    Inventors: Youngbae Park, James Alden Weaver, Prasad V. Venugopal
  • Capacitor explosion-proof device, circuit board and electronic device
    Patent number: 11049665
    Abstract: A capacitor explosion-proof device includes an explosion-proof casing, covering a top of an electrolytic capacitor opposing the pins. The explosion-proof casing includes a side plate, at least one vent disposed on the side plate and opposing the top. By avoiding spread of electrolyte solution, probability of a fire can be reduced.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: June 29, 2021
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Riwen Zheng, Kun Wang
  • Poke-through electrical outlet assembly with leveling bezel
    Patent number: 11050228
    Abstract: An electrical outlet assembly is mountable in a floor or work surface, and includes an upper bezel and a lower insert that are joined in a non-rigid manner that permits some adjustment to the spacing and/or tilt of the upper bezel relative to the lower insert. The upper bezel and lower insert are joined together by a plurality of fasteners extending between a plurality of fastener receivers coupled to the upper bezel, and to the lower insert. At least one end of each coupling fastener is loosely captured in such a way that when the coupling fasteners are fully secured, they are permitted to move axially relative to the fastener receiver or the lower insert. This allows the lower insert to be repositionable in its axial direction relative to the upper bezel, and also permits the lower insert to be tilted out of alignment with the upper bezel.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: June 29, 2021
    Inventors: Norman R. Byrne, Aaron G. Lautenbach, Matthew R. Haller, Marc A. Mitchell
  • Ceramic electronic component
    Patent number: 11051398
    Abstract: A ceramic electronic component according to the present disclosure includes a ceramic insulator and conductor portions including inner conductors disposed inside the ceramic insulator and outer conductors disposed outside the ceramic insulator, wherein each conductor portion has a surface and a back surface opposite to the surface, and at least one of the conductor portions includes a flat portion in which the conductor thickness is constant, surface corner portions having a round-chamfered shape in the direction from the surface toward the back surface of the inner conductor or the outer conductor, and back surface corner portions having a round-chamfered shape in the direction from the back surface toward the surface of the inner conductor or the outer conductor.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: June 29, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yosuke Matsushita, Issei Yamamoto, Shigeru Endo, Yoshihito Otsubo
  • Back-to-back isolation circuit
    Patent number: 11044022
    Abstract: Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: June 22, 2021
    Assignee: Analog Devices Global Unlimited Company
    Inventors: Laurence B. O'Sullivan, Shane Geary, Baoxing Chen, Bernard Patrick Stenson, Paul Lambkin, Patrick M. McGuinness, Stephen O'Brien, Patrick J. Murphy
  • Pop-up power system
    Patent number: 11038331
    Abstract: A pop-up power system with a hollow tower to support an electrical receptacle. The lid includes a lid locking mechanism, and the tower being rotatable between a locked position and an unlocked position. A mounting sleeve receives the tower body through it and includes a locking mechanism alignable with the lid locking mechanism. A liner is positioned between the tower body and the mounting sleeve, the liner comprising a groove for the guide pin in an interior surface of the liner which surrounds and slideably engages the body and is rotatably connected to the mounting sleeve. A biasing element biases the lid of the tower away from the liner and is configured to slide between an extended position and a retracted position with respect to a mounting surface so that it has an extended locked position and an extended unlocked position, a retracted locked position and a retracted unlocked position.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: June 15, 2021
    Assignee: Titan3 Technology LLC
    Inventor: Jeffrey P. Baldwin
  • Mounting structure for capacitor and resistor, input unit, and measuring apparatus
    Patent number: 11037734
    Abstract: A mounting structure minimizes the influence of displacements, along a length direction of a resistor, in mounting positions of capacitor electrodes on the electrical characteristics of a circuit including a parallel circuit composed of a capacitor and the resistor. The capacitor has first and second electrodes, which respectively include first and second side surface portions disposed in parallel to a length direction of the resistor. The resistor has a first resistance body corresponding to the first side surface portions and a second resistance body corresponding to the second side surface portions that are separately disposed along the length direction and connected in series via a wire, and is mounted so that the first resistance body is positioned directly facing the first side surface portions and the second resistance body is positioned directly facing the second side surface portions.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: June 15, 2021
    Assignee: HIOKI E.E. CORPORATION
    Inventors: Shuhei Yamada, Kazunobu Hayashi, Kenichi Seki, Hajime Yoda, Toshio Heishi
  • Printed circuit board and manufacturing method thereof
    Patent number: 11039532
    Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taehyeun Ha, Taeje Park
  • Cable accessory with improved thermal conductivity
    Patent number: 11031766
    Abstract: The invention relates to a cable accessory, said accessory being surrounded by at least one electrically insulating crosslinked layer comprising at least one polymer material, boron nitride and silicon carbide, to an electrical device comprising at least said cable accessory, to a process for manufacturing said accessory and said device, to the use of said crosslinked layer around an electric cable accessory or in an electrical device, in particular for promoting heat discharge, to a kit for connecting electric cables, and to a cable accessory, said accessory comprising two fillers of different thermal conductivities.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: June 8, 2021
    Assignee: NEXANS
    Inventors: Basil Salame, Adrien Charmetant, Mickael Laurent
  • Display device, circuit bonding structure, and circuit bonding method
    Patent number: 11013121
    Abstract: The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and form a preset acute angle. The driving circuit is bonded to the bonding region by the carrying portion.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: May 18, 2021
    Assignees: BOE Technology Group Co., Ltd., BOE (Hebei) Mobile Display Technology Co., Ltd.
    Inventors: Zhifu Yang, Zhiyang Cui, Dahua Zhu, Lei Zhao
  • Cable
    Patent number: 11011286
    Abstract: A cable includes a plurality of electric wires, which are laid helically around a center of the cable and along a central axis of the cable, and a sheath provided to cover respective peripheries of the plurality of electric wires together. The sheath includes an inner layer sheath made of a urethane resin, and an outer layer sheath provided around an outer periphery of the inner layer sheath to protect the inner layer sheath. The cable may further include a core member at its center. The sheath may be composed of a single layer instead of plural layers.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: May 18, 2021
    Assignee: HITACHI METALS, LTD.
    Inventors: Detian Huang, Yoshinori Tsukamoto, Masanori Kobayashi, Masashi Moriyama, Isao Matsuoka
  • Selectively adjustable junction box
    Patent number: 11011897
    Abstract: An adjustable junction box is provided that allows a technician to selectively adjust the distance between an outer surface of the junction box and an outer surface of a stud to which the junction box is interconnected. A selectively-removable cover is also provided that allows an outlet, for example, to be interconnected to a power supply and later removed for inspection.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: May 18, 2021
    Inventor: Monte R. Losaw
  • Substrate with functional fine line and method for forming functional fine line
    Patent number: 11001687
    Abstract: Provided are a substrate with a functional fine line having excellent optical properties and excellent adhesion of the functional fine line, and a method for forming the functional fine line. The substrate with a functional fine line according to the present invention has an undercoat layer including a hydrophobically modified polyester resin on the substrate, and has a functional fine line including a deposit of functional microparticles and having a line width of 1 ?m or more and 10 ?m or less on the undercoat layer. The method for forming a functional fine line according to the present invention includes forming an undercoat layer including a hydrophobically modified polyester resin on a substrate, and then forming a functional fine line including a deposit of functional microparticles and having a line width of 1 ?m or more and 10 ?m or less on the undercoat layer.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: May 11, 2021
    Assignee: Konica Minolta, Inc.
    Inventors: Masayoshi Yamauchi, Hidenobu Ohya, Takenori Omata, Naoto Niizuma
  • Structure for circuit interconnects
    Patent number: 10999923
    Abstract: Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: May 4, 2021
    Assignee: Juniper Networks, Inc.
    Inventor: Christopher Paul Wyland
  • Vehicle control apparatus
    Patent number: 10999947
    Abstract: A vehicle control apparatus is disposed inside a housing for accommodating a transmission. The vehicle control apparatus includes a metal base, a resin case, a printed circuit board on which an electronic component mounts, and an oil-tight seal member. The metal base is made of metal. The resin case is attached to the metal base to form an interior space. The printed circuit board is disposed in the interior space. The oil-tight seal member is disposed between the metal base and the resin case to surround the printed circuit board. The electronic component is included in a control circuit for the transmission. The metal base and the oil-tight seal member are at a hydrogen bonding state, and the rein case and the oil-tight seal member are at a covalent bonding state.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: May 4, 2021
    Assignee: DENSO CORPORATION
    Inventors: Ryuhei Katsuse, Yosuke Matsuo, Keisuke Atsumi