Patents Examined by Tai Van Nguyen
  • Method of manufacturing piezoelectric device
    Patent number: 7200907
    Abstract: Exemplary embodiments of the present invention provide a method of manufacturing a piezoelectric device that includes a piezoelectric layer having high crystallinity in which crystal orientation is aligned to a desired direction, a method of manufacturing a ferroelectric device that includes a ferroelectric layer having the similar high crystallinity, and so forth. Exemplary embodiments include an insulating layer composed of SiO2 and so forth and a buffer layer composed of strontium oxide (SrO) and so forth are formed on a substrate such as a silicon single crystal wafer in sequence, and then a lower electrode composed of strontium ruthenate (SRO) is formed on the buffer layer. By forming self-assembled monolayers on the lower electrode, high affinity regions A1 and low affinity regions A2 are formed. Then, piezoelectric layers are selectively formed only on the high affinity regions A1.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: April 10, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Atsushi Takakuwa, Takamitsu Higuchi, Setsuya Iwashita
  • Method of manufacturing a heated windshield
    Patent number: 7200921
    Abstract: A method of making a windshield having first and second outer layers and a conductive bar, an electrical connector, and an intermediate layer positioned between the outer layers. The method includes the step of sinking the conductive bar and the electrical connector into a surface of the intermediate layer so as to be at least substantially flush with the surface. After sinking the conductive bar and the electrical connector into the surface, the first outer layer is engaged with the surface of the intermediate layer. Additionally, the second outer layer is engaged with a second surface of the intermediate layer.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 10, 2007
    Assignee: Automotive Components Holdings, LLC
    Inventor: Joseph M. Loibl
  • Method for fabricating a thin film magnetic head
    Patent number: 7197814
    Abstract: A writing magnetic pole portion composed of a first magnetic film and a second magnetic film formed on the first magnetic film via a gap film is fabricated on a given wafer. Then, the writing magnetic pole portion is swung forward and backward around a rotation standard axis parallel to a center line of the writing magnetic pole portion in a direction parallel to a surface of the. Then, the writing magnetic pole portion is milled during the swing of the writing magnetic pole portion to define the width of the writing magnetic pole portion.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: April 3, 2007
    Assignee: TDK Corporation
    Inventors: Taro Oike, Makoto Yoshida, Tetsuo Miyazaki, Shin Narushima, Hiroyuki Miyamoto
  • Method for manufacturing a piezoelectric device
    Patent number: 7197799
    Abstract: A method is provided for effectively manufacturing a piezoelectric device equipped with a piezoelectric film with a crystal orientation that is aligned in a desired direction. An interlayer that is bi-axially oriented is formed on a surface of a substrate by conducting ion beam assisted laser ablation in a disposition in which a center axis of an ablation plume to be irradiated is angled at approximately 55 degrees to a direction normal to the substrate. A lower electrode is formed on the interlayer. A piezoelectric film is formed on the lower electrode. An upper electrode is formed on the piezoelectric film. The lower electrode and the piezoelectric film are formed by epitaxial growth.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: April 3, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Takamitsu Higuchi, Setsuya Iwashita, Hiromu Miyazawa
  • Method of making a high impedance surface
    Patent number: 7197800
    Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: April 3, 2007
    Assignee: HRL Laboratories, LLC
    Inventors: Daniel F. Sievenpiper, Joseph L. Pikulski, James H. Schaffner, Tsung-Yuan Hsu
  • Method of assembling an electric power
    Patent number: 7197819
    Abstract: A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also including a bracket adapted to accommodate and constrain a rigid conductive member. A power circuit card having an electrical terminal is placed into the housing and a rigid conductive member into the bracket. The rigid conductive member is flow soldered to the electrical terminal, thereby exposing the heat resistant housing to heat and creating a solder bond. Finally, the rigid conductive member is affirmatively connected to the housing. The bracket constrains the rigid conductive member so that the act of affirmatively connecting does not weaken the solder bond.
    Type: Grant
    Filed: December 18, 2004
    Date of Patent: April 3, 2007
    Assignee: Rinehart Motion Systems, LLC
    Inventors: Lawrence E. Rinehart, Guillermo L. Romero
  • Method for use in forming a read sensor for a magnetic head
    Patent number: 7194797
    Abstract: Methods for use in forming a CPP read sensor for a magnetic head are disclosed. In a particular example, a plurality of read sensor layers are formed over a first shield layer and a resist without undercuts is formed over the plurality of read sensor layers in a central region. With the resist in place, read sensor materials in side regions adjacent the central region are removed by milling to thereby form a read sensor structure in the central region. Insulator materials and metallic seed materials are then deposited in the side regions. High angle ion milling is performed to reduce a thickness of the insulator materials, the metallic seed materials, or both, along sidewalls of the read sensor structure. Magnetic hard bias materials are subsequently deposited over the metallic seed materials, and a second shield layer is formed over the structure after the resist is removed.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: March 27, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: Mustafa Michael Pinarbasi
  • Method for creating a magnetic head
    Patent number: 7194796
    Abstract: A magnetic head and method for forming the same. Leads are added to a wafer stack having a free layer, a bias layer, and a spacer layer between the free layer and bias layer. A gap is formed between the leads. A protective layer is added to the wafer stack such that the gap is covered, as well as facing ends of the leads. Material is removed from at least one side area of the wafer stack using the protective layer as a mask. The protective layer is removed. A portion of the bias layer below the gap is processed for reducing a magnetic moment of the bias layer in the portion of the bias layer below the gap for forming a sensor in which magnetic moments of end portions of the free layer are pinned by magnetic moments of end portions of the bias layer, and preferably antiparallel thereto.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: March 27, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Kim Y. Lee, Jih-Shiuan Luo
  • Method for use in making a write coil of magnetic head
    Patent number: 7194798
    Abstract: Methods suitable for use in making a write coil of a magnetic head includes the steps of forming a seed layer made of ruthenium (Ru) over a substrate; forming, over the seed layer, a patterned resist having a plurality of write coil trenches patterned therein; electroplating electrically conductive materials within the plurality of write coil trenches to thereby form a plurality of write coil layers; removing the patterned resist; and performing a reactive ion etch (RIE) in ozone gas (O3) for removing exposed seed layer materials in between the plurality of write coil layers. Advantageously, the write coil layers remain undamaged from the RIE in the ozone gas. Other structures may be fabricated in a similar manner.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: March 27, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Christian René Bonhôte, Quang Le
  • Method of producing a wireless communication device
    Patent number: 7191507
    Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: March 20, 2007
    Assignee: Mineral Lassen LLC
    Inventors: Ian J. Forster, Patrick F. King
  • Method of optmizing inkjet printheads using a plasma-etching process
    Patent number: 7191520
    Abstract: A method for creating an inkjet chamber. The method comprises the steps of firstly providing a substrate having a nozzle opening and secondly etching the substrate through the nozzle opening by alternating between anisotropic and isotropic etching processes for forming a chamber having a shape approximating a cylinder by using multiple hemispheric etches.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: March 20, 2007
    Assignee: Eastman Kodak Company
    Inventors: Lingadahalli G. Shantharama, John A. Lebens, Thomas M. Stephany
  • Method of producing nozzle plate formed in-situ on printhead substrate
    Patent number: 7188419
    Abstract: A method of producing an ink jet printhead with a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Conveniently, a thin nozzle plate is formed in-situ on the wafer substrate. Depositing a nozzle plate by chemical vapor deposition (CVD) allows the nozzle plate to be included in the printhead at the scale of normal silicon wafer production, using processes normally used for semi-conductor manufacture. Standard lithographic equipment used in the modern semiconductor industry provides a high throughput as well as a high degree of accuracy.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: March 13, 2007
    Inventor: Kia Silverbrook
  • Method for forming a magnetic head having a flux shaping layer
    Patent number: 7185415
    Abstract: A method for fabricating a magnetic head includes forming a first pole and a flux shaping layer in spaced relation to the first pole. A nonmagnetic layer is formed adjacent the flux shaping layer and positioned on an air bearing surface (ABS) side of the flux shaping layer. A tapered recess is created in the nonmagnetic layer, the taper of the recess increasing (i.e., becoming deeper) towards the flux forming layer. The recess is filled with a magnetic material. A probe layer is formed such that it is in electrical communication with the magnetic material filling the recess.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: March 6, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Gautam Khera, Sanford J. Lewis, Galina Moutchaidze, Aron Pentek, Hugo Alberto Emilio Santini, Mason Lamar Williams, III
  • Process for protecting a magnetic head
    Patent number: 7181826
    Abstract: A system and method are provided for manufacturing a magnetic head. Initially, a coil structure, a first pole layer, and a gap layer are formed. A second pole layer is then deposited to form a pair of flanking portions flanking a central portion of the second pole layer. Thereafter, the second pole layer is masked with a photoresist layer. During manufacture, the flanking portions of the second pole layer work in conjunction with the photoresist layer to substantially protect the coil structure from damage.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: February 27, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Wenchein Hsiao, Edward Hin Pong Lee, Bradley D. Webb
  • Method of mounting an electronic part
    Patent number: 7181833
    Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: February 27, 2007
    Assignee: TDK Corporation
    Inventors: Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko, Toshinobu Miyagoshi
  • Method and mechanism of PZT micro-actuator attachment for the hard disk driver arm
    Patent number: 7181825
    Abstract: A fixture with a shaped molding may hold a first micro-actuator part and a second micro-actuator part in place for coupling while maintaining the structure of the first micro-actuator part. The first micro-actuator part and the second micro-actuator part may be a frame or a strip of piezoelectric material. A vacuum nozzle system embedded in the fixture may hold the first micro-actuator part in place. A mobile vacuum nozzle system may hold the second micro-actuator in place and positions the second micro-actuator part relative to the first micro-actuator part. A camera system may monitor the process. A dispense may apply epoxy between the first and second micro-actuator part. An ultraviolet source may provide ultraviolet radiation for curing.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: February 27, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ming Gao Yao, Masashi Shiraishi, Yi Ru Xie
  • Method of forming magnetic layer pattern
    Patent number: 7181827
    Abstract: Provided is a method of manufacturing a thin film magnetic head capable of achieving compatibility between preventing the occurrence of side erasing and securing overwrite characteristics. When a pole portion layer as a portion where a magnetic flux is emitted is formed, a photoresist pattern is formed so that two frame portions which determine an aperture have a different width from each other, and then the photoresist pattern is heated to deform the frame portions. Thereby, the width of the aperture is gradually reduced toward a seed layer. After that, a precursor pole portion layer is formed in the aperture of the photoresist pattern, and the precursor pole portion layer is polished so as to form an air bearing surface, thereby the pole portion layer is formed so that an exposed surface exposed to the air bearing surface has an asymmetrical inverted trapezoidal shape.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: February 27, 2007
    Assignee: TDK Corporation
    Inventor: Akifumi Kamijima
  • Method of forming a thin film magnetic head
    Patent number: 7178221
    Abstract: In a thin-film magnetic head having a multilayered film developing a magnetoresistive effect, which is present between an upper shielding layer and a lower shielding layer both formed above an AlTiC substrate, a recess for defining the lower shielding layer is formed in an underlayer present on a surface of the AlTiC substrate, and a lower shielding layer made of NiFe is provided in the recess. A SiO2 film is interposed between the underlayer and the lower shielding layer.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: February 20, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventor: Kiyoshi Sato
  • Method of manufacturing a liquid jet recording head
    Patent number: 7171748
    Abstract: Disclosed is a manufacturing method of a liquid jet recording head which includes a forming step of forming a recess portion between a flexible film wiring board and a recording element board, a providing step of providing in the recess portion an electrical connecting portion for electrically connecting the flexible film wiring board and the recording element board, a membrane curing step of injecting first resin into the recess portion to cure the first resin in a membrane form, and a covering step of covering an upper portion of the electrical connecting portion and the first resin with second resin subsequent to the membrane curing step. The electrical connecting portion is protected against liquid droplets and the like, and its electrical reliability is improved.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: February 6, 2007
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroyuki Kigami, Manabu Tanimoto, Noaki Nakajo, Junichiro Iri
  • Method of producing inkjet printhead with lithographically formed nozzle plate
    Patent number: 7168166
    Abstract: A method of producing an ink jet printhead with a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Conveniently, a thin nozzle plate is formed in-situ on the wafer substrate. Depositing a nozzle plate by chemical vapor deposition (CVD) allows the nozzle plate to be included in the printhead at the scale of normal silicon wafer production, using processes normally used for semi-conductor manufacture. Standard lithographic equipment used in the modern semiconductor industry provides a high throughput as well as a high degree of accuracy.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: January 30, 2007
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook