Patents Examined by Sung H. Pak
  • Patent number: 10876960
    Abstract: A side illuminated multi point multi parameter optical fiber sensor that requires no sensitive coating is provided. This sensor comprises an optical fiber having at least one removed cladding section as the sensitive region, at least one probing light source that side illuminates the fiber, a power supply, a detector, a signal processor and a display. The sensitive optical fiber is optically affected by the presence of a measurand medium that can fluoresce, phosphoresce, absorb and/or scatter the probing light. This probing light is guided by the fiber core towards a detector which measures the light intensity and this light intensity is correlated with a measurand.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: December 29, 2020
    Inventor: Claudio Egalon
  • Patent number: 10877217
    Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: December 29, 2020
    Assignee: Rockley Photonics Limited
    Inventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou, Karlheinz Muth
  • Patent number: 10877227
    Abstract: A closure (100) is configured to hold one or more termination arrangements (120) at which one or more connectorized ends of optical cables can be received. The closure (100) provides axial pull-out protection for the connectorized ends (142) of the optical cables (140). In certain implementations, the closure (100) provides axial pull-out protection for the connectorized ends (142) of optical cables (140) arranged in multiple layers within the closure (100). In certain implementations, the closure (100) provides axial pull-out protection for standard optical connectors (e.g., standard SC connectors, standard LC connectors, standard LX.5 connectors, standard MPO connectors, etc.). The axial pull-out protection can be in the form of a cover (130). Cable bend protection (136) may also be provided by the cover.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: December 29, 2020
    Inventor: David Jan Irma Van Baelen
  • Patent number: 10866367
    Abstract: A method for forming lenses for a fiber optic connector includes forming a mask on a photosensitive glass, the mask defining a plurality of covered portions of the photosensitive glass and a plurality of open portions of the photosensitive glass that are positioned between the plurality of covered portions, exposing the photosensitive glass and the mask to electromagnetic energy, removing the mask from the photosensitive glass, forming wafer-level lenses at the plurality of covered portions of the photosensitive glass by exposing the photosensitive glass to thermal energy, and applying an anti-reflective coating to an upper surface of the photosensitive glass.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: December 15, 2020
    Assignee: Corning Research & Development Corporation
    Inventors: Nicholas Francis Borrelli, Andrey Kobyakov, Joseph Francis Schroeder, III, Mark Owen Weller
  • Patent number: 10866361
    Abstract: A method of making a grating in a waveguide includes forming a waveguide material over a substrate, the waveguide material having a thickness less than or equal to about 100 nanometers (nm). The method further includes forming a photoresist over the waveguide material and patterning the photoresist. The method further includes forming a first set of openings in the waveguide material through the patterned substrate and filling the first set of openings with a metal material.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jui Hsieh Lai, Ying-Hao Kuo
  • Patent number: 10859837
    Abstract: An optical combiner lens for a wearable heads-up display includes a first lens, a second lens, and a lightguide disposed between the first lens and the second lens to form a stack. A first medium gap is defined within the stack and between the first lens and the lightguide, and a second medium gap is defined within the stack and between the lightguide and the second lens. An in-coupler is positioned to receive light into the lightguide. An out-coupler is positioned to output light from the lightguide.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: December 8, 2020
    Assignee: Google LLC
    Inventors: Daniel Robert Adema, Timothy Paul Bodiya
  • Patent number: 10859780
    Abstract: Two bundle materials are provided on the outer periphery of a plurality of optical fibers. The bundle materials are twisted back while reversing the winding from front to back and vice versa to thus wind the bundle materials around the plurality of optical fibers. That is, the bundle materials are not wound spirally around the plurality of optical fibers. The bundle materials are bonded at a bonding portion where both bundle materials intersect. The bonding portion is provided along a center line of an optical fiber unit. The bundle materials are arranged in ranges which are each approximately 180° and partitioned by the center line.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: December 8, 2020
    Assignees: FURUKAWA ELECTRIC CO., LTD., NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Tomohiro Ishimura, Yutaka Hoshino, Shinya Hamaguchi, Naoki Nakagawa, Yohei Endo, Yukihiko Shibata, Yuji Aoyagi
  • Patent number: 10859212
    Abstract: Methods, systems, and techniques for determining whether an acoustic event has occurred along a fluid conduit having acoustic sensors positioned therealong. The method uses a processor to, for each of the sensors, determine a predicted acoustic signal using one or more past acoustic signals measured prior to measuring a measured acoustic signal using the sensor; determine a prediction error between the measured acoustic signal and the predicted acoustic signal; from the prediction error, determine a power estimate of an acoustic source located along a longitudinal segment of the fluid conduit overlapping the sensor; and determine whether the power estimate of the acoustic source exceeds an event threshold for the sensor. When the power estimate of at least one of the acoustic sources exceeds the event threshold, the processor attributes the acoustic event to one of the sensors for which the power estimate of the acoustic source exceeds the event threshold.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: December 8, 2020
    Assignee: Hifi Engineering Inc.
    Inventors: Seyed Ehsan Jalilian, Arne Dankers, David Westwick
  • Patent number: 10852476
    Abstract: A semiconductor package includes a photonic integrated circuit, an encapsulating material, and a redistribution structure. The photonic integrated circuit includes a coupling surface, a back surface opposite to the coupling surface and a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers. The encapsulating material encapsulates the photonic integrated circuit and revealing the plurality of optical couplers. The redistribution structure is disposed over the encapsulating material and the back surface of the photonic integrated circuit, wherein the redistribution structure is electrically connected to the photonic integrated circuit.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 10845555
    Abstract: An optical module includes a laser light supply system and a chip disposed within a housing. The chip includes a laser input optical port and a transmit data optical port and a receive data optical port. The optical module includes a link-fiber interface exposed at an exterior surface of the housing. The link-fiber interface includes a transmit data connector and a receive data connector. The optical module includes a polarization-maintaining optical fiber connected between a laser output optical port of the laser light supply system and the laser input optical port of the chip. The optical module includes a first non-polarization-maintaining optical fiber connected between the transmit data optical port of the chip and the transmit data connector of the link-fiber interface. The optical module includes a second non-polarization-maintaining optical fiber connected between the receive data optical port of the chip and the receive data connector of the link-fiber interface.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Ayar Labs, Inc.
    Inventors: John Fini, Roy Edward Meade, Mark Wade, Chen Sun, Vladimir Stojanovic, Alexandra Wright
  • Patent number: 10845549
    Abstract: An apparatus, method, and system for connecting optical fibers, commonly used in medical instruments, for use in endoscopy, non-evasive treatments of disease, as well as other medical factions incorporating optical fibers, wherein the novel connector allows for rotation of at least one optical fiber within the connector.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 24, 2020
    Assignee: Canon U.S.A., Inc.
    Inventors: Anderson Thi Mach, Tzu-Yu Wu, Alexander Altshuler
  • Patent number: 10845559
    Abstract: The present disclosure provides a flame retardant optical fiber cable. The flame retardant optical fiber cable includes a plurality of bundle binders. In addition, the flame retardant optical fiber cable includes a first layer, a second layer, a third layer, a fourth layer, a fifth layer, a sixth layer, a seventh layer and an eighth layer. The first layer surrounds a plurality of bundle binders. The second layer surrounds the first layer. The third layer surrounds the second layer. The fourth layer surrounds the third layer. The fifth layer surrounds the fourth layer. The sixth layer surrounds the fifth layer. The seventh layer surrounds the sixth layer. The eighth layer surrounds the seventh layer.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: November 24, 2020
    Assignee: STERLITE TECHNOLOGIES LIMITED
    Inventors: Kishore Sahoo, Venkatesh Murthy, Dnyaneshwar Wagh, Sunil Senapati, Ashutosh Pandey
  • Patent number: 10838155
    Abstract: The optical fiber coupler array can be capable of providing a low-loss, high-coupling coefficient interface with high accuracy and easy alignment between a plurality of optical fibers (or other optical devices) with a first channel-to-channel spacing, and an optical device having a plurality of closely-spaced waveguide interfaces with a second channel-to-channel spacing, where each end of the optical fiber coupler array can be configurable to have different channel-to-channel spacing, each matched to a corresponding one of the first and second channel-to-channel spacing. Advantageously, the refractive indices and sizes of both inner and outer core, and/or other characteristics of vanishing core waveguides in the optical coupler array can be configured to reduce the back reflection for light propagating from the plurality of the optical fibers at the coupler first end to the optical device at the coupler second end, and/or vice versa.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: November 17, 2020
    Assignee: Chiral Photonics, Inc.
    Inventors: Victor Il'ich Kopp, Jongchul Park, Jonathan Singer, Daniel Neugroschl
  • Patent number: 10838160
    Abstract: An optical fiber cable with optical fiber sensing and communication functions includes an outer sheath layer, an inner sheath layer, communicating optical fibers, and sensing optical fibers. The communicating optical fibers are laid inside the inner sheath layer, the sensing optical fibers are laid between the inner sheath layer and the outer sheath layer, and an inner reinforcing member is filled in the inner sheath layer. An outer reinforcing member-is filled between the inner sheath layer and the outer sheath layer, and a plurality of cutting kerfs for slotting are provided on an outer side wall of the outer sheath layer along a length direction of the outer sheath layer. A manufacturing method includes processes of cable paying-off, molding, extruding to form sheath layers, making cutting kerfs, cooling and cable taking-up, etc., which has simple operation and low production costs.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: November 17, 2020
    Assignee: NANJING WASIN FUJIKURA OPTICAL COMMUNICATION LTD.
    Inventors: Xiaoquan Wang, Haibo Wu, Chenglong Zhang, Guo Zhao
  • Patent number: 10831080
    Abstract: An electro-optic modulator. The modulator is made as a plurality of discrete elements, and adjacent elements abut such that there are no free space optics between adjacent discrete elements. The modulator comprises a radio frequency, RF, element configured to modulate light passing through the element based on an electrical RF input. The plurality of discrete elements comprises a first set of discrete elements fabricated from thin film lithium niobate, TFLN, and a second set of discrete elements fabricated from silicon photonics, SiPh. The first set of discrete elements comprises the RF element.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: November 10, 2020
    Assignee: Lumentum Technology UK Limited
    Inventors: Marco Villa, Luigi Gobbi, Stefano Balsamo
  • Patent number: 10830967
    Abstract: An optical fiber connector for external connection to a telecommunications enclosure is described herein. The optical fiber connector has an assembly base having a first end and a second end, an optical connection portion disposed partially within the first end of the assembly base and a strain relief assembly disposed on the second end of the assembly base. The assembly base includes a body portion and a release portion which defines a release mechanism that causes the release portion to move relative to the body portion. The release portion includes at least one cam that is configured to release or disengage the at least one latch element when the release portion moves with respect to the body portion so that the optical fiber connector can be removed from the port of the telecommunication enclosure.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: November 10, 2020
    Assignee: Corning Research & Development Corporation
    Inventors: Nelson Goncalves Pimentel, Christine B. Bund, Johann G. Hajok
  • Patent number: 10823968
    Abstract: A waveguide display includes a first diffractive input waveguide operable to receive input data from a first projector and diffract image data associated with the first projector at a first angular offset and a second diffractive input waveguide operable to receive input data from a second projector and diffract image data associated with the second projector at a second angular offset. The waveguide display also includes a diffractive output waveguide optically coupled to the first diffractive input waveguide and the second diffractive input waveguide. The diffractive output waveguide receives the image data associated with the first projector and image data associated with the second projector and is operable to direct image data associated with the first projector toward a first field of view and direct image data associated with the second projector toward a second field of view.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: November 3, 2020
    Assignee: Magic Leap, Inc.
    Inventors: Brian T. Schowengerdt, Mathew D. Watson, Charles David Melville
  • Patent number: 10816696
    Abstract: The application relates to radars, and provides a chip with a beamforming network based on a photonic crystal resonant cavity tree structure and a fabrication method thereof. The chip includes a beamforming network layer, including an incidence coupling grating, first to Nth photonic crystal resonant cavity combinations, first to (N+1)th optical waveguides and an emergence coupling grating which are successively connected; branches of each photonic crystal resonant cavity combination is an integral multiple of that of the previous photonic crystal resonant cavity combination, and two photonic crystal resonant cavity combinations are connected by an optical waveguide.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: October 27, 2020
    Assignee: 38th Research Institute Of China Electronics Technology Group Corp.
    Inventors: Xueming Jin, Naidi Cui, Jin Guo, Junbo Feng, Yuankui Hu, Heng Zhao, Li Jin, Erdong Chen
  • Patent number: 10819096
    Abstract: An enclosure for breaking out a trunk cable includes: a base having a generally flat surface adapted for mounting to a mounting surface; a shell having a front and two side walls extending from opposite sides of the front and two opposed end walls, the side walls of the shell mounted to the base to form a cavity; a plurality of connectors mounted to each of the side walls; and a trunk cable routed into the cavity through one of the end walls, the trunk cable comprising a plurality of power conductors and/or a plurality of optical fibers. The power conductors and the optical fibers are connected with respective ones of the plurality of connectors.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: October 27, 2020
    Assignee: CommScope Technologies LLC
    Inventor: Chi-Ming Wang
  • Patent number: 10816745
    Abstract: An optical fiber pedestal box comprises a pedestal having a rail and an optical fiber box configured to mount to the pedestal. The optical fiber box is restricted in movement by at least one cable and the pedestal is configured to slide relative to the optical fiber box to accommodate cables moving because of ground heaving during freezing and thawing. The optical fiber pedestal box may be configured to receive different sizes and types of optical fiber cables.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: October 27, 2020
    Assignee: Clearfield, Inc.
    Inventors: John P. Hill, Todd M. Bade, Walter E. Power, II