Abstract: Example embodiments relate to a sensor unit with rotating housing and spoiler for enhanced airflow. An example device includes one or more sensors configured to sense one or more aspects of an environment surrounding the device. The device also includes a housing that at least partially surrounds the one or more sensors. The housing and the one or more sensors are configured to rotate about a shared axis. The housing includes an inlet configured to act as an air intake for an airflow through the housing. The airflow is configured to cool the one or more sensors while the one or more sensors are operating. Further, the device includes a spoiler positioned on or near the inlet. The spoiler is configured to increase an air pressure near the inlet or promote laminar flow near the inlet in order to promote the airflow through the housing.

Abstract: A cooling system may include a first domain having a first fluid inlet and a first fluid outlet. A cooling system may include a second domain having a second fluid inlet and a second fluid outlet. A cooling system may include a thermal break between the first domain and the second domain. The thermal break includes a thermal gap separating the first domain and the second domain by 1 mm or less.

Abstract: An information handling system with a cooling system may include a processor, a memory; a power management unit (PMU) operatively coupled to the processor; a cooling fan operatively coupled to the processor to draw air into and direct air out of a base chassis of the information handling system, the cooling fan including a fan housing; and a radio module operatively coupled to the fan housing to be cooled by conduction to the fan housing and operation of the fan via convective cooling.

Abstract: It is aimed to provide a fuse element capable of interrupting an electrical circuit while suppressing the formation of carbide when an abnormal current is generated. A fuse element 10 is provided with an insulating base material 3, a conductor layer 1 provided on a surface of the base material 3 and an insulating protection layer 4 provided on a surface of the conductor layer 1. The protection layer 4 has a specific heat of 1.1 J·g?1·K?1 or more and a specific gravity of 1.0 g·cm?3 or more.

Abstract: A heat dissipation module includes a housing defining a receiving space for accommodating a fan, a turntable, and an expansion mechanism. The housing includes a top plate and two side walls connected to opposite ends of the top plate. The fan is configured for generating airflow from one side wall to the other. The turntable is connected to the expansion mechanism. The turntable rotates into a locked position to extend the expansion mechanism to protrude from the housing, and the turntable deviates from the locked position to retract the expansion mechanism back into the housing. An electronic device including the heat dissipation module is also provided.

Abstract: Disclosed herein are embodiments for a control module cooling system. For example, the control module is provided with a chassis and a circuit board assembly that is mounted to the chassis and includes electronics that generate heat during operation. A cold plate is mounted to the chassis and adjacent to the circuit board assembly and defines an opening. A cold block is coupled to the cold plate and comprises: a base disposed within the opening and coupled to the electronics; a plurality of fins extending from the base and spaced apart from each other to form channels; and a plate that is spaced apart from the base to form a cavity. The plate defines an inlet that is arranged over a central portion of the plurality of fins to receive a liquid therethrough to facilitate impinging flow of the liquid through the channels to transfer heat from the electronics.

Abstract: A temperature-dependent switching mechanism for a temperature-dependent switch, having: a temperature-dependent bimetal snap-action disc having a first through hole; a temperature independent snap-action spring disc having a second through hole; and an electrically conductive contact member including a main body that passes through the first through hole and the second through hole. The contact member includes a support shoulder projecting radially from the main body, a first locking element projecting radially from the main body and arranged on a first side of the support shoulder, and a second locking element projecting radially from the main body and arranged on a second side of the support shoulder opposite the first side. The temperature-dependent bimetal snap-action disc and the snap-action spring disc are arranged between the locking elements and the support shoulder and are each held captive, but with clearance, by these on the main body of the contact member.

Abstract: A panelboard assembly for a harsh and/or hazardous environment is provided. The panelboard assembly includes a core assembly. The core assembly includes a main breaker assembly configured to be electrically connected to a power supply, and a branch breaker assembly electrically connected to the main breaker assembly and configured to be electrically connected to one or more loads, and a power distribution heatsink assembly. The power distribution heatsink assembly includes an electrically-conductive heatsink having a first end and an opposing second end, the first end electrically connected to the core assembly and an electrically-nonconductive isolator electrically insulating the heatsink.

Abstract: An electronic device is provided. The electronic device includes a housing including an opening, a first cover disposed in the housing to close the opening and includes a first surface facing the outside and a second surface facing an internal space of the housing, at least one air vent formed from the first surface to the second surface in a region of the first cover to connect the outside of the electronic device to the internal space and includes a first space formed to have a specified depth in a direction starting from the first surface to the second surface, and a second space formed to have a specified depth in a direction starting from the second surface to the first surface, wherein the first space and the second space are connected, and a breathable waterproof member disposed to close the second space in the second surface.

Abstract: A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.

Abstract: Provided are a structure capable of protecting an air intake portion from entry of water droplets or the like, and an electronic device including the structure. The electronic device includes: a housing which is a box-shaped container having an open upper surface, configured to house an electronic component and a fan for blowing air downward, and provided with an air exhaust hole; an inner lid to be attachable and detachable at a position at which an opening of the housing is closed, and provided with an air intake hole upstream of the fan in an air-blowing direction; and an upper lid provided to overlap the inner lid, and facing, from above, a surface provided with the air intake hole with a gap therebetween.

Abstract: A boiler plate is provided. The boiler plate includes a heat spreader layer operable to transfer heat from a computing component across the heat spreader layer. The heat spreader layer extends along a plane. At least one heat pipe extends from the heat spreader layer in a direction substantially perpendicular to the plane away from the computing component. The at least one heat pipe is operable to transfer the heat away from the heat spreader layer to reduce a temperature of the computing component.

Abstract: A heat transfer device may be used to provide a thermal conduit from heat generating components mounted on transversely oriented circuit boards. The heat transfer device generally includes a base portion for supporting and thermally coupling with at least one heat generating component on a main circuit board and a transverse portion for supporting and thermally coupling with at least one heat generating component on a daughter circuit board that is oriented transverse to the main circuit board. The base and transverse portions may be made of a thermally conductive material with raised pedestals providing the thermal coupling with the heat generating components. The transverse portion of the heat transfer device may also be designed to facilitate connecting the daughter circuit board to the main circuit board. The heat transfer device may be used in an opto-electronic communications module, such as a broadband digital access (BDA) module used in a hybrid fiber-coaxial (HFC) network.

Abstract: An electronic device includes: a body, including opposite outer and inner surfaces, and a through opening passing through the outer and inner surfaces; a fan, disposed on the outer surface and having an air outlet; a heat sink assembly, disposed at the air outlet and corresponding to the through opening; a first thermal tube, having one end assembled on the heat sink assembly and located on the side of the outer surface; a first heat source, disposed corresponding to the other end of the first thermal tube; a thermal plate, disposed in the body and corresponding to the through opening, having one side abutting against the heat sink assembly and the inner surface; a second thermal tube, having one end connected to the other side of the thermal plate; and a second heat source, disposed corresponding to the other end of the second thermal tube.

Abstract: Provided is an opto-electric transmission composite module capable of efficiently dissipating heat of an opto-electric conversion portion, which includes an opto-electric hybrid board configured to be optically and electrically connected to an opto-electric conversion portion and including an optical waveguide and an electric circuit board in order toward one side in a thickness direction; a printed wiring board electrically connected to the electric circuit board; a heat dissipating layer; and a casing made of metal, the casing accommodating the opto-electric hybrid board, the printed wiring board, and the heat dissipating member, the casing including a first wall are provided. The first wall, the heat dissipating layer, a portion of the printed wiring board, and the opto-electric hybrid board are disposed in order toward one side in the thickness direction. The heat dissipating layer is in contact with the first wall and the printed wiring board.

Abstract: A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.

Abstract: A switch-fuse module includes: a security device, a fuse; and a fuse canister having the fuse inside. The security device includes at least one slider linearly movable between open and closed positions; an earthing switch that is galvanically connected to the fuse, and is coupled to the slider such that the open position effects an open state of the earthing switch and the closed position effects an closed state of the earthing switch; a propulsion element configured to move the earthing switch from the open to the closed state when discharging; and a locking mechanism configured to block access to the fuse in a locked state. The slider is coupled to the locking mechanism such that the slider in the closed position while the locking mechanism is in the unlocked state, so that the fuse is only accessible if it is ensured that the fuse is earthed.

Abstract: Provided is a cooling device of an endoscope device. The cooling device includes: a box; a first communicating hole that is a hole provided in the box; a second communicating hole that is a hole provided in the box; a second fan that is provided at the second communicating hole, the second fan being configured to guide gas to an exterior of the box through the second communicating hole to generate an airflow in the box, the gas having introduced into the box from the first communicating hole; and a duct configured to house a heat generator to be cooled, the duct being positioned in the box to allow the airflow to pass through an inside of the duct.

Abstract: A mobile terminal includes a main board, a heat dissipation layer, a first support, and a housing that are sequentially stacked. A heat generation element is disposed on the main board, and an orthographic projection of the heat generation element on the housing is located in an orthographic projection of the first support on the housing. The heat dissipation layer is disposed in contact with the heat generation element, and an area of an orthographic projection of the heat dissipation layer on the housing is larger than an area of the orthographic projection of the first support on the housing.

Abstract: A disconnect device includes a cooling device having first and second main surfaces opposite to each other, a first insulator contacting the first main surface, a second insulator contacting the second main surface, a charging relay and a first discharging relay which contact a surface of the first insulator opposite to a surface of the first insulator contacting the first insulator, a protector contacting a surface of the second insulator opposite to a surface of the second insulator contacting the second main surface, a first power storage terminal configured to be connected to a first electrode of the power storage element, a second power storage terminal configured to be connected to a second electrode of the power storage element. The charging relay is separated from the discharging relay via a space between the charging relay and the discharging relay. At least a part of the protector faces the space across the first insulator, the cooling device, and the second insulator.