Abstract: An assembly assembled by a plurality of sections put together, wherein the section includes an elongated structure having a left end and a right end, an optical fiber having a left end and a right end and extending from its left end to its right end so that: the left ends of the elongated structure and of the optical fiber are located on the same left side of the section, and the right ends of the elongated structure and of the optical fiber are located on the same right side of the section, each end of the optical fiber is enclosed in a junction box, the box of the right or left end of the optical fiber of the section being assembled with the junction box of the left end or right end of the optical fiber of another similar section to optically connect the optical fibers of two sections.

Abstract: Devices, assemblies, and methods for anchoring portions of telecommunications cables, including protective sheaths and strength members. In some examples, the devices and assemblies are adjustable to accommodate different sized cables and cable components. According to one embodiment, an assembly includes two members that cooperate via a ratcheting mechanism to adjust to different cable diameters, the assembly further including features adapted to anchor strength member yarn of a cable.

Abstract: An arrayed waveguide for a photonic integrated circuit has a single optical path with serially connected delay lines. Different delayed optical paths or channels are periodically split off from the serially connected optical delay path. This has the net result of requiring much less space on-chip for comparable optical path differences with high spectral resolution.

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

Abstract: A hologram display device includes a light source unit, a light guide plate, a spatial light modulator, a sensing unit, and a light source driving unit. The light source unit includes a plurality of light sources and emits light when at least one of the plurality of light sources is turned on. The light guide plate converts the light emitted thereto from the light source unit to a planar light beam. The spatial light modulator spatially modulates the planar light beam to produce a hologram image. The sensing unit senses a position of a user watching the hologram image, and the light source driving unit turns on the at least one of the plurality of light sources, based on information on the position of the user obtained by the sensing unit.

Abstract: The present disclosure relates to an easy-to-unlock optical module. The easy-to-unlock optical module includes an optical module body and a mechanism of a pull ring for unlocking or locking connection between the optical module body and a metal cage. The mechanism of the pull ring includes a cover plate and the pull ring arranged on the optical module body. A pivot part for pivotally connecting the optical module body, and a first rotating arm and a second rotating arm respectively located on front and rear sides of the pivot part are arranged on the cover plate, and a lock head protrusion for matching with a spring lock groove on the metal cage is formed in the first rotating arm. The pull ring is pivotally connected to the optical module body, an unlocking contact surface and a locking contact surface are formed in the pull ring.

Abstract: The present disclosure relates to an optical fiber or the like that can be adapted to an optical transceiver for a short wavelength band of 850 nm or more and 1060 nm or less while maintaining compatibility with an SMF of the related art. An optical fiber of one embodiment includes a core, a cladding, and a resin coating, and has a mode field diameter of 8.2 ?m or more and 9.6 ?m or less at a wavelength of 1310 nm, a cable cutoff wavelength of an LP11 mode of 1060 nm or more and 1260 nm or less, and a cable cutoff wavelength of an LP02 mode of 1060 nm or less.

Abstract: Devices, assemblies and methods for anchoring and tightening strength member yarn of a telecommunications cable. The strength member yarn is routed through channels defined in a cable fixation body and pulled into one or more recesses positioned between one of the channels and the cable jacket to tightly anchor the strength member yarn.

Abstract: An optical connector of the present invention includes a ferrule accommodating optical fibers, a flange integrated with the ferrule, a sleeve in which a pair of the ferrules are accommodated, and a connection component which is provided around the sleeve and includes a magnet or a metallic magnetic material, wherein at least one of the connection component and the flange includes a magnet, and an attractive force acts on the connection component and the flanges, whereby cores of the opposing optical fibers come into close contact with each other. As a result, the optical connector of the present invention can provide the present physical contact connection and can provide a smaller optical connector.

Abstract: A fiber optic connector has a fiber optic connector shutter that rotates about a first axis and an adapter for the fiber optic connector also has an adapter shutter that rotates about a second axis in the adapter. When the fiber optic connector and the adapter are mated to one another, the axes for the fiber optic connector shutter and the adapter shutter are aligned and the fiber optic connector shutter and the adapter shutter rotate about a single axis. The fiber optic connector shutter and the adapter shutter include structure to maintain engagement during the mating and un-mating of the fiber optic connector and the adapter.

Abstract: A method includes receiving a plurality of quantum systems, wherein each quantum system of the plurality of quantum system includes a plurality of quantum sub-systems in an entangled state, and wherein respective quantum systems of the plurality of quantum systems are independent quantum systems that are not entangled with one another. The method further includes performing a plurality of joint measurements on different quantum sub-systems from respective ones of the plurality of quantum systems, wherein the joint measurements generate joint measurement outcome data and determining, by a decoder, a plurality of syndrome graph values based on the joint measurement outcome data.

Abstract: A cable enclosure assembly includes an enclosure, a cable spool and a length of fiber optic cable. The enclosure defines an interior region, a first opening and a second opening aligned with the first opening. The first and second openings provide access to the interior region. The cable spool is disposed in the interior region of the enclosure and is rotatably engaged with the enclosure. The cable spool includes a drum and a flange engaged to the drum. The flange has an outer peripheral side, a cable management portion and an adapter bulkhead portion. The adapter bulkhead portion extends outwardly from the cable management portion and forms a portion of the outer peripheral side. The length of the fiber optic cable is dispose about the drum of the cable spool.

Abstract: An optical bench subassembly including an integrated photonic device. Optical alignment of the photonic device with the optical bench can be performed outside of an optoelectronic package assembly before attaching thereto. The photonic device is attached to a base of the optical bench, with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports an array of optical fibers in precise relationship to a structured reflective surface. The photonic device is mounted on a submount to be attached to the optical bench. The photonic device may be actively or passively aligned with the optical bench. After achieving optical alignment, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly may be structured to be hermetically sealed as a hermetic feedthrough, to be hermetically attached to a hermetic optoelectronic package.

Abstract: The disclosed systems, structures, and methods are directed to antennas for integration with a display structure which has a plurality of pixels arranged in pixel rows with an inter-pixel spacing, and a feeding line located in the inter-pixel spacing. The display structure also has an antenna which comprises a slotted waveguide and a substrate. The slotted waveguide is located in the inter-pixel spacing and defines a plurality of slots configured to radiate electromagnetic waves. The substrate is attached to the slotted waveguide and is located between the feeding line and the slotted waveguide. The antenna may also include a plurality of slotted waveguides superposing on different feeding lines of the display structure.

Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.

Abstract: A multilayer stack comprises a surface wherein a predetermined region is defined for enclosing a device provided on the multilayer stack, the region being encircled by a welding zone defined on the surface, the welding zone being suitable for being welded by a welding radiation beam to a capping structure. It also comprises a first layer embedded within the multilayer stack, including at least one embedded component suitable for being functionally connected to the device provided on the multilayer stack. It furthermore comprises at least a second layer over the first layer comprising a shielding structure positioned between the at least one component of the first layer and the welding zone defined on the surface, the shielding structure being adapted to limit the welding depth of the welding radiation beam provided on the welding zone.

Abstract: Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.

Abstract: Aspects of the present disclosure describe methods for reducing guided acoustic wave Brillouin (GAWBS) noise in an optical fiber that may be included in an optical communications system by reducing the polarization diffusion length of the fiber by increasing the birefringence of the optical fiber, the increased birefringence of the optical fiber being increased with respect to its average magnitude. Additionally, the polarization diffusion length is reduced by reducing the coherence length of birefringence of the optical fiber.

Abstract: The disclosed subject matter relates generally to photonic integrated circuit chips, semiconductor assemblies or packagings, and a method of forming the same. More particularly, the present disclosure relates to placement of optical fibers on a photonics chip, and a semiconductor assembly including the photonics chip.

Abstract: An optical interface assembly, comprising a lens, an optical receptacle, a stub disposed in the optical receptacle. The lens includes a convex surface farther away from the stub and a flat surface near the stub, the flat surface and a cross section of the lens being disposed at an inclined angle from each other. A first end surface of the stub facing the lens is disposed at an inclined angle relative to an axis of the stub. When a light beam is coupled into the stub by the lens, a portion of a return light reflected from the first end surface of the stub is reflected to an outside of the lens.