Patents Examined by Tina M. Wong
  • Patent number: 11860412
    Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: January 2, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Subal Sahni, Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck
  • Patent number: 11860419
    Abstract: An optical communication device includes two optical transmitting devices, two optical receiving devices, an optical path component, and an optical fiber adapter. A first converging lens packaged in each of the optical transmitting devices converges a light beam emitted by a light source, and provides the converged light beam for the optical path component. A second converging lens packaged in each of the optical receiving devices converges a light beam from the optical path component, and provides the converged light beam for a photoelectric detection element. The optical path of the optical communication device is simplified and the process costs are reduced. In addition, the quantity of used lenses is reduced, correspondingly reducing the quantity of optical coupling dimensions between mechanical parts and improving production efficiency of combined passive optical network (Combo PON) products.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: January 2, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhaojiang Ge, Fei Gao, Tao Liu
  • Patent number: 11852868
    Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu
  • Patent number: 11852882
    Abstract: A packaging assembly for telecommunications modules comprises a plurality of telecommunications modules provided in a stacked arrangement in a first container, a plurality of telecommunications modules provided in a stacked arrangement in an adjacent second container, and a removable radius limiter mounted between the first and second containers for guiding all of the fiber optic cabling extending from the telecommunications modules with minimum bend radius protection.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: December 26, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Thomas Marcouiller, Paula Lockhart, Michael J. Schomisch, Tomas Fucsek, Roman Solich
  • Patent number: 11852877
    Abstract: Provided is a connector plug includes: an optical device module having an optical engine that generates an optical signal or receives an optical signal; an optical fiber alignment guide member having an optical fiber insertion channel formed on one surface of the optical device module so that optical fibers are seated; and an optical component that is seated in an optical component alignment guide groove formed adjacent to the optical fiber alignment guide member on one surface of the optical device module, wherein the optical engine includes an optical device which is formed adjacent to the optical component on one surface of the optical device module, and which radiates an optical signal or receives an optical signal in the horizontal direction, and an optical integrated circuit (IC) installed in the optical device module and controlling the optical device.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: December 26, 2023
    Assignee: LIPAC CO., LTD.
    Inventor: Seong Wook Choi
  • Patent number: 11852867
    Abstract: The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: December 26, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Bo Peng, Michal Rakowski
  • Patent number: 11846821
    Abstract: An adapter block assembly includes two housing pieces that cooperate to hold one or more adapters therebetween. The two housing pieces are removably latched together. Labels can be placed over the latches. Certain types of adapter block assemblies are configured to receive multi-fiber plug connectors. Certain types of adapter block assemblies include securement arrangements at opposite ends thereof to aid in mounting the adapter block assemblies to frames, trays, chassis, or other such structures.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: December 19, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Scott C. Sievers, Loren J. Mattson
  • Patent number: 11832364
    Abstract: Disclosed herein is an integrated photonics device including a frequency stabilization subsystem for monitoring and/or adjusting the wavelength of light emitted by one or more light sources. The device can include one or more selectors that can combine, select, and/or filter light along one or more light paths, which can include light emitted by a plurality of light sources. Example selectors may include, but are not limited to, an arrayed waveguide grating (AWG), a ring resonator, a plurality of distributed Bragg reflectors (DBRs), a plurality of filters, and the like. Output light paths from the selector(s) can be input into one or more detector(s). The detector(s) can receive the light along the light paths and can generate one or more signals as output signal(s) from the frequency stabilization subsystem.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: November 28, 2023
    Inventors: Alfredo Bismuto, Yi-Kuei Ryan Wu, Thomas Schrans, Andrea Trita, Aaron Zilkie
  • Patent number: 11828997
    Abstract: An optical fan-out assembly includes: a fiber optic cable comprising a plurality of optical fibers and a surrounding jacket; a housing comprising first and second mating halves that mate to form a cavity, each of the first and second halves having opposite first and second ends and first and second lips adjacent respective first and second ends; the second half having a window, wherein the first lips create a seal with the cable jacket; a disk with a plurality of holes, a plurality of slots, and having a periphery, wherein a respective one of the plurality of slots extends between each hole and the periphery, the disk adjacent to and forming a seal with the second lips of the first and second halves; and a plurality of furcation tubes, each of the furcation tubes being inserted into a respective hole; wherein the optical fibers extend through the cavity, and each optical fiber is received in a respective furcation tube.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: November 28, 2023
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Oscar Bran de León, Thomas B. Marcouiller
  • Patent number: 11822133
    Abstract: An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes internal alignment slots configured to accept a corresponding alignment key on connector outer housing to ensure alignment and orientation for maximum signal transfer between opposing ferrule end faces.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: November 21, 2023
    Assignee: Senko Advanced Components, Inc.
    Inventors: Jimmy Jun Fu Chang, Kazuyoshi Takano
  • Patent number: 11815751
    Abstract: A composite substrate for an electro-optic element includes: an electro-optic crystal substrate having an electro-optic effect; a support substrate bonded to the electro-optic crystal substrate at least via an amorphous layer; and a low-refractive-index layer located between the electro-optic crystal substrate and the amorphous layer and having a lower refractive index than the electro-optical crystal substrate. The amorphous layer is constituted of one or more elements that constitute a layer or a substrate contacting the amorphous layer from one side and one or more elements that constitute a layer or a substrate contacting the amorphous layer from another side.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: November 14, 2023
    Assignee: NGK INSULATORS, LTD.
    Inventors: Tomoyoshi Tai, Jungo Kondo
  • Patent number: 11808936
    Abstract: A method of rotating polarization of light travelling in a waveguide includes receiving an optical signal having a first polarization state at a first section of the waveguide, the first section of the waveguide being disposed on a plane of a substrate, using a micro-electromechanical system (MEMS) device, angling a second section of the waveguide out of the plane of the substrate, and outputting the optical signal with a second polarization state, different from the first polarization state, on a third section of the waveguide, the third section of the waveguide also being disposed on the plane of the substrate. A control loop is provided to sense the polarization shift to control the angle of the MEMS device to compensate for that shift.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: November 7, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Sujit Handanhal Ramachandra, Matthew Stewart Johnson, Trang Thu Pham, Aidas A. Jakubenas
  • Patent number: 11806831
    Abstract: A holder to polish a fiber optic connector having at least two ferrule assembly. Each ferrule assembly having a ferrule with an optical fiber therein. And a tool to rotate a ferrule assembly within the connector housing to allow opposing ferrules, with an APC surface, to transfer a light signal with minimal surface reflection, or data loss.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: November 7, 2023
    Assignee: Senko Advanced Components, Inc.
    Inventor: Kim Man Wong
  • Patent number: 11809006
    Abstract: An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: November 7, 2023
    Assignee: Senko Advanced Components, Inc.
    Inventors: Kazuyoshi Takano, Jimmy Jun-Fu Chang
  • Patent number: 11796739
    Abstract: Disclosed are edge couplers having a high coupling efficiency and low polarization dependent loss, and methods of making the edge couplers. In one embodiment, a semiconductor device for optical coupling is disclosed. The semiconductor device includes: a substrate; an optical waveguide over the substrate; and a plurality of layers over the optical waveguide. The plurality of layers includes a plurality of coupling pillars disposed at an edge of the semiconductor device. The plurality of coupling pillars form an edge coupler configured for optically coupling the optical waveguide to an optical fiber placed at the edge of the semiconductor device.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Hsiang Hsu, Chewn-Pu Jou, Chan-Hong Chern, Cheng-Tse Tang, Yung-Jr Hung, Lan-Chou Cho
  • Patent number: 11791527
    Abstract: A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: October 17, 2023
    Assignee: Ciena Corporation
    Inventors: Kaisheng Hu, Georges-Andre Chaudron, John David Wice
  • Patent number: 11789211
    Abstract: An optical fiber connector includes an outer housing, a rear member sleeved on a rear end of the outer housing, a polarity key, and a release pull lever. The polarity key includes a body part extending from the rear member and located on one side of the outer housing, a latching part formed with a cutout and having a first sloping surface, and a locking protrusion extending from the latching part. The release pull lever is disposed on the outer housing and has a driving portion protruding into the cutout and being in sliding contact with the first sloping surface, such that rearward movement of the release pull lever drives the locking protrusion to move close to the outer housing.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: October 17, 2023
    Assignee: GLORIOLE ELECTROPTIC TECHNOLOGY CORP.
    Inventor: Hsien-Hsin Hsu
  • Patent number: 11789219
    Abstract: Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: October 17, 2023
    Assignee: OpenLight Photonics, Inc.
    Inventors: Gregory Alan Fish, Brian R. Koch
  • Patent number: 11782221
    Abstract: A dust cap includes a cap body and a pair of opposing latches. The cap body is adapted to cover a connectorized end of a fiber optic connector and cable assembly when the connectorized end is inserted through an opening of an interior of the cap body. The cap body further includes an opposing pair of resilient walls. The pair of opposing latches each include latching features that extend outside of the interior of the cap body. The pair of opposing latches each further include a mounting portion mounted to a respective one of the opposing pair of resilient walls. The dust cap may further include a pulling interface. The pulling interface may be adapted to attach to a pulling member and may be positioned at a tapered nose of the cap body. The dust cap may thereby be a cable pulling cap and may pull a fiber optic connector and cable assembly through conduits and other narrow passages.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: October 10, 2023
    Assignee: CommScope Technologies LLC
    Inventor: Cyle D. Petersen
  • Patent number: 11782219
    Abstract: The optical switch 10 comprises a first waveguide 11, a second waveguide 12, and an exchanger 13. The first waveguide 11 comprises a first end E1 and a second end E2. The second waveguide 12 comprises a third end E3 and a fourth end E4, respectively located on the first end E1 side and the second end E2 side as viewed from the center of the first waveguide 11. The exchanger 13 comprises: a first waveguide section 21 configuring a directional coupler together with the first waveguide 11 and including a phase changing material 23; and a second waveguide section 22 configuring a directional coupler together with the second waveguide 12 and including a phase change material 24. The exchanger 13 inputs electromagnetic waves, input from the first end E1 and output from the first waveguide section 21, to the third end E3 side of the second waveguide section 22.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: October 10, 2023
    Assignee: KYOCERA Corporation
    Inventors: Naoki Matsui, Tomoya Sugita, Hiromichi Yoshikawa