Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Abstract: There is described a method of optically coupling a first optical fiber and a second optical fiber to one another. The method generally has a step of bringing a free end of the first optical fiber, the second optical fiber and liquid in close proximity to one another within a coupling region, the free end of the first optical fiber having a dimension below a critical dimension, the free end of the first optical fiber moving within said liquid to contact the second optical fiber along a given coupling length, said contact optically coupling the free end of the first optical fiber and the second optical fiber to one another.

Abstract: A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a plurality of layers; a signal pad, at a first layer of the plurality of layers, connected to a signal transmission trace strip line, at a second layer of the plurality of layers, wherein the signal pad is configured to connect to a surface mount Radio Frequency (RF) connector that is configured to interface an RF signal with the signal pad; a PCB ground cage structure through the plurality of layers, surrounding the signal pad; and extended ground reference planes located at the first layer and a third layer of the plurality of layers, wherein the extended ground reference planes extend into a volume of the PCB ground cage structure.

Abstract: The present disclosure is directed to a board mounted active component assembly that includes a printed circuit board to which a connector is mounted and electrically connected. In one aspect, the connector includes a housing defining an adapter port for receiving an optical plug. The connector also includes a fiber optic transceiver module secured within the housing such that the transceiver module is optically aligned with an optical plug received in the adapter port. The fiber optic transceiver module includes a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA) with leads connected to a circuit on the printed circuit board.

Abstract: A fiber optic connector comprises a connector body, a ferrule, and a boot. The ferrule has a rear portion supported within the connector body and a front portion extending beyond a front end of the connector body. The boot has a front portion within the connector body and a funnel-shaped portion that extends beyond a back end of the connector body. The funnel-shaped portion defines a boot back end. Additionally, the funnel-shaped portion includes a tapered passage on an interior of the boot and a lip on an exterior of the boot. The tapered passage and the lip are curved toward each other proximate the boot back end so that the funnel-shaped portion terminates with a rounded configuration.

Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.

Abstract: An object of the present invention is to provide, in a local-light coupling technique for improving efficiency of work, an optical fiber local-light coupling apparatus configured to hardly affect communication between an OLT and an ONU while causing light to leak from a coated optical fiber in such an amount that makes it possible to confirm a communication state.

Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

Abstract: An optical assembly for optical aperture expansion combines facet reflective technology with diffractive technology. At least two diffractive components having opposite optical power (matching) are used, so that chromatic dispersion introduced by the first diffractive component will then be cancelled by the second diffractive component. The two diffractive components are used in combination with a reflective optical component to achieve more efficient aperture expansion (for near eye display), reducing distortions and noise, while also reducing design constraints on the system and individual components, as compared to conventional techniques. The assembly eliminates and/or reduces the need for polarization management, while enabling wider field of view. In addition, embodiments can have reduced nonuniformity, as compared to conventional single technology implementations, since the distortion patterns of the two technologies do not correlate.

Abstract: Communications systems and methods for communicating data are provided. In one example, the communications system includes an outer ring having an inner surface and an inner ring having an outer surface. The inner surface and the outer surface are separated by a gap that extends around the inner ring to define a loop. A modulating light arrangement receives data and produces modulated light. A first light diffusing optical fiber and a second light diffusing optical fiber are disposed on a first side of the gap and extend in the loop to define an optical data ring. The first light diffusing optical fiber and the second light diffusing optical fiber cooperate to diffuse the modulated light along the optical data ring. A detector is disposed on the second side of the gap and detects the diffuse modulated light.

Abstract: In an optical modulation element using a thinly processed substrate, cracking of the substrate during electrical connection is prevented, and poor connection or a reduction in manufacturing yield is prevented. An optical waveguide element includes an optical substrate on which an optical waveguide and a conductor pattern are formed, and a support substrate that supports the optical substrate, in which the conductor pattern includes at least one electrical connection area defined as a range in which electrical connection is performed, the optical substrate has a substrate removal portion in which a material of the optical substrate has been removed to penetrate through the optical substrate at a portion corresponding to the electrical connection area, and at least a part of the electrical connection area is formed on the support substrate via the substrate removal portion.

Abstract: An optical device includes an optical modulator formed on a substrate. The optical device includes: a signal electrode for the optical modulator that is formed on the substrate; a ground electrode for the optical modulator that is formed on the substrate; an optical waveguide that is provided in a region between the signal electrode and the ground electrode; a first buffer region that is formed between the optical waveguide and the substrate; and second buffer regions that are formed between the optical waveguide and the signal electrode and between the optical waveguide and the ground electrode. A permittivity of the second buffer regions is higher than a permittivity of the first buffer region.

Abstract: A package includes silicon waveguides on a first side of an oxide layer; photonic devices on the first side of the oxide layer, wherein the photonic devices are coupled to the silicon waveguides; redistribution structures over the first side of the oxide layer, wherein the redistribution structures are electrically connected to the photonic devices; a hybrid interconnect structure on a second side of the oxide layer, wherein the hybrid interconnect structure includes a stack of silicon nitride waveguides that are separated by dielectric layers; and through vias extending through the hybrid interconnect structure and the oxide layer, wherein the through vias make physical and electrical connection to the redistribution structures.

Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).

Abstract: The invention relates to an optical waveguide with two or more light-guiding cores (1a-1e) extending continuously along the longitudinal extension of the optical waveguide, parallel to one another and spaced apart from one another, from one end of the optical waveguide to the other, and with a first cladding (2) enclosing the cores (1a-1e). It is an object of the invention to provide a multicore optical waveguide for high-power operation with reduced system complexity compared to the prior art.

Abstract: The invention concerns a polarization rotator, comprising a first waveguide layer containing at least a first waveguide, said first waveguide having an input end and an output end, a second waveguide layer having at least a second waveguide, said second waveguide having an input end and an output end, and at least a first vertical mirror element arranged at the end of at least one of said waveguides to couple light between the output end of the first waveguide and the input end of the second waveguide. The optical axis of said first or second waveguide which has the vertical mirror element at its end is rotated in its waveguide layer at a first angle in order to induce rotation of polarization of light coupled between said first and second waveguides with an amount that corresponds to said first angle.

Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.

Abstract: Fiber optic trays adapted to increase fiber splicing/connecting and fiber organizing capacity on the tray. The trays can include multiple splice circuits, each splice circuit including a splice holder area or a connector holder area having a plurality of splice holders or connector holders, and a at least one fiber organizing structure such as a spool structure.

Abstract: Waveguide combiners having a pass-through in-coupler grating are described herein. The waveguide combiners include at least one microdisplay and a stack of at least two waveguide layers. In one configuration of a waveguide combiner described herein, the green FOV and the blue FOV only propagate in a first waveguide and the red FOV only propagates in a second waveguide. In another configuration of a waveguide combiner described herein, the blue FOV, the red FOV, and the green FOV only propagate in the first waveguide, the second waveguide, and a third waveguide respectively. The waveguide combiners including the stack of waveguide layers reduces luminance non-uniformity, color non-uniformity, double-images, and other non-uniformities of the overlayed images from a first microdisplay and, in some embodiments, a second microdisplay.