Abstract: Embodiments of an optical fiber cable are provided. The cable includes a cable jacket and at least one buffer tube. Each buffer tube surrounds a plurality of optical fibers. The cable jacket surrounds the at least one buffer tube. Further, a coating of superabsorbent, swellable hot melt is applied to at least one of the following locations: (i) along at least a portion of the length of at least one of the plurality of optical fibers; (ii) along at least a portion of the length of the exterior or interior surface of the at least one buffer tube; or (iii) along at least a portion of the length of the interior surface of the cable jacket. Moreover, the superabsorbent, swellable hot melt is capable of absorbing at least 50 g of water per gram of superabsorbent, swellable hot melt.

Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a semiconductor waveguide on a semiconductor layer. The semiconductor waveguide includes a first vertical sidewall over the semiconductor layer over the semiconductor layer. A plurality of grating protrusions extends horizontally from the first vertical sidewall of the semiconductor waveguide.

Abstract: The rolling bearing provides a first ring, a second ring and at least one row of rolling elements arranged therebetween. Each of the first and second rings include an inner bore having an outer surface and at least one raceway for the row of rolling elements formed on one of the inner bore and outer surface. The first ring provides at least one part ring delimiting the raceway, and at least one sleeve secured to the part ring and delimiting at least partly the other of the inner bore and outer surface of the first ring. The rolling bearing further provides at least one optical fiber sensor mounted inside at least one circumferential groove formed on the first ring and passing through at least one optical fiber sensor passage opening into the circumferential groove.

Abstract: There is provided an adapter tip to be employed with an optical-fiber connector endface inspection microscope and an optical-fiber connector endface inspection microscope system suitable for imaging the optical-fiber endface of an angled-polished optical-fiber connector deeply recessed within a connector adapter. The adapter tip or microscope system comprises a relay optical system comprising a Rhomboid prism. The Rhomboid prism being disposed so as to receive light reflected from said optical-fiber endface during inspection and laterally shift the light beam reflected from the angled-polished optical-fiber endface.

Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCM and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.

Abstract: Described herein are embodiments of fiber scanning systems and methods of scanning optical fibers. The disclosed systems and methods advantageously provide an improvement to the scanning range, the oscillation amplitude, and/or the maximum pointing angle for an optical fiber in a fiber scanning system by inducing a buckling of a portion of the optical fiber.

Abstract: An optical circuit switch including a two-dimensional fiber collimator includes a hole plate to hold and align a plurality of optical fibers. Fiber pathways within the hole plate can be formed using a femtosecond laser irradiation chemical etching (FLICE) technique. The use of the FLICE technique allows for extremely precise channels to be formed which allows for fibers to be aligned more closely with their intended alignment. The technique also allows for the channels or fiber pathways to be formed in a thicker material, which allows for greater structural support and robustness of the fiber collimator in use.

Abstract: A method for making a multimode interference (MMI) coupler with an arbitrary desired splitting ratio includes forming a thin-film of silicon-nitride material overlying a SOI substrate. The method further includes obtaining geometric parameters of a standard MIMI coupler including a rectangular MMI block and one input port and two output ports in taper shape with one of standard splitting ratios under self-imaging principle which is close to the desired splitting ratio. Additionally, the method includes tunning the input port to an off-center position at front edge of the MMI block. The method further includes making a first output port to a first off-center position flushing with a side edge of the MMI block, adjusting a second output port to a second off-center position. The method includes tunning the MMI block to obtain optimized geometric parameters for approaching the selected arbitrary splitting ratio, and etching the thin-film of silicon-nitride material.

Abstract: A micro connector kit including a ferrule assembly, an optical sub-assembly (“OSA”) and a micro connector. The ferrule assembly is coupled to an optical fiber and includes a ferrule. The OSA can receive an electric signal and transmit an optical signal or receive an optical signal and transmit an electric signal. The OSA includes a receptacle sized and shaped to receive the ferrule of the ferrule assembly to form an optical connection between the ferrule assembly and the OSA. The micro connector secures the optical connection between the ferrule assembly and the OSA. The micro connector includes a micro connector housing that forms a direct, mating connection with the OSA to secure the optical connection between the ferrule assembly and the OSA. The connection is made using only a very small space, allowing more ferrule assembly and OSA connections to be made in a smaller area.

Abstract: A silicon nitride phased array chip based on a suspended waveguide structure, which includes a silicon nitride waveguide area and a suspended waveguide area. The silicon nitride waveguide area includes a silicon substrate, a silicon dioxide buffer layer, a silicon dioxide cladding layer and a silicon nitride waveguide-based core layer. The silicon nitride waveguide-based core layer includes an optical splitter unit, a first curved waveguide, a thermo-optic phase shifter and a spot-size converter. The suspended waveguide area includes a second curved waveguide and an array grating antenna.

Abstract: An optical waveguide device includes a substrate on which an optical waveguide is formed, and a reinforcing block disposed on the substrate, along an end surface of the substrate on which an input portion or an output portion of the optical waveguide is disposed, in which an optical component that is joined to both the end surface of the substrate and an end surface of the reinforcing block is provided, a material used for a joining surface of the optical component and a material used for the substrate or the reinforcing block have at least different linear expansion coefficients of a direction parallel to the joining surface, and an area of the joining surface is set to be smaller than a maximum value of a total of areas of cross sections of the substrate and the reinforcing block parallel to the joining surface.

Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

Abstract: A light guide plate can include: a first end surface coupled to a reflection surface and a second end surface; where an incident light entering the light guide plate through the first end surface is reflected by the reflection surface and then output from the second end surface; and a diffusion structure configured to increase a transmission path of the incident light in the light guide plate.

Abstract: A composite substrate for an electro-optic element includes: an electro-optic crystal substrate having an electro-optic effect; a support substrate bonded to the electro-optic crystal substrate at least via an amorphous layer; and a low-refractive-index layer located between the electro-optic crystal substrate and the amorphous layer and having a lower refractive index than the electro-optical crystal substrate. The amorphous layer is constituted of one or more elements that constitute a layer or a substrate contacting the amorphous layer from one side and one or more elements that constitute a layer or a substrate contacting the amorphous layer from another side.

Abstract: The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

Abstract: A display device includes a cover structure, a light guide plate, and a display panel. The cover structure includes an anti-glare layer, a light blocking frame, and an adhesive layer. The anti-glare layer has a display region and an non-display region. The light blocking frame surrounds a receiving space. An orthogonal projection of the light blocking frame on the anti-glare layer is located within the non-display region. An adhesive layer is located in the receiving space of the light blocking frame. The light guide plate is located on the surface of the adhesive layer facing away from the anti-glare layer. The display panel is adjacent to the light guide plate.

Abstract: An optical fiber connection system includes a first and a second optical fiber, each with end portions that are terminated by a first and a second fiber optic connector, respectively. A fiber optic adapter connects the first and the second fiber optic connectors. A fiber alignment apparatus includes V-blocks and gel blocks. Each of the fiber optic connectors includes a connector housing and a sheath. The end portions of the optical fibers are positioned beyond distal ends of the respective connector housings. The sheath is slidably connected to the connector housing and slides between an extended configuration and a retracted configuration. The sheath covers the end portion of the respective optical fiber when the sheath is at the extended configuration and exposes the end portion when at the retracted configuration. The end portions of the optical fibers are cleaned when slid between the V-blocks and the gel blocks.

Abstract: A flexible cable guide and enclosure is disclosed for guiding one or more optic fiber cables between an outside of the enclosure and a moveable tray inside the enclosure on which devices terminating the one or more cables are mounted. A first end of the cable guide is secured to an outside of the enclosure and a second end is secured to the tray for movement therewith. The flexible cable guide ensures that the optic fiber cables transition smoothly from the outside of the enclosure to the devices.