Patents Examined by Tai Van Nguyen
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Patent number: 7134183Abstract: The method of making a thin-film magnetic head in accordance with the present invention forms a cover layer on an insulating layer about a magnetoresistive film so as to eliminate a protrusion riding on the magnetoresistive film. Then, the protrusion can be eliminated by etching. The part of insulating layer clad with the cover layer is not etched. This can prevent short-circuit from occurring because of thinning the insulating layer.Type: GrantFiled: November 10, 2003Date of Patent: November 14, 2006Assignee: TDK CorporationInventors: Kazuki Sato, Takeo Kagami
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Patent number: 7134171Abstract: A solid state angular rate sensor is fabricated by preparation of a disc-shaped base structure (10) having first and second outer layers of a piezo-electric ceramic material, built up from a number of layers of a ceramic sheet or film that is capable of being tape-cast. The layers are then sintered and an inner layer of metallic material is provided between the outer layers, to complete a piezo-electric base structure having an inner electrode (15) between the sintered outer layers. Arrays of electrode structures are provided on the outer layers of the base structure (10), the electrodes radiating from the central region 14 of the base structure (10) and being equi-spaced around the outer edge of the disc (19).Type: GrantFiled: September 9, 2002Date of Patent: November 14, 2006Assignee: European Technology for Business LimitedInventor: Diana Hodgins
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Patent number: 7134182Abstract: Conventional liftoff processes used to define track width in magnetic read heads can produce an uneven etch-depth of dielectric materials around the sensor and cause shorting to the overlay top lead layer. This problem has been overcome by printing the images of track width and stripe height onto an intermediate layer to form a hard mask. Through this hard mask, the GMR stack can be selectively etched and then back-filled with a high-resistivity material by using newly developed electroless plating processes.Type: GrantFiled: November 17, 2003Date of Patent: November 14, 2006Assignee: Headway Technologies, Inc.Inventors: Jei-Wei Chang, Chao-Peng Chen, Youfeng Zheng
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Patent number: 7131185Abstract: A method for manufacturing a magnetic recording medium, including the steps of applying a magnetic coating containing ferromagnetic powder and a binder onto a nonmagnetic band-shaped flexible base material to be transferred to form a magnetic layer, and grinding the magnetic layer continuously with a grinding wheel on the downstream side of transfer, wherein a cleaning device which cleans a grindstone of the grinding wheel is additionally provided in close proximity of the grinding wheel to clean the grindstone during the grinding operation.Type: GrantFiled: March 18, 2005Date of Patent: November 7, 2006Assignee: Fuji Photo Film Co., Ltd.Inventors: Shigemi Kato, Hideo Kawamura
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Patent number: 7127796Abstract: A method of manufacturing a waveguide includes forming two waveguide units, each waveguide unit having a channel defined by a bottom wall and two side walls generally transverse to the bottom wall, flanges extending from the side walls, outside the groove, transverse to the side walls and generally parallel to the bottom wall, the flanges including though holes; joining the two waveguide units to each other so that the flanges of a first of the waveguide units abut the flanges of a second of the waveguide units, with the grooves forming a channel for guiding waves; and, by insert molding, forming a thermoplastic resin cover that fills the through holes in the flanges and covers both of the first and second waveguide units, at least partially.Type: GrantFiled: June 10, 2002Date of Patent: October 31, 2006Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Muneaki Mukuda, Takayuki Inuzuka, Naosi Yamada, Hideki Asao, Kazuhisa Henmi
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Patent number: 7124485Abstract: A method of manufacturing a piezoelectric thin film resonator forms, after forming a piezoelectric film on a substrate so as to cover a lower electrode formed on the substrate, a resist layer so as to cover the piezoelectric film, forms a mask composed of the resist layer on the piezoelectric film by forming, in the resist layer, an exposure hole for exposing a formation part of an upper electrode on the piezoelectric film, forms an electrode material layer for forming the upper electrode on the piezoelectric film exposed via the exposure hole and on the mask, and then forms the upper electrode by removing the electrode material layer on the mask by removing the mask.Type: GrantFiled: April 7, 2004Date of Patent: October 24, 2006Assignee: TDK CorporationInventor: Eiju Komuro
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Patent number: 7124498Abstract: A non-magnetic material layer which is formed with a taper region of which the film thickness is gradually reduced over the top surface and the side of an upper core layer and the side of the gap layer is formed by cutting the gap layer and the upper core layer on a lower core layer with a track width and the lower periphery of the taper region is contacted with the top surface of the lower core layer. On the top surface of the lower core layer extending from the lower periphery of the taper region to the both sides, the slopes inclined in the direction apart from the upper core layer are formed and a protrusion having a track width is formed on the lower core layer. The material layer having the same material as the lower core layer adhered to the outside of the non-magnetic material layer is removed.Type: GrantFiled: May 12, 2005Date of Patent: October 24, 2006Assignee: Alps Electric Co., Ltd.Inventor: Kiyoshi Sato
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Patent number: 7120988Abstract: A method and materials to fabricate a trailing shield write pole that resolve the problems of controlling the write gap and preventing damages to the write gap or pole during fabrication of the subsequent structure. This process also introduces a CMP assisted lift-off process to remove re-deposition and fencing (increase yields) and a method to create dishing in the top of the write pole. Moreover, also included in this disclosure are suitable materials that can function as an ion mill transfer layer, CMP layer, and RIEable layer.Type: GrantFiled: September 26, 2003Date of Patent: October 17, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Quang Le, Edward Hin Pong Lee, Jui-Lung Li, Aron Pentek, Nian-Xiang Sun
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Patent number: 7120997Abstract: A connector axial compression tool having a lever end and a cable end, with a body slidably supporting a cradle in a cavity formed in the body. The cradle is slidable via a handle which pivots about the body, linked to the cradle by a lever mechanism. The cradle has a shoulder clamp adapted to mate with a connector body. Operation of the handle moves the cradle towards and away from a cable end of the cavity, against a cable clamp through which the cable may pass but against which a cable clamp sleeve of the connector abuts, axially compressing the connector to couple it to the cable. Because the shoulder clamp holds the connector body rather than pressing against the connector interface, a wide range of different connectors may be used with the same tool, without causing damage to the connector interface of the various connectors.Type: GrantFiled: July 30, 2004Date of Patent: October 17, 2006Assignee: Andrew CorporationInventors: Nahid Islam, Joon Lee, David John Ball, Rodger Burke
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Patent number: 7117572Abstract: A method of making a drop emitting device that includes a fluid channel layer, a diaphragm layer having a laser ablated bonding region, and a plurality of electrical components attached to the laser ablated bonding region.Type: GrantFiled: January 13, 2005Date of Patent: October 10, 2006Assignee: Xerox CorporationInventor: J. Kirk McGlothlan
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Patent number: 7117597Abstract: A method of manufacturing a liquid discharge head provided with a liquid flow path communicating with a liquid discharge port on a substrate has a step of forming a first electrically conductive layer on the substrate, a step of forming a molding member into the pattern shape of the flow path on the substrate, a step of forming a second electrically conductive layer on the molding member so as not to contact with the first electrically conductive layer, a step of forming a metal film by a plating process around the molding member by the utilization of the first electrically conductive layer and the second electrically conductive layer, and a step of removing the molding member and forming the flow path.Type: GrantFiled: August 4, 2005Date of Patent: October 10, 2006Assignee: Canon Kabushiki KaishaInventor: Takehito Nishida
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Patent number: 7114247Abstract: A method of making an electrical connector comprises the steps of: forming an electrically conductive member having a body including an interface, the body having a longitudinal chamber therein; forming an electrically conductive pin; overmolding the interface with a first electrically insulating material; overmolding at least a part of the electrically conductive pin with a second electrically insulating material to form an overmolded electrically conductive pin; and inserting the overmolded electrically conductive pin into the longitudinal chamber.Type: GrantFiled: October 27, 2004Date of Patent: October 3, 2006Assignee: OSRAM Sylvania Inc.Inventors: Michael J. Swantner, Douglas G. Seymour, Shane Brown
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Patent number: 7114244Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs and spacers to be stacked, disc pushers which are slidably provided outside the hub unit and include corresponding pressure members which center the discs by pushing circumferences of the discs, a driving unit which slides the disc pushers, and biasing units which are slidably provided outside the hub unit and push circumferences of the spacers. Accordingly, by performing a spacer biasing along with a disc centering, the accuracy of a centering is increased, thereby providing the discs having data recorded thereon with a uniform quality. Additionally, vibration of a rotation body can be minimized due to the simple configuration of the disc centering device. Furthermore, the productivity and manufacturability of HDDs are improved in view of the simplified maintenance and repair of the same.Type: GrantFiled: October 2, 2003Date of Patent: October 3, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Ki-keon Yeom, Sang-jin Choi, Young-kun Kwon, Hyun-jin Lee, Dong-ok Kwak
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Patent number: 7111385Abstract: A method for improving hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a first layer of silicon and a second layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.Type: GrantFiled: September 30, 2003Date of Patent: September 26, 2006Assignee: Hitachi Global Storage TechnologiesInventors: Phong V. Chau, James Mac Freitag, Mustafa Michael Pinarbasi, Hua Ai Zeng, Howard Gordon Zolla
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Patent number: 7107667Abstract: A first and a second longitudinal bias-applying films are formed via a first mask at both sides of a magnetoresistive effective element film so that the difference in surface level between the magnetoresistive effective element film and the first and the second longitudinal bias-applying films is set within ±20 nm. Then, a first and a second electrode films are formed so as to cover edge portions of the magnetoresistive effective element film and the first and the second longitudinal bias-applying films.Type: GrantFiled: April 20, 2004Date of Patent: September 19, 2006Assignee: TDK CorporationInventors: Noriyuki Ito, Kosuke Tanaka, Koichi Terunuma
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Patent number: 7107675Abstract: Methods for preventing disengagement of electrical connectors in computers are disclosed herein. A method in accordance with one embodiment of the invention includes securing a bracket of a retaining device to an electrical component in a computer. The method further includes installing an electrical connector into a receptacle on the electrical component, and positioning a retainer portion of the retaining device at least approximately adjacent to an outwardly facing surface of the electrical connector. In this embodiment, the retainer portion of the retaining device is operatively connected to the bracket of the retaining device. Positioning the retainer portion in this manner prevents the connector from disengaging from the electrical component.Type: GrantFiled: August 23, 2004Date of Patent: September 19, 2006Assignee: Micron Technology, Inc.Inventor: Craig L. Boe
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Patent number: 7103949Abstract: A method for fabricating a transducer suitable for a fluidic drive for a miniature acoustic-fluidic pump or mixer that includes an acoustic transducer attached to an exterior or interior of a fluidic circuit or reservoir. The transducer converts radio frequency electrical energy into an ultrasonic acoustic wave in a fluid that in turn generates directed fluid motion through the effect of acoustic streaming. The method includes depositing a piezo-electric thin-film onto a platinum coated silicon wafer or substrate with capping electrodes, defining each separate transducer; and dicing said piezoelectric tin-film to provide individual transducers.Type: GrantFiled: January 6, 2003Date of Patent: September 12, 2006Assignee: The United States of America as represented by the Secretary of the NavyInventors: Jack C. Rife, Michael I. Bell, James Horwitz, Milton N. Kabler
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Patent number: 7096548Abstract: Disclosed is a manufacturing method of an integrated capacitor including: forming a hole in a semiconductor substrate; depositing a dielectric film on an inner face of the formed hole; heat-treating the deposited dielectric film; depositing a silicon film on the dielectric film; embedding a resist film in the hole except an upper portion of the inner face of the hole on which the dielectric film and the silicon film are deposited; etching the silicon film on the heat-treated dielectric film with the embedded resist film as a mask; removing the resist film; removing the heat-treated dielectric film by etching with the silicon film remaining after the etching as a mask; and embedding an electrode material in the hole having the dielectric film remaining after the removal by etching, and the integrated capacitor.Type: GrantFiled: April 14, 2004Date of Patent: August 29, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Hiroki Sakurai, Hiroshi Tomita
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Patent number: 7093357Abstract: A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires outward at an angle of about 90 degrees, forming a flat portion on each of the pair of substantially round conductive wires by press extending at least the portion on the tip side from the bending point so as to be extended substantially parallel to a lead portion of the lead terminal, such that a thickness of the flat portion is less than a diameter of each of the pair of substantially round conductive wires, forming a cup-shaped holder portion by bending the flat portion inwards, holding both end portions of a piezoelectric element in a pair of the cup-shaped holder portions, and electrically and mechanically connecting the cup-shaped holder portions and the electrodes formed in both end portions of the piezoelectric element by using a conductive joining material.Type: GrantFiled: February 17, 2004Date of Patent: August 22, 2006Assignee: Murata Manufacturing Co., Ltd.Inventors: Masanobu Sugimori, Kenichi Nakamura
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Patent number: 7089638Abstract: A micromachined piezoelectric microspeaker and its fabricating method are disclosed. The micromachined piezoelectric microspeaker comprises a diaphragm and a plurality of contact pads. The diaphragm comprises an active area which is flat, and a non-active area which is wrinkled and surrounds the active area. The plurality of contact pads for electrodes are located outside of the diaphragm and over a wafer.Type: GrantFiled: July 27, 2004Date of Patent: August 15, 2006Inventors: Seung-Hwan Yi, Eun-Sok Kim