Patents Examined by Thiem D Phan
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Patent number: 12027927Abstract: There are provided core part manufacturing method and apparatus for manufacturing a core part of a rotary electric machine. The core part manufacturing method includes: injecting a molten resin from a side on one end surface of an iron core body into a plurality of space portions provided in the iron core body in a state where the iron core body is sandwiched and pressed. In injecting of the resin, a contact surface on an opposite side to a side where the resin is injected includes: a relief portion that is recessed without contacting to the one end surface; and a remaining portion that is adjacent to a non-contact region. The remaining portion is disposed in the contact surface on an outer peripheral side from the non-contact region, and the relief portion is disposed further in the contact surface on an outer peripheral side from the remaining portion.Type: GrantFiled: January 21, 2022Date of Patent: July 2, 2024Assignee: MITSUI HIGH-TEC, INC.Inventors: Shohei Yoshisako, Kohei Yoshida, Hibiki Mino, Masayuki Ono
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Patent number: 12021182Abstract: The present invention relates to a battery manufacturing device including: a fixed roller that moves an electrode where an active material is applied; a roller that rolls the electrode; and a stopper that is disposed between the fixed roller and the roller, and when the electrode is disconnected, moves the disconnected electrode.Type: GrantFiled: October 29, 2019Date of Patent: June 25, 2024Assignee: LG Energy Solution, Ltd.Inventors: Ki Hoon Paeng, Hyung Seok Han, Hyungkyun Yu, Jaewon Moon, Sang Myeon Lee
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Patent number: 12021433Abstract: An electric motor comprises a cylindrical housing, a stator comprising multiple stacked metal sheets and mounted in the housing, and a rotor which sits on a shaft, which is rotatably mounted in a respective bearing shield provided at a first end or at a second end of the housing. The housing is die cast. The stator protrudes into a wall of the housing with a depth. The depth is smaller than a thickness of the wall. A method for producing such an electric motor is also disclosed.Type: GrantFiled: April 23, 2019Date of Patent: June 25, 2024Assignee: Schaeffler Technologies AG & Co. KGInventors: Peter Schwanemann, Andreas Keskinoglu
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Patent number: 12020853Abstract: A structure for forming inductor windings includes a first portion and a second portion of a clamshell casing. The first portion includes a first set of electrically conductive segments, a first inner carrier, and a first outer carrier. The second portion includes a second set of electrically conductive segments, a second inner carrier, and a second outer carrier. An inductor core is mountable between the first inner carrier and the first outer carrier within the first portion. A control assembly aligns and joins the first portion to the second portion of the clamshell casing such that the first set of electrically conductive segments arranged in the first pattern that correspond to first half-turns of the inductor windings, are attached to the second set of electrically conductive segments arranged in the second pattern that correspond to second half-turns of the inductor windings, to form continuous turns around the inductor core.Type: GrantFiled: July 10, 2023Date of Patent: June 25, 2024Assignee: Tesla, Inc.Inventor: Tobias S. Ricco
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Patent number: 12020096Abstract: A method for manufacturing a portable data carrier by means of a continuous manufacturing method, comprises the steps: providing at least one foil as a rolled good, unrolling at least one first foil, with at least a first foil being coated at least partly with an adhesive on at least one side, with at least the first foil being scored on at least one side along at least one creasing edge, with at least the first foil being folded up in precise fit along at least one creasing edge and bonded, with the foil being folded up in the direction of the side which is coated with adhesive, with the side coated with adhesive being arranged on the opposite side of the foil which has at least one scored creasing edge along which it is folded.Type: GrantFiled: August 22, 2022Date of Patent: June 25, 2024Assignee: GIESECKE+DEVRIENT EPAYMENTS GMBHInventors: Stefan Bannert, Peter Kaufmann, Lucas Perlitz, Thomas Tarantino, Robert Griesmeier, Tatjana Mosthof, Cordula Regensburger
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Patent number: 12016119Abstract: A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.Type: GrantFiled: December 6, 2021Date of Patent: June 18, 2024Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Cheng-Jia Li, Mei Yang
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Patent number: 12007435Abstract: A method of copper hillock detecting includes the following steps. A testkey structure is disposed on a substrate, wherein the testkey structure includes a lower metallization layer, an upper metallization layer, and a dielectric layer between the lower metallization layer and the upper metallization layer. A force voltage difference is applied to the lower metallization layer and the upper metallization layer under a test temperature and stress time. A changed sensing voltage difference to the lower metallization layer and the upper metallization layer is detected for detecting copper hillock.Type: GrantFiled: December 8, 2020Date of Patent: June 11, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Ching-Chih Chang, Yi-Hsiu Chen, Yuan-Fu Ko, Chih-Sheng Chang
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Patent number: 12010800Abstract: In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.Type: GrantFiled: June 30, 2021Date of Patent: June 11, 2024Assignee: IO Tech Group Ltd.Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
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Patent number: 12009710Abstract: A stamping progressive die for a stator and rotor core of a motor using adhesive dispensing lamination and an adhesive dispensing process. The adhesive dispensing lamination device comprises a stamping station, an adhesive dispensing station for a first adhesive component, an adhesive dispensing station for a second adhesive component and a blanking station which are arranged on the stamping progressive die for the core of the stator and rotor of the motor, wherein an automatic stacking mechanism for core stamping sheets is arranged below the blanking station; one of the adhesive dispensing station for the first adhesive component and the adhesive dispensing station for the second adhesive component is located at an upper position of a material strip, and the other adhesive dispensing station is located at a lower position of the material strip.Type: GrantFiled: March 3, 2023Date of Patent: June 11, 2024Assignee: Jiangyin Huaxin Precision Technology Co., Ltd.Inventors: Bin Guo, Yicun Zhou, Dawei Liu, Laiyuan Zhao
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Patent number: 12009120Abstract: Cross-web for use in cable manufacture having a tape-like appearance in their relaxed state and their method of manufacture.Type: GrantFiled: May 21, 2021Date of Patent: June 11, 2024Assignee: WEB INDUSTRIES, INC.Inventors: Raymond Paul Stockwell, James Andrew Evans
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Patent number: 12009644Abstract: A robotic system is configured to autonomously or semi-autonomously rack a circuit breaker from an electrical cabinet or other electrical-connection station. The robotic system may perform work on circuit breakers, ground-and-test devices, or other electrical equipment.Type: GrantFiled: September 9, 2020Date of Patent: June 11, 2024Assignee: ULC TECHNOLOGIES, LLCInventors: Benjamin Artes, Benjamin J. Lagosz-Sinclair, Aalap Rajendra Shah, John Jayne, Dennis John Semet
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Patent number: 12003151Abstract: A method for motor manufacturing using a clip system is illustrated. The method includes sliding a plurality of magnets onto a vertical dowel hoop, wherein the plurality of magnets are stacked on each dowel, attaching a first plate to the top of the vertical dowel hoop and a second plate to the bottom of the vertical dowel hoop, wherein the plates compress the plurality of magnets on each vertical dowel, and curing the combination of the first plate, the second plate, the plurality of magnets and the vertical dowel hoop.Type: GrantFiled: July 22, 2022Date of Patent: June 4, 2024Assignee: BETA AIR, LLCInventors: Brandon White, Stephen Widdis
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Patent number: 11996743Abstract: The rotor manufacturing method includes the step of fixing a shaft to a rotor core by hydroforming. The shaft has a cylindrical shape in which an inside diameter of a first portion of the shaft to be placed on an inner peripheral surface of a shaft insertion hole is larger than an inside diameter of a second portion of the shaft located on one side in a rotation axis direction relative to the first portion.Type: GrantFiled: March 25, 2020Date of Patent: May 28, 2024Assignee: AISIN CORPORATIONInventors: Takaaki Kawashima, Yutaka Hara
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Patent number: 11990257Abstract: A process is provided for forming an integrated thin film resistor (TFR) in an integrated circuit (IC) device including IC elements and IC element contacts. A TFR film layer and TFR dielectric layer are formed over the IC structure, and a wet etch is performed to define a dielectric cap with sloped lateral edges over the TFR film layer. Exposed portions of the TFR film layer are etched to define a TFR element. A TFR contact etch forms contact openings over the TFR element, and a metal layer is formed to form metal layer connections to the IC element contacts and the TFR element. The sloped edges of the dielectric cap may improve the removal of metal adjacent the TFR element to prevent electrical shorts in the completed device. A TFR anneal to reduce a TCR of the TFR is performed at any suitable time before forming the metal layer.Type: GrantFiled: October 15, 2020Date of Patent: May 21, 2024Assignee: Microchip Technology IncorporatedInventor: Paul Fest
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Patent number: 11984693Abstract: A method, comprising: forming a dielectric structure, the structure comprising a first terminal surface, a second terminal surface and a through-hole that extends from the first terminal surface to the second terminal surface, applying an electrically conductive material to at least a portion of the dielectric structure, removing a first portion of the electrically conductive material from the first terminal surface, and removing a second portion of the electrically conductive material from the second terminal surface, a remaining portion of the electrically conductive material constituting at least an inner conductor of a first generally coaxial conductor pair and a first shielding conductor of the first generally coaxial conductor pair, and the inner conductor extending through the through-hole.Type: GrantFiled: February 4, 2019Date of Patent: May 14, 2024Assignee: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KGInventors: Hauke Schütt, Waldemar Schmidt, Alexandra Henniger-Ludwig
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Patent number: 11984257Abstract: A field magnet manufacturing method where a bonded magnet's inner surface press-fitted in a yoke has a certain accuracy irrespective of the accuracy of the yoke's outer circumferential surface. A cylindrical bonded magnet from binding magnet particles with a thermosetting resin is fixed in a tubular yoke of magnetic material. The method includes reheating and softening the bonded magnet after thermal curing; and press-fitting in the bonded magnet after the softening step from a tapered portion on one end side of the yoke to press the bonded magnet's outer circumferential surface against the yoke's inner surface. The press-fitting includes feeding the bonded magnet relatively into the yoke while allowing a relative posture variation between the bonded magnet and the yoke so the bonded magnet's inner surface to be remolded into a shape along the inner surface of the yoke exhibits almost the same accuracy as the yoke's inner surface.Type: GrantFiled: June 6, 2023Date of Patent: May 14, 2024Assignee: AICHI STEEL CORPORATIONInventors: Satoru Kan, Hiroaki Hirano, Hironari Mitarai, Takumi Asano, Motonobu Furuyama
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Patent number: 11979132Abstract: A method for manufacturing a substrate for a radiofrequency filter by joining a piezoelectric layer to a carrier substrate via an electrically insulating layer, wherein the method comprises depositing the electrically insulating layer by spin coating an oxide belonging to the family of SOGs (spin-on glasses) on the surface of the piezoelectric layer to be joined to the carrier substrate, followed by an anneal for densifying the electrically insulating layer before joining the piezoelectric layer to the carrier substrate via the electrically insulating layer.Type: GrantFiled: March 27, 2019Date of Patent: May 7, 2024Assignee: SoitecInventors: Djamel Belhachemi, Thierry Barge
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Patent number: 11979068Abstract: A rotor includes a rotor core lamination. The rotor core lamination includes a first metal alloy that at least partially defines adjacent magnet pockets proximate an outer periphery of the rotor core lamination. The rotor core lamination further includes a second metal alloy different than the first metal alloy that forms at least a portion of a bridge that extends between the magnet pockets. The rotor core lamination further includes permanent magnets disposed in the magnet pockets at opposing sides of the second metal alloy.Type: GrantFiled: May 28, 2021Date of Patent: May 7, 2024Assignee: Ford Global Technologies, LLCInventors: Leyi Zhu, Michael W. Degner, Feng Liang
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Patent number: 11969235Abstract: Provided is a sensor module, a method for manufacturing a sensor module, and a blood pressure measurement device that can improve the holding force onto a soft portion. A sensor module 63 of a blood pressure measurement device 1 includes: a sensor base 72; a pressure sensor portion 71 fixed to the sensor base 72; a sensor head cover 73 including, on an outer surface, an opening 73a in a region that comes into contact with a wrist 100 and an inner surface 73g formed with unevenness, the sensor head cover 73 being fixed to the sensor base 72 and forming a gap portion 79 that communicates with the opening 73a between the inner surface 73g, the sensor base 72, and the pressure sensor portion 71; and a soft portion 74 disposed in the gap portion 79 and, at least, filling up the opening 73a and covering the pressure sensor portion 71.Type: GrantFiled: November 17, 2020Date of Patent: April 30, 2024Assignee: OMRON HEALTHCARE CO., LTD.Inventors: Yuki Nakagawa, Tsuyoshi Hamaguchi, Takashi Fuchimoto
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Patent number: 11963452Abstract: A method of forming a piezoelectric microphone with an interlock/stopper and a micro-bump and a resulting device are provided. Embodiments include forming a membrane over a Si substrate having a first and second sacrificial layer disposed on opposite surfaces thereof, the membrane being formed on the first sacrificial layer, forming a first HM over the membrane, forming first and second vias through the first HM, forming a first pad layer in the first and second vias and over an exposed top thin film, forming a trench to the first sacrificial layer between the first and second vias and a gap between the trench and second via, patterning a second HM over the membrane, in the first and second vias, the trench and the gap, and forming a second pad layer over the second HM and in exposed areas around the first and second vias to form pad structures.Type: GrantFiled: November 24, 2020Date of Patent: April 16, 2024Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.Inventors: Jia Jie Xia, Rakesh Kumar, Minu Prabhachandran Nair, Nagarajan Ranganathan