Abstract: A memory test is performed by sequentially generating a number of n-bit addresses, whose first to k-th bits (1?k?n) are all set to one of two values, 0 or 1, and whose (k+1)th to n-th bits are all set to the other one of the two values, for all k's which range from 1 to n; writing first test data to each of the generated addresses in the memory; reading second test data from each of the addresses in the memory; and comparing the first test data with the second test data.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship.

Abstract: Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.

Abstract: An integrated circuit memory device includes a memory cell array comprising memory cells having respective data storage regions therein, a plurality of pass transistors having different channel widths and/or channel lengths, and a plurality of conductive lines. Each of the conductive lines electrically couple a respective one of the pass transistors to ones of the memory cells. Each of the memory cells has a line resistance defined by a portion of the corresponding one of the conductive lines extending between the memory cell and the pass transistor coupled thereto. Ones of the memory cells having greater line resistances are coupled to ones of the pass transistors having greater channel widths and/or shorter channel lengths than ones of the memory cells having smaller line resistances. Each of the memory cells may also include a diode therein, and ones of the memory cells having greater line resistances may include diodes having lower resistances. Related devices are also discussed.

Abstract: A method is provided for altering distribution of a chosen characteristic of a plurality of memory cells forming a memory device. The method comprises identifying a subset of the memory cells whose value of the chosen characteristic is within a predetermined end region of the distribution, and then performing a burn-in process during which one or more operating parameters of the memory device are set to induce aging of the memory cells. During the burn-in process, for each memory cell in the subset, the value stored in that memory cell is fixed to a selected value which exposes that memory cell to a stress condition. In contrast, for each memory cell not in the subset, the value stored in that memory cell is alternated during the burn-in process in order to alleviate exposure of that memory cell to the stress condition. Such an approach allows a tightening of the distribution of the chosen characteristic, thus improving the worst case memory cells.

Abstract: A semiconductor device includes a first amplifier circuit, a second amplifier circuit, first and second bit lines coupled to the first amplifier circuit, third and fourth bit lines coupled to the second amplifier circuit, a first equalizer circuit being coupled to the first and second bit lines, and a second equalizer circuit being coupled between the second and third bit lines. The second equalizer circuit being closer to the second amplifier circuit than the first equalizer circuit, the first equalizer circuit being closer to the first amplifier circuit than the second equalizer circuit.

Abstract: Apparatus and methods for providing SRAM timing tracking cell circuits are disclosed. In an embodiment, an apparatus comprises an SRAM array comprising static random access memory cells arranged in rows and columns; a plurality of word lines each coupled to memory cells along one of the rows; a clock generation circuit for outputting clock signals; a word line generation circuit for generating a pulse on the plurality of word lines responsive to one of the clock signals and for ending the pulse responsive to one of the clock signals; and a tracking cell for receiving a clock signal and for outputting a word line pulse end signal to the clock generation circuit, following an SRAM tracking time; wherein the tracking cell further comprises SRAM tracking circuits positioned in the SRAM array and coupled in series to provide a signal indicating the SRAM tracking time. Methods for SRAM timing are disclosed.

Abstract: Nonvolatile memory devices, memory systems and related methods of operating nonvolatile memory devices are presented. During a programming operation, the nonvolatile memory device is capable of using bit line forcing, and is also capable of selecting a verification mode for use during a verification operation from a group of verification modes on the basis of an evaluated programming condition.

Abstract: Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are described.

Abstract: Quaternary CAM cells are provided that include one or more compare circuits that each has a minimal number of pull-down transistors coupled between the match line and ground potential. For some embodiments, the compare circuit includes two parallel paths between the match line and ground potential, with each parallel path consisting of a single pull-down transistor having a gate selectively coupled to the stored data value in response to a comparand value.

Abstract: A memory device includes a plurality of memory cells serially connected between a bit line and a common source line and a plurality of word lines, respective ones of which are connected to respective gates of the plurality of memory cells. The memory device further includes a common source line compensation circuit configured to generate a compensated bias voltage on the bit line or at least one of the plurality of word lines responsive to a common source line voltage on the common source line. Related methods of operating memory devices are also provided.

Abstract: A flash memory device includes a memory cell array made up of memory cells arranged in rows and columns. A first page of data is programmed in selected memory cells of the memory cell array, and a second page of data is subsequently programmed in the selected memory cells. The first page of data is programmed using a program voltage having a first start value, and the second page of data is programmed using a program voltage having a second start value determined by a programming characteristic of the selected memory cells.

Abstract: Methods, devices, and systems are provided for a power generator system. The power generator system may include a control device configured to output a first reference voltage and a second reference voltage that define a dead band range. The control device may be configured to independently adjust the first reference voltage and the second reference voltage. The power generator system may also include a power generator operably coupled to the control device, and the power generator may be configured to receive the first reference voltage and the second reference voltage and to output a voltage that is greater than or substantially equal to the first reference voltage and less than or substantially equal to the second reference voltage.

Abstract: An internal voltage generator circuit is disclosed. The internal voltage generator circuit includes a comparator configured to compare a first voltage with a reference voltage and to output a comparison signal. The circuit further includes an internal voltage driver configured to receive an external voltage and the comparison signal and to output an internal voltage at an internal voltage output terminal, based on the comparison signal. The circuit further includes a voltage divider circuit including first and second resistor units and a first voltage output terminal between the first and second resistor units, configured to receive the internal voltage, and configured to output the first voltage based on the resistance values of the first and second resistor units, the first and second resistor units connected in series, and the first voltage being output through the first voltage output terminal.

Abstract: Devices, systems, methods, and other embodiments associated with accessing memory using fractional reference voltage are described. In one embodiment, an apparatus includes comparison logic. The comparison logic compares a threshold voltage of a memory cell to at least one pair of fractional reference voltages to generate comparison results. The apparatus includes read logic to determine a bit value of the memory cell based, at least in part, on the comparison results.

Abstract: In a particular embodiment, a method includes discharging a first dynamic node at a first discharge circuit of a first dynamic circuit structure in response to receiving an asserted discharge signal. The first dynamic circuit structure includes the first dynamic node at a first voltage level and a first keeper circuit that is disabled when the asserted discharge signal is received. The asserted discharge signal has a second voltage level that is different from the first voltage level. A second keeper circuit of a second dynamic circuit structure is enabled responsive to discharging the first dynamic node to maintain a second dynamic node of the second dynamic circuit structure at the first voltage level.

Abstract: According to one embodiment, a semiconductor memory device includes memory cells, a memory cell array, a word line, a bit line, a source line, a row decoder, a sense amplifier, and a first MOS transistor. The word line is connected to gates of the memory cells. The bit line is electrically connected to drains of the memory cells. The source line is electrically connected to sources of the memory cells. The row decoder selects the word line. The sense amplifier senses and amplifies data read onto the bit line in a read operation. The first MOS transistor is capable of connecting a well region where the memory cells are formed with the source line and is arranged between the row decoder or the sense amplifier and the memory cell array.

Abstract: In one or more of the disclosed embodiments, a read operation is compensated for back pattern effect. A bit line current is generated by a read operation that biases the word lines. As part of a back pattern effect measurement phase, at predetermined time intervals an indication of the discharge status of the bit line is stored in a latch of a set of N latches coupled to each bit line. At the end of the measurement phase, the set of latches contains a multiple bit word that is an indication of the back pattern effect experienced by that particular series string of memory cells. This back pattern effect indication is used in subsequent read operations to adjust the timing of the operation.

Abstract: A flash memory device includes a memory cell array having a set-up data region configured to store set-up data, wherein the set-up data includes first data and second data. The second data is stored in an empty cell area of the set-up data region. The flash memory also includes a page buffer and decoder configured to read the set-up data from the set-up data region, and a status detector receiving the set-up data from the page buffer and decoder and configured to discriminate the first data from the second data and generate a Pass/Fail status signal.

Abstract: An optimum forming method of performing a forming for a variable resistance element to maximize an operation window of the variable resistance element is provided. The forming method is used to initialize a variable resistance element (100). The forming method includes: a determination step (S35) of determining whether or not a current resistance value of the variable resistance element (100) is lower than a resistance value in a high resistance state; and a voltage application step (S36) of applying a voltage pulse having a voltage not exceeding a sum of a forming voltage and a forming margin when the determination is made that the current resistance value is not lower than the resistance value in the high resistance state (No at S35). The determination step (S35) and the voltage application step (S36) are repeated to process all memory cells in a memory array (202) (S34 to S37).