Abstract: Magnetic devices, magnetoresistive structures, and methods and techniques associated with the magnetic devices and magnetoresistive structures are presented. For example, a magnetic device is presented. The magnetic device includes a ferromagnet, an antiferromagnet coupled to the ferromagnet, and a nonmagnetic metal proximate to the ferromagnet. The antiferromagnet provides uniaxial anisotropy to the magnetic device. A resistance of the nonmagnetic metal is dependent upon a direction of a magnetic moment of the ferromagnet.

Abstract: A series of programming pulses are applied to a memory cell to be programmed. A program verify pulse, at an initial program verify voltage, is applied to the memory cell after each programming pulse. The initial program verify voltage is a verify voltage that has been increased by a quick charge loss voltage. The quick charge loss voltage is subtracted from the initial program verify voltage after either a programming pulse has reached a certain reference voltage or a quantity of programming pulses has reached a pulse count threshold.

Abstract: In one or more of the disclosed embodiments, a read operation is compensated for back pattern effect. A bit line current is generated by a read operation that biases the word lines. As part of a back pattern effect measurement phase, at predetermined time intervals an indication of the discharge status of the bit line is stored in a latch of a set of N latches coupled to each bit line. At the end of the measurement phase, the set of latches contains a multiple bit word that is an indication of the back pattern effect experienced by that particular series string of memory cells. This back pattern effect indication is used in subsequent read operations to adjust the timing of the operation.

Abstract: A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

Abstract: A flash memory device includes a memory cell array made up of memory cells arranged in rows and columns. A first page of data is programmed in selected memory cells of the memory cell array, and a second page of data is subsequently programmed in the selected memory cells. The first page of data is programmed using a program voltage having a first start value, and the second page of data is programmed using a program voltage having a second start value determined by a programming characteristic of the selected memory cells.

Abstract: A semiconductor apparatus includes an odd data clock buffer group configured to maintain or shift a phase of a multi-phase source clock signal, and output a first multi-phase clock signal, an even data clock buffer group configured to maintain or shift a phase of the multi-phase source clock signal, and output a second multi-phase clock signal, an odd data output buffer group configured to drive odd data in response to the first multi-phase clock signal and output the driven data to an odd data pad group, and an even data output buffer group configured to drive even data in response to the second multi-phase clock signal and output the driven data to an even data pad group, wherein the phases of clock signals of the first and second multi-phase clock signal are different from each other.

Abstract: A memory device includes a memory unit including a plurality of first conductive lines and a plurality of second conductive lines that cross the first conductive lines, and a driving unit module coupled with the plurality of the first conductive lines through respective ones of a plurality of contacts and coupled with and the plurality of the second conductive lines through respective ones of the plurality of contacts, wherein as the first conductive lines become farther from the driving unit module along a direction that the second conductive lines extend, the respective contacts of the first conductive lines have lower resistance values.

Abstract: The present disclosure provides a dual port static random access memory (SRAM) cell. The dual-port SRAM cell includes a first and second inverters cross-coupled for data storage, each inverter includes a pull-up device (PU) and a plurality of pull-down devices (PDs); a plurality of pass gate devices configured with the two cross-coupled inverters; and at least two ports coupled with the plurality of pass gate devices (PGs) for reading and writing, wherein each of PU, PDs and PGs includes a fin field-effect transistor (FinFET), a ratio between a number of PDs in the SRAM cell and a number of PGs in the SRAM cell is greater than 1, and a number of FinFETs in the SRAM cell is equal to or greater than 12.

Abstract: A data holding device according to the present invention includes a loop structure portion LOOP for holding data using a plurality of logic gates (NAND3 and NAND4) connected in a loop, a nonvolatile storage portion (NVM) for storing in a nonvolatile manner the data held in the loop structure portion (LOOP) by using the hysteresis characteristics of ferroelectric elements, a circuit separating portion (SEP) for electrically separating the loop structure portion (LOOP) and the nonvolatile storage portion (NVM), and a set/reset controller (SRC) for generating a set signal (SNL) and reset signal (RNL) based on data stored in the nonvolatile storage portion (NVM), wherein the plurality of logic gates are each set and reset to an arbitrary output logic level in accordance with the set signal (SNL) and reset signal (RNL).

Abstract: Methods, devices, and systems associated with memory cell operation are described. One or more methods of operating a memory cell include charging a capacitor coupled to the memory cell to a particular voltage level and programming the memory cell from a first state to a second state by controlling discharge of the capacitor through a resistive switching element of the memory cell.

Abstract: A nonvolatile semiconductor memory device comprises a plurality of memory blocks, each including a plurality of cell units and each configured as a unit of execution of an erase operation. Each of the cell units comprises a memory string, a first transistor, a second transistor, and a diode. The first transistor has one end connected to one end of the memory string. The second transistor is provided between the other end of the memory string and a second line. The diode is provided between the other end of the first transistor and a first line. The diode comprises a second semiconductor layer of a first conductivity type and a third semiconductor layer of a second conductivity type.

Abstract: A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell consisting essentially of one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. The device includes data sense circuitry coupled to the memory cell. The data sense circuitry comprises a word line coupled to the gate region and a bit output coupled to the source region or the drain region.

Abstract: A Registered DIMM (RDIMM) system with reduced electrical loading on the data bus for increases memory capacity and operation frequency. In one embodiment, the data bus is buffered on the DIMM. In another embodiment, the data bus is selectively coupled to a group of memory chips via switches.

Abstract: A device includes a backup power supply configured to provide power to an external system upon loss of primary system power, the backup power provided by at least one capacitor; logic to create, while the capacitor is available as the backup power supply to the external system, a transient elevation of the capacitor's stored potential above a upper predetermined operating potential of the capacitor; logic to obtain measurements of the capacitor's output voltage during the transient elevation of the capacitor's stored potential; and logic to determine a capacitance of the capacitor from the measurements; the device comprising multiple capacitors in series; logic to discharge each capacitor in series individually from the others; and logic to monitor for overcharging of any of the capacitors in series, and, during charging of the capacitors in series, to operate the discharge logic for any capacitor in the series that is in danger of overcharging.

Abstract: A NAND flash memory, in a read operation, a p-type semiconductor substrate is set at a ground potential, a bit line is charged to a first voltage, a source line, a n-type well and a p-type well are charged to a second voltage, which lies between a ground potential and a first voltage, and in a block not selected by said row decoder, said drain-side select gate line and said source-side select gate line are charged to a third voltage, which is higher than said ground potential and is equal to or lower than said second voltage.

Abstract: A synchronous type semiconductor storage device includes an array unit which includes a cell array and sense amplifiers. The synchronous type semiconductor storage device includes a read/write pulse generator which generates a read pulse signal and a write pulse signal according to a clock signal, the clock signal defining one cycle time of a read operation and a write operation with respect to the array unit as one cycle. The synchronous type semiconductor storage device includes a secondary amplifier which is activated according to the read pulse signal to read out data stored in the sense amplifiers through the read/write line. The synchronous type semiconductor storage device includes a write driver which is activated according to the write pulse signal to write data in the sense amplifiers through the read/write line.

Abstract: A semiconductor memory device in accordance with an embodiment includes a memory cell array having memory cells disposed at an intersection of first lines and second lines; and a control circuit configured to execute a read operation, thereby determining a resistance state of the selected one of the memory cells. The read operation is an operation configured to execute a sensing operation multiple times and aggregate determination results thereof. The sensing operation is configured such that a first voltage is applied to selected ones of the first lines and a second voltage lower than the first voltage is applied to a single selected one of the second lines. The control circuit suspends application of the first voltage to the first line connected to the selected one of the memory cells determined to be in a first resistance state in one of the sensing operations, and executes the next sensing operation.

Abstract: A non-volatile memory device for measuring a read current of a unit cell is provided. The non-volatile memory device includes a unit cell configured to read or write data, a column switching unit configured to select the unit cell in response to a column selection signal, a sense amplifier controlled by a sense-amplifier enable signal, configured to sense and amplify data that is received from the unit cell through the column switching unit, a first latch unit configured to latch the sense-amplifier enable signal for a predetermined time when a test code signal received from an external part is activated, a column controller configured to output a latch control signal in response to a combination of a column switch-off signal and a column control signal, and a second latch unit configured to control whether or not the column selection signal is latched in response to an activation state of the latch control signal.

Abstract: A semiconductor integrated circuit includes a P-type MOS transistor and two or more N-type MOS transistors connected together in series between a first and a second power supply, an input terminal connected to a gate terminal of the P-type MOS transistor and gate terminals of the two or more N-type MOS transistors, an output terminal which is a connection node between the P-type MOS transistor and one of the two or more N-type MOS transistors connected to the P-type MOS transistor, and one or more capacitors connected to the output terminal. The drive capability of the P-type MOS transistor is higher than the overall drive capability of the two or more N-type MOS transistors connected together in series. Therefore, a semiconductor integrated circuit is provided in which fluctuations in the delay time of a delay circuit caused by variations in transistor characteristics can be reduced.

Abstract: A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell provides a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further provides two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor.