Patents Examined by Tho G. Phan
  • Patent number: 11139551
    Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: October 5, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hee Choi, Sang Jong Lee
  • Patent number: 11133573
    Abstract: Mobile terminal antenna and mobile terminal are provided. Mobile terminal antenna includes: main ground board, isolation sheet and metal frame surrounding main ground board; main ground board is within metal frame, part of edge of which is connected with inner edge of metal frame and another part of edge of which is separated from inner edge of metal frame; metal frame includes first section and second section, inner edge of metal frame corresponding to first section is connected with edge of main ground board, inner edge of metal frame corresponding to second section is separated from edge of main ground board; opening is provided in second section, portions of metal frame on sides of opening are connected with grounding terminal and feed, so portions each form antenna arm; isolation sheet is in opening and connected with grounding terminal. Mobile terminal includes any described mobile terminal antenna.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 28, 2021
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Yuwen Chen
  • Patent number: 11108155
    Abstract: An electronic device may be provided with wireless circuitry for conveying radio-frequency signals greater than 10 GHz. The wireless circuitry may include a phased antenna array that transmits a steerable signal beam and independent antennas that are separate from the array. The array may be coupled to a first transceiver and the independent antennas may be coupled to a second transceiver. Power amplifier stages may be coupled between the second transceiver and the independent antennas to boost the gain of the independent antennas. If desired, the array and the independent antennas may be coupled to ports of the same transceiver. In this arrangement, each independent antenna may include an antenna feed that is coupled to a respective pair of ports on the transceiver. This may serve to boost the gain of the independent antennas without power amplifier circuitry. The independent antennas may have smaller footprints than the phased antenna array.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: August 31, 2021
    Assignee: Apple Inc.
    Inventors: Rodney A. Gomez Angulo, Simone Paulotto, Harish Rajagopalan, Jennifer M. Edwards, Hao Xu
  • Patent number: 11108170
    Abstract: An apparatus is disclosed for a multi-band millimeter-wave (mmW) antenna array and radio-frequency integrated circuit (RFIC) module. In an example aspect, the apparatus includes a multi-band mmW antenna array and RFIC module with a first antenna array, a second antenna array, and at least one radio-frequency front-end integrated circuit. The first antenna array includes at least two first antenna elements and is tuned to a first mmW frequency band. The second antenna array includes at least two second antenna elements and is tuned to a second mmW frequency band. The at least one radio-frequency front-end integrated circuit includes at least two first transceiver chains and at least two second transceiver chains. The at least two first transceiver chains are respectively coupled to the at least two first antenna elements, and the at least two second transceiver chains are respectively coupled to the at least two second antenna elements.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: August 31, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Kaushik Chakraborty, Rahul Malik, Jeremy Dunworth
  • Patent number: 11108154
    Abstract: Disclosed is a phase shifter arrangement for an antenna, such as a cellular antenna, that has a simplified drive mechanism. The phase shifter arrangement has two phase shifters, each with two wiper arms that are coupled at one end to a single drive shaft. Each of the wiper arms have a pivot access that may be located at or near its center such that as the drive shaft translates, it mechanically engages both wiper arms, causing them to rotate around their respective pivot axes. Certain antenna arrangements have several array faces. For example, the antenna may have three array faces, each spaced at 120 degrees of azimuth. The drive shafts for each of these array faces may operate independently to function as a multisector antenna, or they may be driven in unison to function as an omnidirectional antenna.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 31, 2021
    Assignee: JOHN MEZZALINGUA ASSOCIATES, LLC
    Inventor: Andrew Litteer
  • Patent number: 11101530
    Abstract: A square waveguide (1) has four ridges (6a, 6b, 7a, 7b). The cross section of the square waveguide (1) perpendicular to a waveguide axial direction is square. Inside the square waveguide (1), two rectangular waveguide terminals (4, 5) are formed by partitioning the inside along the waveguide axial direction. A septum phase plate (2) formed to get narrower stepwisely as its gets closer to a square waveguide terminal (3) opposite to the rectangular waveguide terminals (4, 5) is provided. A projecting portion (8) is provided on a part of a ridge (7b) formed on a ridge-side wall surface opposite to a wall surface, the septum phase plate (2) being joined to the wall surface in a part where the septum phase plate has largest width, the projecting portion (8) being larger than other parts of the ridge (7b) in a cross-sectional shape perpendicular to the waveguide axial direction.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: August 24, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidenori Yukawa, Yu Ushijima, Motomi Watanabe, Jun Goto, Naofumi Yoneda, Shinji Arai
  • Patent number: 11101537
    Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: August 24, 2021
    Assignee: Viasat, Inc.
    Inventors: Donald L. Runyon, Dominic Q. Nguyen, James W. Maxwell
  • Patent number: 11088455
    Abstract: An antenna may include a ground plane, a tuning stub, and a shorted spiral antenna element connected to the tuning stub. The shorted spiral antenna element may include a plurality of spiral traces shorted together by a shorting element extending radially outward to contact each of the spiral traces.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: August 10, 2021
    Assignee: TAOGLAS GROUP HOLDINGS LIMITED
    Inventor: Timothy Patrick Kelley
  • Patent number: 11088459
    Abstract: Examples reflectors for an antenna is provided. One example reflector comprises a support structure for supporting radiating elements and for providing mechanical stiffness of the reflector, and a separate conductive member acting as an electrically reflective surface attached to the support structure and covering at least a portion of the support structure.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: August 10, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Serban Rebegea, Christian Helbig, Johann Baptist Obermaier
  • Patent number: 11088470
    Abstract: A mobile terminal according to the present invention includes a first conductive member forming a part of a lower end of an outer metal frame, and a second conductive member spaced apart from the first conductive member to form parts of the lower end and a side surface of the outer metal frame. The terminal may further include a conductive line connected to one point of each of the first conductive member and the second conductive member and interconnected inside the mobile terminal. At this time, an antenna device, in which the second conductive member is connected adjacent to a ground at a predetermined position from the one point of the second conductive member, so as to fully cover a low frequency band including an LTE, and which has a hand-effect compensation function, and a mobile terminal can be provided.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 10, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Youngbae Kwon, Byungeun Jeon, Byungwoon Jung, Sungjoon Hong
  • Patent number: 11081782
    Abstract: A three-dimensional antenna element is provided. The three-dimensional antenna element is configured to be disposed on a surface of a conductive substrate, and includes a dielectric base, a first radiation part, a second radiation part, a third radiation part, a fourth radiation part, a first shorting element, and a second shorting element. The dielectric base includes a first plane and a second plane, where the second plane includes a first side and a second side, the first side is opposite to the second side and configured to be joined to the first plane, and the second side is configured to be joined to the surface of the conductive substrate. A signal feed-in point is coupled between the first radiation part and the second radiation part.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 3, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wei-Hsuan Chang, Fang-Hsien Chu
  • Patent number: 11081783
    Abstract: Systems and methods of manufacture are disclosed for semiconductor device assemblies having a front side metallurgy portion, a substrate layer adjacent to the front side metallurgy portion, a plurality of through-silicon-vias (TSVs) in the substrate layer, metallic conductors located within at least a portion of the plurality of TSVs, and at least one conductive connection circuitry between the metallic conductors and the front side metallurgy portion. The plurality of TSVs with metallic conductors located within are configured to form an antenna structure. Selectively breakable connective circuitry is used to form and/or tune the antenna structure.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: August 3, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Owen R. Fay
  • Patent number: 11069962
    Abstract: An antenna assembly for a portable radio includes a removable speaker cover having a plurality of speaker ports and an antenna mounting aperture extending through the removable speaker cover. The antenna assembly also includes a sheet metal antenna element coupled to the removable speaker cover along at least one of a top or side surface of the removable speaker cover, the sheet metal antenna element having a jogged portion that extends into the antenna mounting aperture. The antenna assembly also includes a contact plate disposed below the removable speaker cover and aligned with the antenna mounting aperture. The contact plate is coupled to the jogged portion to provide an electrical connection between the contact plate and the jogged portion.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 20, 2021
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Andy K. Baw, Jody H. Akens, Eduardo Moralejo, Adam R. Zelko
  • Patent number: 11069953
    Abstract: An electrically small low profile antenna is disclosed. The antenna comprises circuit board comprising a composite laminate, formed of a magnetic material and having at least one antenna element disposed on a top surface of the composite laminate, a conductive ground plane disposed on a bottom surface of the composite laminate, and a conductor, extending through the composite laminate between the top surface and the bottom surface of the composite laminate, the conductor forming a microstrip feed extending from an antenna input to the antenna element.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: July 20, 2021
    Assignee: THE BOEING COMPANY
    Inventors: John E. Rogers, John D. Williams
  • Patent number: 11063357
    Abstract: A dual-band antenna for global positioning system includes a plurality of dipole antenna arranged to operate in a L1 band and a L2 band; a back cavity structure mounted to the plurality of dipole antennas, wherein the plurality of dipole antennas are at least partially accommodated within a back cavity defined by the back cavity structure; and a feed network provided on the back cavity structure and coupled to the plurality of dipole antennas.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: July 13, 2021
    Assignee: City University of Hong Kong
    Inventors: Kwok Wa Leung, Yuxiang Sun, Jian Ren
  • Patent number: 11056761
    Abstract: A shaft antenna system for mobile communication has an antenna housing and a supporting frame. The frame has a frame top side, a frame bottom side and an insertion opening located at the height of the frame top side. An accommodating space adjoins the insertion opening in which the antenna housing is arranged. The antenna housing has at least one supporting device for retaining the antenna housing within the supporting frame. A closing cover closes the insertion opening and the accommodating space. The closing cover is supported at the edge region of the closing cover at least indirectly on the supporting frame and covers a top side of the antenna housing by the inner face of the closing cover. The closing cover has a central region, the surface of which facing downward is at least 60% of the total inner surface of the closing cover facing downward, wherein the central region is arranged above the adjacent top side of the antenna housing without contact.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: July 6, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Maximilian Schlosser
  • Patent number: 11050155
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 29, 2021
    Assignee: Intel Corporation
    Inventors: Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios C. Dogiamis, Aleksandar Aleksov
  • Patent number: 11050151
    Abstract: A multi-band antenna includes a plurality of dipole antenna each arranged to operate in a frequency band different from each other; a back cavity structure mounted to the plurality of dipole antennas, wherein the plurality of dipole antennas are at least partially accommodated within a back cavity defined by the back cavity structure; and a feed network provided on the back cavity structure and coupled to the plurality of dipole antennas.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: June 29, 2021
    Assignee: City University of Hong Kong
    Inventors: Kwok Wa Leung, Yuxiang Sun, Jian Ren
  • Patent number: 11038274
    Abstract: An antenna apparatus includes a ground layer, a wiring layer spaced apart from either a first surface or a second surface of the ground layer and including wiring lines, feed lines electrically connected to the wiring lines, a dipole antenna pattern to transmit and/or receive an RF signal, a plurality of feed vias to electrically connect poles of the dipole antenna pattern to the feed lines, and a ground pattern to electrically connect the poles of the dipole antenna pattern to the ground layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 15, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Kim, Jeong Ki Ryoo
  • Patent number: 11038283
    Abstract: An electronically configurable antenna is disclosed. In one embodiment, the antenna comprises a circuit board having a composite dielectric that has a top surface and a bottom surface. An inner antenna element and a coupling element are disposed on the top surface, with the coupling element disposed about a periphery of and substantially coplanar with the antenna element. The coupling element is selectably electrically shorted to the inner antenna element to configure the antenna. The electronically configurable antenna further has a conductor extending through the composite dielectric between the top surface and the bottom surface and a lower electrical ground plane on the bottom surface to minimize any change in the antenna's electrical behavior due to the conductivity of the surfaces to which they are mounted.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: June 15, 2021
    Assignee: THE BOEING COMPANY
    Inventors: John E. Rogers, John D. Williams