Abstract: The invention provides a holder for snap-fitting a thermal fuse to an electronic component, wherein the holder comprises: a bottom surface for mounting the holder to a carrier comprising the electronic component, wherein the bottom surface comprises an opening for accommodating the electronic component; a first wall parallel to a second wall, wherein the first wall and the second wall each comprise a protrusion for snap-fitting the thermal fuse to the electronic component; a third wall, wherein the third wall comprises an edge for bending around at least one lead of the thermal fuse, wherein a shortest distance between the bottom surface and said edge is larger than a shortest distance between the bottom surface and one of said protrusion.

Abstract: Electronic rack and data center thermal management systems are disclosed. An electronic rack system includes a heat exchange system and the electronic rack having a plurality of servers containing heat-generating components. The heat exchange system includes a filter and a pump to circulate filtered cooling fluid to the electronic rack, via an internal cooling loop. An external cooling loop provides a backup cooling fluid supply to the electronic rack to function as a redundant system for the heat exchange system. The external cooling loop includes an external cooling fluid pump and filter, and is coupled to the internal cooling fluid supply via a valve. The cooling fluid in the internal cooling fluid loop, and its associated filter, are of a higher quality than the cooling fluid and filter of the external cooling fluid loop. In one embodiment, the external cooling loop filter is a high quality filtration system.

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

Abstract: A liquid cooling arrangement for peripheral board incorporates cooling plates on one side and resilient cushion on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.

Abstract: A multi-path cooling system is provided that includes a first cooling path in which a refrigerant is circulated by a first pump and a second cooling path in which the refrigerant is circulated by a second pump. A reservoir tank is provided through which the refrigerant circulating through the first cooling path enters or exits. An air separator is disposed on the second cooling path to separate air from the passing refrigerant when the refrigerant circulating through the second cooling path passes. The reservoir tank and the air separator communicate with each other.

Abstract: An electronic device is provided. The electronic device includes a housing including an opening, a first cover disposed in the housing to close the opening and includes a first surface facing the outside and a second surface facing an internal space of the housing, at least one air vent formed from the first surface to the second surface in a region of the first cover to connect the outside of the electronic device to the internal space and includes a first space formed to have a specified depth in a direction starting from the first surface to the second surface, and a second space formed to have a specified depth in a direction starting from the second surface to the first surface, wherein the first space and the second space are connected, and a breathable waterproof member disposed to close the second space in the second surface.

Abstract: The electronic display, especially for carts, provided with a display housing being a cart handle or being mounted on a cart handle, comprising a screen with an electronic circuit board and a power supply unit located in the display housing, according to the invention stands out in that the screen with the electronic circuit board and the power supply unit are further placed in a removable inner housing, thereby forming a separate display module. The display module is provided with a screen with an electronic circuit board and a power supply unit located in an inner housing adapted to be placed in the display housing.

Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.

Abstract: A display device includes a display panel, a data driver which transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, where a part of the metal tape overlapping the input side wiring in the plan view defines an opening.

Abstract: The cooling module comprises a main supply connector, a main return connector, an internal cooling loop, a plurality of cooling plates, a base layer and a lid. The base layer includes a plurality of supply sub-connectors and return sub-connectors and a plurality of cooling areas corresponding to a plurality of cooling plates. Each cooling plate has a supply connector, a return connector and a contacting area. The plurality of supply sub-connectors and return sub-connectors are connected with the internal cooling loop. Each cooling area is to contact with a contacting area of a corresponding cooling plate. Each supply sub-connector is to be connected to a supply connector of the corresponding cooling plate, and each return sub-connector is to be connected to a return connector of the corresponding cooling plate. The corresponding cooling plate is to be removably attached with the base layer and to be serviced independently.

Abstract: A compressor may include a compressor shell, a motor, a compression mechanism, an enclosure, a control module, a fan, and an airflow deflector. The compression mechanism is disposed within the compressor shell. The motor drives the compression mechanism. The enclosure defines an internal cavity. The control module is in communication with the motor and is configured to control operation of the motor. The fan may be disposed within the internal cavity. The airflow deflector may include a base portion, a first leg, and a second leg. The first and second legs may be spaced apart from each other and may extend from the base portion. The fan may force air against the base portion. A first portion of the air may flow from the base portion along the first leg, and a second portion of the air may flow from the base portion along the second leg.

Abstract: Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Abstract: An electrical apparatus includes an electrical device that generates heat and a fan unit. A case of the electrical device includes a first opening and a second opening. A case of the fan unit includes a third opening and a fourth opening. The case of the electrical device and the case of the fan unit are configured such that a space sandwiched between a recess of the case of the electrical device and the support rail and a space sandwiched between a recess of the case of the fan unit and the support rail constitute an air flow path.

Abstract: A fan frame structure includes a base portion and a wall portion. The base portion has at least one extension section vertically extended from an outer peripheral edge of the base portion, and the extension section has connecting sides. The wall portion is formed along the outer peripheral edge of the base portion through an insert molding process. The wall portion includes a plurality of wall segments connected to the connecting sides of the extension sections, and a clearance is formed between any two adjacent wall segments. With these arrangements, the base portion can better resist a wrapping force from the insert-molded wall portion to avoid deformation.

Abstract: A high-voltage direct-current thermal fuse includes one or more fusible components each having two fusible alloy support arms, a fluxing agent, a fusing cavity, two pins, and an insulation block. Two fusible alloy support arms are arranged opposite, and the fusible component is U-shaped. The fusible component and the fluxing agent are sealed within the fusing cavity. The two pins are respectively connected to the two fusible alloy support arms. The insulation block is arranged between the two fusible alloy support arms and separates the two pins. A volume ratio of the fluxing agent to the fusing cavity is approximately 50% or less, preferably, 10%-50%. The number of the one or more fusible components is at least two, and the at least two fusible components are arranged separately. The thermal fuse can avoid the burst and quickly cut off the current, which provides effective thermal protection for a circuit.

Abstract: An apparatus includes a body, an object to be cooled, a unit, a structural frame, and a ventilation duct. The unit is disposed detachably from the body of the apparatus. The structural frame constitutes a part of the body or the unit. The ventilation duct includes a plurality of ducts connected to each other. The ventilation duct is configured to guide air sucked from outside of the body through an intake of the body to an exhaust port to blow the air to the object to be cooled. The structural frame includes a part of at least one of the plurality of ducts.

Abstract: A display device may include a display panel, a first back cover disposed on a rear surface of the display panel, at least one flexible film which is electrically connected to one end of the display panel and is bent toward a rear surface of the first back cover or a front surface of the display panel, and a printed circuit board which is electrically connected to the at least one flexible film and disposed on the rear surface of the first back cover or the at least one flexible film. The printed circuit board overlaps one end of the display panel. Accordingly, one end of the display panel in which the pad area which is vulnerable to the stress is disposed and the printed circuit board are maintained to be flat, to minimize the damage of the display device.

Abstract: A water block assembly includes first and second water block units having respective first and second fluid conduits. The second water block unit is stacked on the first water block unit. The second fluid conduit operates either in parallel with the first fluid conduit or fluidly independent therefrom, such that cooled fluid is fed to the first and second fluid conduits. The first water block unit includes a first base portion and a first cover portion disposed on and affixed to the first base portion. The first cover portion defines a first fluid inlet and a first fluid outlet of the first fluid conduit. The second water block unit includes a second base portion and a second cover portion disposed on and affixed to the second base portion. The second cover portion defines a second fluid inlet and a second fluid outlet of the second fluid conduit.

Abstract: A scalable graphics card assembly support system for a desktop chassis comprises an end support for coupling to an end of a graphics card assembly and a side support for coupling to a side of the card assembly. The side support can be coupled to any of several positions in a retention guide and the end support may couple to the card assembly or an extension coupled to the graphics card assembly, allowing the graphics card assembly support system to support graphic card assemblies of different lengths, widths and thicknesses. The graphics card assembly support system couples to one or more selected points within the chassis such that a chassis panel can be easily removed for servicing the information handling system. Cable parking connectors and conduit couplers provide better cable and conduit management for a more aesthetically pleasing appearance of an information handling system in the chassis.

Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.