Abstract: An overlap mark set is provided to have at least a first and a second overlap marks both of which are located at the same pattern layer. The first overlap mark includes at least two sets of X-directional linear patterns, having a preset offset a1 therebetween; and at least two sets of Y-directional linear patterns, having the preset offset a1 therebetween. The second overlap mark includes at least two sets of X-directional linear patterns, having a preset offset b1 therebetween; and at least two sets of Y-directional linear patterns, having the preset offset b1 therebetween. The preset offsets a1 and b1 are not equal.

Abstract: The present invention is concerning an image projection apparatus comprising: a projecting unit that projects and displays on a projection surface each image in a time sharing manner for each of a plurality of color components, for an input image signal; a shooting unit that shoots a projected image on the projection surface; a shoot control unit that makes the shooting unit perform the shooting, when a detection mode of a irradiation point at which light is irradiated from an irradiation device on the projection surface is set, in timing shifted by a certain amount of time from a synchronized state to time sharing timing of each color component in the projecting unit; and an irradiation-point-position detecting unit that detects, from a projected image projected by the projecting unit, a position of the irradiation point on the image.

Abstract: A lithographic apparatus comprises an illumination system configured to condition a radiation beam, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, and a sensor. The sensor (S) comprises a photodiode (2) provided on a face (8) of a semiconductor substrate (4) towards which the radiation beam is directed during operation of the lithographic apparatus, a first radiation blocking material (10) being provided around the photodiode on the face of the semiconductor substrate, and a second radiation blocking material (12) is provided on a side (14) of the semiconductor substrate upon which the radiation beam is incident during operation of the lithographic apparatus.

Abstract: A projector includes a light source apparatus, a light modulator that modulates a light flux outputted from the light source apparatus in accordance with image information, a projection lens that projects the light flux modulated by the light modulator, an exterior enclosure that accommodates the light source apparatus, the light modulator, and the projection lens, an exhaust fan (first exhaust fan) that exhausts air inside the exterior enclosure out thereof through an exhaust port (first light source exhaust port) provided in the exterior enclosure, and a functional device (wireless device) that provides a predetermined function and is heated to a temperature higher than the temperature of the exhaust air from the first exhaust fan. The wireless device is disposed in a position downstream of the first exhaust fan, and part of the exhaust air discharged from the first exhaust fan flows to the wireless device.

Abstract: A system for making flexible circuit films includes an inelastic conveyor, a web handling apparatus configured to pass a flexible substrate around the inelastic conveyor, an image acquisition apparatus configured to measure positions of a first set of alignment marks on the flexible substrate at a first conveyor location, an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at a second conveyor location, and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks. The exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions.

Abstract: An image-providing light source device 58 is arranged to inject a non-coherent and collimated image into waveguide element 60. Light forming the image is dispersed by an optical element 76 so as to occupy a continuum of angles within the waveguide 60. The optical element 76 and a grating 70 are arranged such that the light exiting the waveguide occupies a single angle. Thereby, pupil banding of light exiting the waveguide 60 is mitigated.

Abstract: An imaging optical unit for a projection exposure apparatus serves for imaging an object field in an object plane into an image field in an image plane. The image field is arranged at a field distance from the object plane. The optical unit has a plurality of mirrors. The imaging optical unit has a wavefront aberration over the image field of a maximum of 0.3 nm and an image-side numerical aperture of at least 0.5. The image field in at least one dimension has an extent of at least 10 mm. The result is an imaging optical unit in particular suited as part of an optical system for a projection exposure apparatus for projection lithography.

Abstract: The present invention provides an exposure apparatus which includes a projection optical system that projects a pattern of a reticle onto a substrate, and exposes the substrate through the projection optical system and a liquid, the apparatus including a recovery unit which includes a recovery path connected to a recovery port, and is configured to reduce a pressure in the recovery path to recover the liquid, supplied to a space between the projection optical system and the substrate, through the recovery port and the recovery path, and a heating unit which is disposed in the recovery path, and configured to heat the liquid recovered through the recovery port and the recovery path.

Abstract: A method of programmable photolithography includes positioning (910) a programmable photomask in proximity to a photoresist layer on a sample. The programmable photomask is illuminated (920) with a plurality of different wavelengths of light simultaneously to expose the photoresist layer in a predetermined pattern. The programmable photomask is separated (930) from the photoresist layer and the photoresist layer is developed (940) to create the predetermined pattern in the photoresist layer.

Abstract: An off-axis alignment system includes, sequentially along a transmission path of a light beam, an illumination module (10), an interference module (20) and a detection module (30). The interference module (20) includes: a polarization beam splitter (21) having four side faces, the illumination module (10) and the detection modules (30) both located on a first side of the polarization beam splitter (21); a first quarter-wave plate (22) and a first reflector (23), sequentially disposed on a second side opposite to the first side; and a second quarter-wave plate (24) and a cube-corner prism (25), sequentially disposed on a third side of the polarization beam splitter (21); and a third quarter-wave plate (26), a second reflector (27) and a lens (28), sequentially disposed on a fourth side of the polarization beam splitter (21). The second reflector (27) is located on a rear focal plane of the lens (28). A center of a bottom of the cube-corner prism (25) is situated on an optical axis of the lens (28).

Abstract: An exposure apparatus capable of preventing a reduction in its accuracy due to, for example, the influence of aging or the influence of heat is disclosed. Also disclosed is a method of controlling the same, and an alignment method for exposure. In one aspect, the exposure apparatus includes a main stage for adjusting a position of a substrate, a beam irradiation unit for irradiating a beam onto a mask, and a beam monitoring unit having a position fixed with respect to the main stage, and for recognizing the beam emitted from the beam irradiation unit and passed through one pattern of the mask.

Abstract: The invention pertains to an exposure apparatus, a method for controlling a photosensitive element to radiation using the exposure apparatus, and a method for exposing a photosensitive element to radiation. The exposure apparatus includes a base assembly having an exposure bed that supports the photosensitive element, and a lamp housing assembly having two or more lamps. The lamp housing assembly includes an adjustable ballast connected to at least one of the lamps to adjust power received by the one lamp, a sensor for measuring irradiance impinging the exposure bed; and a controller that adjusts the adjustable ballast based on comparison of the measured irradiance to the target irradiance, thereby adjusting the irradiance emitting from the lamp to the target irradiance.

Abstract: A Wynne-Dyson projection lens for use in an ultraviolet optical lithography system is disclosed, wherein the projection lens is configured to have reduced susceptibility to damage from ultraviolet radiation. The projection lens utilizes lens elements that are made of optical glasses that are resistant to damage from ultraviolet radiation, but that also provide sufficient degrees of freedom to correct aberrations. The glass types used for the lens elements are selected from the group of optical glasses consisting of: fused silica, S-FPL51Y, S-FSL5Y, BSM51Y and BAL15Y.

Abstract: A method for compensating a slit illumination uniformity includes executing a first lithography operation and recording an initial slit uniformity profile; executing a slit uniformity optimization process and recording an optimized slit uniformity profile; and offsetting the optimized slit uniformity profile to obtain a working slit uniformity profile such that the working slit uniformity profile has a mean value closest to that of the initial slit uniformity profile.

Abstract: A displacement measurement system comprising at least one retro reflector and a diffraction grating. Said displacement measurement system is constructed and arranged to measure a displacement by providing a first beam of radiation to the measurement system, wherein the diffraction grating is arranged to diffract the first beam of radiation a first time to form diffracted beams. The at least one retro reflector is arranged to subsequently redirect the diffracted beams to diffract a second time on the diffraction grating. The at least one retro reflector is arranged to redirect the diffraction beams to diffract at least a third time on the diffraction grating before the diffracted beams are being recombined to form a second beam. And the displacement system is provided with a sensor configured to receive the second beam and determine the displacement from an intensity of the second beam.

Abstract: A lithography method and apparatus is disclosed herein. In a described embodiment, the method comprises (i) providing a first mask having an exposure pattern for forming a three dimensional structure; (ii) exposing the first mask to radiation to form the exposure pattern on a radiation-sensitive resist; the exposure pattern defined by irradiated areas and non-irradiated areas of the resist; (ii) providing a second mask; and (iii) during exposure, changing relative positions between the first mask and the second mask to shield selected portions of the irradiated areas from radiation to enable varying depth profiles to be created in the three dimensional structure.

Abstract: Multi-beam pattern generators employing yaw correction when writing upon large substrates, and associated methods are disclosed. A multi-beam pattern generator may include a spatial light modulator (SLM) with independently controllable mirrors to reflect light onto a substrate to write a pattern. The pattern may be written in writing cycles where the substrate is moved to writing cycle zone locations. The light is reflected by the SLM onto the substrate by mirrors of the SLM in active positions to write the pattern upon the substrate. By determining a location and yaw of the substrate with respect to the SLM in each writing cycle, some mirrors of the SLM may be digitally controlled to either inactive positions or the active positions to compensate for the yaw of the substrate. In this manner, the pattern written upon the substrate may be precisely written with compensation for yaw.

Abstract: A lithographic apparatus includes a radiation source configured to produce a radiation beam, and a support configured to support a patterning device. The patterning device is configured to impart the radiation beam with a pattern to form a patterned radiation beam. A chamber is located between the radiation source and patterning device. The chamber contains at least one optical component configured to reflect the radiation beam, and is configured to permit radiation from the radiation source to pass therethrough. A membrane is configured to permit the passage of the radiation beam, and to prevent the passage of contamination particles through the membrane. A particle trapping structure is configured to permit gas to flow along an indirect path from inside the chamber to outside the chamber. The indirect path is configured to substantially prevent the passage of contamination particles from inside the chamber to outside the chamber.

Abstract: A movable stage system is configured to support an object. The stage system comprises an object table configured to support the object and an object table support defining an object table support surface configured to support the object table. The object table support comprises at least one first actuator to drive the object table support in a first driving direction substantially parallel to the object table support surface. In a projection on a plane parallel to the object table support surface the at least one actuator is spaced with respect to the object table in a direction perpendicular to the first driving direction such that the risk on slip between the object table support and the object table supported thereon is decreased.

Abstract: A method of obtaining information indicative of the topography of a surface of a flexible substrate, the method including directing a beam of radiation at the surface of the flexible substrate; and detecting changes in intensity distribution, or angle of reflection, of the beam of radiation after the beam of radiation has been reflected from the surface of the substrate to obtain information indicative of the topography of the surface of the flexible substrate.