Abstract: The present invention relates to a variable insertion force circuit pack latching system comprising a latch assembly mounted on the front of a circuit pack and adapted to couple to a trough block mounted on a bay frame. The trough block has a hook-shaped tongue adapted to conversely couple to the latch assembly to secure the circuit pack in the installed position.

Abstract: A telecommunications module with a circuit board including pairs of connectors mounting on both sides of the circuit board held within a housing by structure that holds the circuit board offset from the front and rear of the module and connectors accessible openings in the rear wall of the module. A telecommunications patch panel including one or more modules mounted to the rear of a faceplate, each module with a circuit board including pairs of electrically linked connectors mounting on both sides of the circuit board held within the module by structure that holds the circuit board offset from the front and rear of the module with connectors accessible through a rear wall of the module and through the faceplate. A method of assembling a telecommunications module and a method of assembling a telecommunications patch panel including one or more modules attached to the rear of a faceplate.

Abstract: An electronic control unit (ECU) includes a flexible circuit substrate having a first partition interconnected to a third partition by a second, flexible partition. The electronic control unit further includes a rigidizer having a first partition interconnected to a third partition by a second partition. When the ECU is twice folded, the second, flexible partition of the circuit substrate assumes an approximate ‘U’-shape, resulting in a reduced cracking and splitting rate than the prior art. In various embodiments of the present invention, the assumption of a ‘U’-shaped fold in the second, flexible partition of the circuit substrate is facilitated by multiple apertures in a second rigidizer partition, by a depression in a second rigidizer partition, or by non-slidably affixing a first circuit substrate partition to a first rigidizer partition via a first adhesive and non-slidably affixing a third circuit substrate partition to a third rigidizer partition via a second adhesive.

Abstract: An apparatus and method for inserting and extracting printed circuit boards from a housing using screwing devices. A connector on the printed circuit board includes two tapped holes that cooperate with two threaded shafts held by the housing. The threaded shafts are operatively coupled to a common control shaft in such a way that rotating the control shaft in turn rotates the threaded shafts. Depending upon the rotation direction, the threaded shafts either screw or unscrew within the tapped holes so that the printed circuit board coupled to the connector is inserted or extracted.

Abstract: A housing for an electronic control device in vehicles comprises a bottom part (10) which has a metallic baseplate (12), and a cover part (14) made of plastic. The bottom part (10) has a front wall (16) made of plastic that rises up from the baseplate and to which a plug collar (18) is integrally molded. The plug collar (18) defines an accommodation for a contact pin carrier (28) formed as a flat strip with through holes for passing contact pins (32). The contact pin carrier (28) can be inserted into the plug collar (18) from inside of the housing.

Abstract: An invention relates to an apparatus for shielding an electronic circuit situated on a printed circuit board in an electrically conductive housing which has at least one opening and/or bushing, in which a shielding tube extends from the printed circuit board as far as the housing and encompasses the opening and/or the bushing, and a device for length equalization of the shielding tube forms an electrical contact of the shielding tube independently of tolerances between the printed circuited board and the housing.

Abstract: A field emission display panel that utilizes nanotube emitters as electron sources and is equipped with two cathodes i.e. a primary cathode and an auxiliary cathode, and an anode is provided. The nanotube emitters can be suitably formed by nanometer-dimensioned hollow tubes of carbon, diamond or diamond-like carbon mixed in a polymeric-based binder. The nanotube emitters are formed in two parallelly-positioned, spaced-apart rows on top of an electrode layer such as a silver paste by a thick film printing technique. Since both the primary cathode and the anode are formed on the bottom glass plate, the operating voltage can be controlled by the thickness of the dielectric layer that is used in forming the nanotube emitter stacks. An auxiliary cathode formed of an electrically conductive material is coated on the interior surface of a top glass plate to further repel electrons in a downward direction toward the anode on the bottom glass plate.

Abstract: An adapter for adapting a first circuit package to a second circuit packaging, includes a substrate for receiving the first circuit package thereon, a plurality of connectors disposed on the substrate configured in the form of the second circuit packaging, and interconnections on the substrate for interconnecting the first circuit package to the plurality of connectors. At least one electronic component may also be disposed on the substrate and interconnected with the first transceiver package and the second transceiver packaging. An insulator pad may be provided for electrically insulating the adapter circuitry from an electrical system circuit board on which the adapter is mounted. A metal cover provides a chassis ground.

Abstract: The invention relates to an adhesive joint which connects a body made of a first material to a plastic body. The adhesive joint is formed by an adhesive laminate which includes a flexible core layer made of acrylate and outer layers made of hot-melt adhesive which respectively adjoin the first body and the plastic body, and a transition layer is respectively arranged between the outer layers and the core layer.

Abstract: A shield member for an electronic apparatus comprises a contact portion that extends outwardly from the shield member. The shield member is attached to an electronic apparatus slot unit and spans between the slot unit and a radiation unit via the contact portion. The contact portion creates a grounding potential between the slot unit and the radiation member.

Abstract: Electric contact portions that contact terminals are formed for a first holder, and pressing portions are formed for a second holder to press terminals against the electric contact portions. In addition, provided for the pressing portions are a pair of first position regulators, which contact, at two places in the widthwise direction of the terminals, the outer walls of the terminals, and a pair of second position regulators, which, in the longitudinal direction of the terminals, contact the ends of the terminals.

Abstract: A method for securing a contact assembly to a frame in an integrated circuit socket via cold forming. A plurality of posts are integrally formed with and extend from the bottom surface of the frame of an integrated circuit device socket. The contact assembly includes a plurality of conductive columns mounted within an insulating sheet in a predetermined contact pattern. The insulating sheet also has a plurality of post receiving apertures that are selectively positioned such that the posts extend through corresponding apertures in the insulating sheet when the contact assembly is positioned in a mounting position on the bottom surface of the frame. The posts are cold staked to expand the diameter of the post ends and to secure the contact assembly to the frame.

Abstract: There is provided a fuse relay junction block for use in automobiles capable of not only considerably reducing the number of assembling process but also realizing small sized, lightweight compact block, thereby enhancing reliability and achieving a low cost material by aggregating the conventional plural pieces of boards to form a multilayered circuit structure. The fuse relay junction block comprises a box cover having a plurality of connection ports through which wirings of electronic wiring systems are connected to terminals of wiring members and a plurality of filling ports for fuses, a box body engaged in the box cover, a multilayered board housed between the box cover and the box body, wherein said wiring members being arranged on not less than two layers of board and integrated with primary molded portions by insert molding to form a network structure, said network structure is subjected to an insert to form a secondary molded portion.

Abstract: An SFP module includes a housing (1) and an ejector (70). An ejector seat (111) is formed in the housing for receiving the ejector. A triangular latch (114) is formed on the housing behind the ejector seat. The ejector includes a push bar (79) exposed forward of a front end (17) of the housing, and a tongue board (74). Two ejecting protrusions (741) are formed at a rear end of the tongue board, corresponding to a spring tab (611) of an SFP cage (6). The spring tab defines a retaining hole (613) for retaining the latch of the housing. When the SFP module is withdrawn from the cage, the push bar is pressed until the protrusions of the ejector have released the spring tab from the latch of the housing. The SFP module is then ejected from the cage by conventional spring means located in a rear of the cage.

Abstract: The present invention provides an apparatus for supporting electronic equipment. The electronic equipment comprises a groove, a first engagement mechanism and a second engagement mechanism. The apparatus comprises a main body, a first component and a second component. The main body has a turning spindle disposed within the groove. The first component and the second component locate on the main body. While the first component is coupled with the first engagement mechanism, the apparatus extends and the electronic equipment is vertical. While the second component is coupled with the second engagement mechanism, the apparatus retracts and the electronic equipment is horizontal.

Abstract: An electronics housing enabled to compensate for the accumulation of dimensional tolerances to enable reliable connection between one or more connectors mounted to internal electronic components and external connectors from one or more external devices. An alignment plate is provided that adapts an aperture in the housing to the connectors. The alignment plate is adapted to account for tolerance accumulation by being positional within the housing while substantially covering the space between the connectors and the housing aperture. The alignment plate in cooperation with an EMI a shield provides electromagnetic shielding about the connectors.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: The present invention provides for a self-aligned, panel mounted cord set, a method of manufacture therefor and an electronic equipment chassis employing the same. One end of the cord set is mounted in an aperture on a panel of an electronic equipment chassis (typically a back panel). The cord set self-aligns when mounted in the aperture to provide a mating connection with an electronic module housed in the chassis. In one embodiment of the invention the self-aligned panel mounted cord set has an elongated body with first and second opposing ends. Coupled to the first end is a power cord configured to mate with an electrical source, such as an AC wall outlet. Coupled to the second end is an electronic module connector configured to mate with the electronic module. About the elongated body is a flange with an alignment post thereon configured to align the elongated body with respect to the panel when positioned in the aperture.

Abstract: An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.

Abstract: A push-back circuit board frame on which a semiconductor device is mounted, including a circuit board, the board being detached from the frame and being returned to an original position in the frame, a cavity formed at an edge of the circuit board in the frame, a semiconductor chip mounted on the circuit board, a resin sealing the semiconductor chip on the circuit board, and a support base made of the same material as the resin, formed in the cavity, where all of the resin is formed simultaneously, and connected each other.