Abstract: This invention is concerning easily installing an encoder main unit to a disk unit disposed on a shaft, without contacting a light-receiving element and an LED. An encoder installing structure and method using a spigot unit according to this invention are a configuration and method including: a shaft end which is a spigot inserting portion of a motor shaft of a motor; a disk unit which is fitted in an outer periphery of the shaft end so as to be fitted as a first spigot fitting portion and includes a disk; a screw hole which is formed at a shaft center of the shaft end along a shaft direction of the motor shaft.

Abstract: Methods of processing a viscous ribbon include supplying a molten material from a supply vessel. Methods include forming the molten material into the viscous ribbon. The viscous ribbon travels along a travel path. Methods include receiving thermal light energy produced from the viscous ribbon. Methods include generating an image of the viscous ribbon from the thermal light energy. Methods include detecting a defect of the viscous ribbon from the image.

Abstract: There is provided an optical encoder with alignable relative positions between elements including an encoding medium, a sensor package and a memory. The sensor package includes a photodiode array and two alignment photodiodes opposite to the encoding medium. The memory records an alignment pattern associated with output signals of the two alignment photodiodes when the encoding medium and the sensor package are at nominal operating positions. When the encoding medium and the sensor package are not at the nominal operating positions, the relative position alignment is performed by adjusting current relative positions between the encoding medium and the sensor package to cause a current pattern associated with output signals of the two alignment photodiodes to be identical to the alignment pattern.

Abstract: A system for use in imaging through diffusive media is presented. The system comprising: an imaging unit comprising light source unit comprising light source(s) providing coherent illumination with selected wavelength range, and a spatial light modulator configured for selectively varying spatial pattern of wavefront of light generated by the light source(s); a collection unit comprising detector array(s) and located next to said light source unit for collecting light reflected from a sample illuminated by said light source unit. And a control system comprising processing unit(s) and connected to said light source unit and said collection unit, said control system is configured for selectively varying spatial pattern of wavefront of light generated by the light source(s) in accordance with spatial pattern of light collected by said detector array(s) of the collection unit to satisfy a reflectance condition indicative of relation between wavefront spatial pattern and collected light spatial pattern.

Abstract: The present disclosure provides a Brillouin optical time domain reflectometer with an ultra-high spatial resolution based on bipolar differential phase encoding, including a narrow-linewidth laser, a polarization maintaining coupler, a differential encoder, a Mach-Zehnder modulator, an optical pulse amplifier, an optical circulator and a sensing fiber, an optical amplifier, a coherent optoelectronic receiver, a sideband demultiplexer, and a result measurement module. By implementing the present disclosure, a spatial resolution for measuring a Brillouin scattering spectrum can be effectively improved, and measurement precision can be effectively improved by increasing a quantity of times of superposition and averaging. In addition, measurement performance can be effectively improved by directly using a bipolar encoding sequence.

Abstract: An imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.

Abstract: An electronic device includes a stack of a first level having a SPAD, a second level having a quench circuit for said SPAD, and a third level having a circuit for processing data generated by said SPAD. A method for making the device includes: a) forming of the first level; b) bonding, on the first level, by molecular bonding, of a stack of layers including a semiconductor layer; and c) forming the quench circuit of the second level in the semiconductor layer.

Abstract: A non-tracking solar sensor device and systems. The non-tracking solar sensor system includes a transparent hemispherical dome enclosure for receiving light. A diffuser is disposed with the enclosure for diffusing the light. A photodiode sensor array senses at least one discrete wavelength of the diffused light. A data acquisition module is configured to receive a sensor signal from the sensor array, the signal indicative of light quality at least one discrete wave band for processing via a processor module.

Abstract: A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: An image capture device includes a sensing component, a filter layer, and a micromotor. The sensing component includes a plurality of sensing units arranged in an array. The filter layer is disposed on one side of the sensing component and includes a plurality of filter units arranged in an array. The micromotor includes a stator and a mover, the sensing component is fixed on the stator, the filter layer is fixed on the mover. The micromotor is used to drive the filter layer to move relative to the sensing component, such that the plurality of sensing units is moved to a one-to-one corresponding position relative to the plurality of filter units.

Abstract: Provided imaging control apparatus effectively avoid image capturing competition in a scene in which a large number of infrared cameras capture images. The imaging control apparatus includes an image acquisition unit that acquires an infrared image generated by an infrared camera imaging reflected light of emitted infrared rays; and a control unit that controls a setting for the generation of the infrared image on the basis of a control parameter transmitted to another apparatus or received from another apparatus via a communication interface.

Abstract: To reduce a variation in the characteristics of avalanche photodiode sensors. An avalanche photodiode sensor includes a first semiconductor region, a second semiconductor region, a low-impurity-concentration region, a first contact region, and a second contact region. The first semiconductor region is disposed on a surface of a semiconductor substrate. The second semiconductor region is disposed below the first semiconductor region and has a different conductivity type from the first semiconductor region. The low-impurity-concentration region is disposed adjacent to the second semiconductor region. The first contact region is disposed on the surface of the semiconductor substrate to be adjacent to the first semiconductor region and has electrodes connected thereto. The second contact region is disposed adjacent to the low-impurity-concentration region and has electrodes connected thereto.

Abstract: A light sensing module and a display apparatus are provided. The light sensing module includes a circuit board and a light sensing device, wherein the circuit board includes a mounting region and a device region surrounding the mounting region, an encapsulation layer is disposed on the device region, and a light sensing device, a light sensing hole and a barrier structure are provided on the mounting region, a vertical projection of the light sensing device on the mounting region at least partially overlaps with a vertical projection of the light sensing hole on the mounting region, and the barrier structure is disposed around the periphery of the light sensing hole, and separates the encapsulation layer from the light sensing hole.

Abstract: The present invention relates to a method and system for determining the manufacture of a glass container with its mold number. The method consists of marking the molds according to a system of pre-established coordinates based on a Fibonacci system or sinusoidal system, for identifying a mold number with the container that has been formed in that mould. Control means are programmed with the sinusoidal or Fibonacci coordinate system according to various coordinate points of each mold. The containers are formed with a bead or protuberance located at the bottom of each container according to the pre-established coordinate system. The recently formed containers are transported on a conveyor belt. Optical means are used to inspect the containers to identify, by means of the position of the bead or protuberance, the mold number related to the container.

Abstract: An automatic focus system for an optical microscope that facilitates faster focusing by using at least two offset focusing cameras. Each offset focusing camera can be positioned on a different side of an image forming conjugate plane so that their sharpness curves intersect at the image forming conjugate plane. Focus of a specimen can be adjusted by using sharpness values determined from images taken by the offset focusing cameras.

Abstract: A semiconductor apparatus of the present disclosure includes: a first semiconductor component in which a first circuit unit is provided; and a second semiconductor component in which a second circuit unit is provided and which is stacked to the first semiconductor component, and the second semiconductor component includes a capacitor unit as a decoupling capacitor having a first node and a second node that are connected to the first circuit unit.

Abstract: The present invention relates to an optical fiber sensor, comprising an optical fiber having embedded therein at least one fiber core (14, 16, 18, 20) extending along a length of the optical fiber, the at least one fiber core having a plurality of single fiber Bragg gratings (40, 42, 44) arranged in series along the at least one fiber core (14, 16, 18, 20), wherein each fiber Bragg grating (40, 42, 44) has a single reflection spectrum around a single reflection peak wavelength when interrogated with light in an untrained state of the at least one fiber core (14, 16, 18, 20), wherein the reflection peak wavelengths of the single reflection spectra are different from fiber Bragg grating (40, 42, 44) to fiber Bragg grating (40, 42, 44) along the at least one fiber core. Also described is an optical system and a method of interrogating an optical fiber sensor.

Abstract: Disclosed herein is an apparatus suitable for detecting radiation, comprising: a plurality of pixels configured to generate an electric signal upon exposure to a radiation; an electronic system configured to read out the electric signal; wherein the electronic system comprises a first memory and a second memory; wherein the first memory is configured to store a plurality of data bits representing the electric signal generated by the pixel that the first memory is associated with; wherein the electronic system is configured to transmit a subset of bits among the plurality of data bits, from the first memory to the second memory; wherein the electronic system is configured to transmit the subset of bits from the second memory to a bus.

Abstract: According to certain embodiments, an electronic device comprises: a housing; an optical sensor module disposed in the housing and including one or more light-emitting elements, and one or more light-receiving elements; a light source driver disposed in the housing and configured to control power supply of the one or more light-emitting elements; and at least one processor disposed in the housing and operatively connected to the optical sensor module and the light source driver, wherein the at least one processor is configured to identify a light source of the one or more light-emitting elements and turn-on/off timings of the one or more light-emitting elements according to a sensor measurement mode or a measurement function when the optical sensor module is driven, configure a control signal of the light source driver in response to the identified turn-on/off timings of the one or more light-emitting elements, based on the control signal, apply an output voltage of the light source driver as power of the one