Abstract: A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.

Abstract: A device for transferring a line between a retracted state and an extended state includes a line arranged in an interface region between a semitrailer train and a semitrailer, wherein the line has a first line section and a second line section and wherein the line is longer in the extended state than in the retracted state, and an envelope element via which the first line section and the second line section are connectable for transfer between the retracted state and the extended state by forming a telescopic mechanism.

Abstract: It is an object to make a wire harness for connecting a vehicle body-side device and a wheel-side device suited to routing in a small space, and improve its flex resistance. A wire harness for connecting a vehicle body-side device and a wheel-side device includes: a first wiring member; and a second wiring member, and at least part of an outer path portion of the first wiring member, and at least part of an outer path portion of the second wiring member are separated from each other outside a vehicle body.

Abstract: It is an object to provide a wire harness for connecting a vehicle body-side device and a wheel-side device that can be routed in a small space appropriately, and can have an improved flex resistance. A wire harness for connecting a vehicle body-side device and a wheel-side device includes: a first wiring member; and a second wiring member that has higher flex resistance than the first wiring member. The first wiring member has an outer path length that is greater than an outer path length of the second wiring member.

Abstract: The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

Abstract: An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×1012 ohms to about 1×1018 ohms as determined in accordance with ASTM D257-14.

Abstract: An electric field shaping apparatus according to a present embodiment includes a substrate, a first electrode positioned on the substrate, a second electrode spaced apart from the first electrode, a power source configured to provide a voltage between the first electrode and the second electrode, and an insulating material with which the first electrode is coated, wherein one or more holes configured to shape an electric field generated between the first electrode and the second electrode are formed in the insulating material.

Abstract: A wiring component includes a plurality of electric wires aligned in a predetermined alignment direction, and a holder to hold the plurality of electric wires. The holder includes a pair of resin members that sandwich longitudinal portions of the plurality of electric wires in a perpendicular direction perpendicular to the alignment direction, and the pair of resin members are recess-projection fitted between the plurality of electric wires.

Abstract: A modular hardware platform utilizes a combination of different types of units that are pluggable into cassette endpoints. The present disclosure enables the construction of an extremely large system, e.g., 500 Tb/s+, as well as small, standalone systems using the same hardware units. This provides flexibility to build different systems with different slot pitches. The hardware platform includes various numbers of stackable units that mate with a cost-effective, hybrid Printed Circuit Board (PCB)/Twinax backplane, that is orthogonally oriented relative to the stackable units. In an embodiment, the hardware platform supports a range of 14.4 Tb/s-800 Tb/s+ in one or more 19? racks, providing full features Layer 3 to Layer 0 support, i.e., protocol support for both a transit core router and full feature edge router including Layer 2/Layer 3 Virtual Private Networks (VPNs), Dense Wave Division Multiplexed (DWDM) optics, and the like.

Abstract: A laminated busbar includes: a base body comprising conducting layers and insulating material to electrically insulate the conducting layers from each other. The conducting layers and the insulating material are clamped together by mechanical means and/or a profile is connected to the base body. In an embodiment, no glue or adhesive is arranged between at least one conducting layer and at least one insulating material.

Abstract: A shielded electrical ribbon cable includes adjacent first and second longitudinal conductor sets where each conductor set includes two or more insulated conductors. The first conductor set also includes a ground conductor that generally lies in the plane of the insulated conductors of the first conductor set. At least 90% of the periphery of each conductor set is encompassed by a shielding film. First and second non-conductive polymeric films are disposed on opposite sides of the cable and form cover portions substantially surrounding each conductor set, and pinched portions on each side of each conductor set. When the cable is laid flat, the distance between the center of the ground conductor of the first conductor set and the center of the nearest insulated conductor of the second conductor set is ?1, the center-to-center spacing of the insulated conductors of the second conductor set is ?2, and ?1/?2 is greater than 0.7.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

Abstract: In an example embodiment, a junction box may include a flashing. The flashing may define a first groove. The first groove may be disposed relative to a first center axis on a first plane. The junction box may also include a housing. The housing may include a bottom portion. The bottom portion may define a second groove. The second groove may be disposed relative to a second center axis. The second center axis may be coincident with the first center axis in a direction that is substantially parallel to the first plane of the first groove. In addition, the second groove may be located on a second plane that is substantially parallel to the first plane of the first groove. Further, the second groove may be configured to indicate a suitable hole position in the bottom portion.

Abstract: Methods for installing electronic connections into a Factory Mutual certified cabinet may comprise providing a double walled cabinet. The double walled cabinet ay comprise an outer cabinet wall, and inner cabinet wall, and an airgap between the inner cabinet wall and the outer cabinet wall. The method may comprise the steps of including a first large hole in a surface of the outer cabinet wall and including a first small hole in a surface of the inner cabinet wall. Methods can additionally include the steps of inserting a first bulkhead fitting into the first small hole in the surface of the inner cabinet wall via the first large hole and covering the first large hole in the surface of the outer cabinet wall. Methods may additionally include the first small hole at least partially overlapping the first large hole when viewed from a plane normal to the first large hole.

Abstract: A recessed floor fitting includes a poke-through housing, a divider assembly, and a feeder plate. The poke-through housing has a base and an outer wall with an open top that defines an interior chamber. The base includes a central aperture, a first perimeter aperture, and a second perimeter aperture. The divider assembly separates the interior chamber into a center portion, a first portion, and a second portion. The center portion is in communication with the center aperture. The first and second portions are in communication with the respective first and second perimeter apertures. The feeder plate is connected to the base, and has a mounting flange and a conduit extending from the mounting flange.

Abstract: Disclosed are methods and apparatus for providing and installing electrical wire connector clamps that may be inserted into knockout holes from the inside of an electrical box or panel, that are capable of holding multiple wires or cables, that may be run through the connector before it is slotted into the hole, and that use only a minimal amount of interior space of the electrical box or panel. Embodiments of the present invention include semi-cylindrical units that may be folded together around one or more wires for secure engagement with the wires and with a knockout hole of an electrical box or panel. Embodiments may be used in new construction, and to replace existing connector clamps in an electrical box or panel from the inside without damaging the walls surrounding the box or panel, in order to securely hold wires in an electrical box or panel, add new wire(s), hold multiple wires, and/or increase available space inside the box or panel.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.

Abstract: A modular electrical bus system for a valve manifold has a communication module, a valve driver module, and a plurality of I/O modules each having a plurality of I/O fittings being both electrically and mechanically connectable together via a bridge member connecting adjacent modules. The bridge member has a housing with an interior for housing electronic components for memory storage or Wi-fi reception and transmission that is operably connected to a complementary electrical fitting constructed to be connected to an electrical fitting of a module of said electrical fieldbus system without adding extra length to said bank of modules of said electrical fieldbus system.

Abstract: The present disclosure describes methods of manufacture and implementations of hybrid separators for data cables having conductive and non-conductive or metallic and non-metallic portions, and data cables including such hybrid separators. A hybrid separator comprising one or more conductive portions and one or more non-conductive portions may be positioned within a data cable between adjacent pairs of twisted insulated and shielded or unshielded conductors so as to provide physical and electrical separation of the conductors. The position and extent (laterally and longitudinally) of each conductive portion and each non-conductive portion may be selected for optimum performance of the data cable, including attenuation or rejection of cross talk, reduction of return loss, increase of stability, and control of impedance.

Abstract: A wiring substrate includes: a base material; a first through-hole and a second through-hole that are formed in the base material; magnetic material that is filled in the first through-hole; a third through-hole that is formed in the magnetic material; a first plating film that covers an inner wall surface of the third through-hole; and a second plating film that covers an inner wall surface of the second through-hole and the first plating film. The first plating film includes a first electroless plating film that is in contact with the inner wall surface of the third through-hole, and a first electrolytic plating film that is laminated on the first electroless plating film.