Abstract: The invention discloses a buckle ring device for a memory slot. A memory module is able to be inserted into the memory slot. The memory slot is provided at two sides thereof with a seat, respectively. A clamp structure is pivotally connected to an inside of the seat. Two sides of the memory module inserted in the memory slot are clamped by the clamp structures. When the buckle ring device is assembled on the seat of the memory slot, the seat and the clamp structures can be used for constraining the displacement of the buckle ring device in XYZ axis directions, resulting in strengthening the clamping of the clamp structures to the memory module by the buckle ring device.

Abstract: An inhomogeneous dielectric medium high-speed signal trace system includes a first and second ground layer. A first dielectric layer is located adjacent the first ground layer. A second dielectric layer has a different dielectric constant and a greater thickness than the first dielectric layer, and is located between the first dielectric layer and the second ground layer. A first differential trace pair is located between the first dielectric layer and the second dielectric layer, and includes a trace spacing that is less than or equal to a thickness of the first dielectric layer. The first different trace pair transmit signals and, in response, produces a magnetic field, and the trace spacing prevents a magnetic field strength of the magnetic field from exceeding a magnetic field strength threshold at a second differential trace pair that is located adjacent the first differential trace pair.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: The present disclosure discloses a cable pressing structure and a lamp. The cable pressing structure adapted to fix a cable on a carrying base, includes: a main portion and a first connecting portion and a second connecting portion provided at both ends of the main portion, respectively. The cable pressing structure is configured to being detachably connected to the carrying base through the first connecting portion and the second connecting portion, and press and fix the cable on the carrying base; the main portion has a first side surface and a second side surface facing away from each other, a first cable pressing portion is provided on the first side surface, and a second cable pressing portion is provided on the second side surface. The cable pressing structure has a first installation state and a second installation state.

Abstract: A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.

Abstract: A cable management apparatus can include a first surface configured for working and a second surface having a channel integrally formed into the apparatus material at the second surface. The channel can have sidewalls, extend longitudinally in a direction parallel to the second surface, have a longitudinal channel opening at the second surface along a substantial portion of the channel, and can be configured to hold a cable therein even when the channel opening faces downward. The cable may be curved within the channel to create elastic potential energy in the cable, and a friction force between the curved cable pushing against the channel sidewalls can hold the cable in place within the channel. The channel may form a cross-section having an undercut that is defined by ledge portions at the channel opening, and the ledge portions can hold the cable in place within the channel.

Abstract: A wiring harness (1010), a motor vehicle component (1000), a mold (15) for manufacturing a wiring harness (1010), a mold system (10) and a method for manufacturing the wiring harness (1010), the wiring harness (1010) comprising at least one bunch (1020) of at least two cables (1025) and a sheath (1030), at least some sections of the bunch (1020) of cables being embedded in the sheath (1030).

Abstract: A wire harness including: a plurality of electric wires; an exterior tube that has an internal space into which the plurality of electric wires are inserted; a first protective body that is insulative, is provided between the plurality of electric wires in the internal space of the exterior tube, and is formed with an insulating reinforced fiber; and a second protective body that is provided so as to fill a gap between an inner circumferential surface of the exterior tube and outer circumferential surfaces of the plurality of electric wires, and covers an outer circumference of the first protective body and outer circumferences of the plurality of electric wires, wherein the first protective body is shorter than the second protective body in a side view of the wire harness.

Abstract: A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

Abstract: A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

Abstract: Disclosed herein is a coil component that includes a core, first to fourth terminal electrodes provided on a first flange part, fifth to eighth terminal electrodes provided on a second flange part, first and second wires bifilar wound around a winding core part, and third and fourth wires bifilar wound around the winding core part. One and other ends of the first to eighth wires are connected corresponding one of the first to eighth terminal electrodes. The first and second wires cross each other in a first crossing area. The third and fourth wires cross each other in a second crossing area different from the first crossing area.

Abstract: A wire harness including: a wire; and an outer cover into which the wire is inserted; wherein the outer cover is provided with a spring that is in contact with an outer circumferential surface of the wire. An outer cover into which a wire is to be inserted, the outer cover including a spring configured to come into contact with an outer circumferential surface of the wire.

Abstract: Disclosed are embodiments of a round floor grommet and a rectangular floor grommet. These floor grommets can be constructed in any desired shape other than round or rectangular. Frame portions that hold foam pieces are joined together to form a primary slit in the floor grommet. Cross slits can also be formed in the foam material. The foam is a semi-closed cell foam that is constructed from PVC and nitrile butadiene rubber which has superior sealing effects since the foam can conform around objects passing through the slits in the floor grommet and seal any flow of air through the slits.

Abstract: The present invention relates to a first metal cable (1) having a flat upper (A) and a flat lower (B) surface, comprising at least one hollow riser (2) extending approximately 90 degrees from one of the flat surfaces of the first metal cable, the hollow riser being 5 configured to house an end of a second metal cable (3). A connected structure comprising a first metal cable wherein a second metal cable is inserted into the hollow riser (2) of the first metal cable and joined with the first metal cable. it also relates to a method of making a connected structure, joining a first metal cable to a second metal cable by friction welding the second metal cable (3) to the first metal cable by 10 contacting a rotating tool (4) with the lower surface of the first metal cable in the area underneath the hollow riser.

Abstract: A current feedthrough seal assembly (1) for insertion into and sealing a wall opening (WO) of a climate chamber (KK) comprises a plastic core (10) formed in a step-like shape in an axial direction thereof so as to be inserted into the wall opening (WO) of the climate chamber (KK), so that, when inserted, substantially the whole of the plastic core (10) is located in the wall opening (WO), and a flange (11) is formed at an axial end of the plastic core (10) to protrude beyond the wall opening in the radial direction of the plastic core (10) to abut against one (I) of an internal or external wall (I, A) of the climate chamber (KK), at least two elongated power conducting members (20) accommodated in parallel to each other inside the plastic core (10) and extending through the plastic core (10) and a press ring seal (30) interposed between an inner peripheral surface of the wall opening (WO) and an outer peripheral surface of the plastic core (10) on an opposite axial side thereof with respect to the flange (11)

Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

Abstract: An interconnect structure includes a first conductor, a second conductor, a dielectric block, a substrate, and a pair of conductive lines. The first conductor and the second conductor form a differential pair design. The dielectric block surrounds the first conductor and the second conductor. The first conductor is separated from the second conductor by the dielectric block. The substrate surrounds the dielectric block and is spaced apart from the first conductor and the second conductor. The pair of conductive lines is connected to the first conductor and the second conductor, respectively, and extends along a top surface of the dielectric block and a top surface of the substrate.

Abstract: According to one configuration, an inductor device comprises core material and at least a first electrically conductive path. The core material is fabricated from magnetically permeable material. The first electrically conductive path extends axially through the core material from a proximal end of the inductor device to a distal end of the inductor device. The core material is operable to confine first magnetic flux generated from first current flowing through the first electrically conductive path. The inductor device further includes a gap in the core material. The gap (gas or solid material) has a different magnetic permeability than the core material. Inclusion of the gap in the core material provides a way to tune an inductance of the inductor device and increase a magnetic saturation level of the inductor device. The core material includes any number of electrically conductive paths and corresponding gaps.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

Abstract: According to one aspect of the present invention, a silver nanowire mesh (Ag NW-mesh) electrode and a fabricating method thereof. The Ag NW-mesh electrode includes a flexible substrate; and a mesh pattern layer which is disposed on the flexible substrate and in which a plurality of first meal lines and a plurality of second metal lines are composed of Ag NWs and intersect each other in an orthogonal or diagonal direction to form a grid pattern, wherein the first metal lines and the second metal lines of the mesh pattern layer form an angle of 35 degrees to 55 degrees with respect to a bending direction.