Patents Examined by Travis Ruby
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Patent number: 12023982Abstract: A proximity air conditioner is capable of performing energy-saving and efficient air-conditioning. A proximity air-conditioning unit for vehicles includes: a housing; a temperature adjustment unit including a temperature adjuster and a blower; and ducts, wherein upper ends of blowout ports of ducts are located above seat surfaces of seats, end portions in a long-side direction of the blowout ports are located on a front side with respect to other end portions thereof in a front-back direction of the seats, and the temperature adjustment unit is disposed between both end portions in the long-side direction of each of the blowout ports.Type: GrantFiled: November 6, 2019Date of Patent: July 2, 2024Assignee: TOYODA GOSEI CO., LTD.Inventors: Nobuhiro Terai, Chiharu Totani, Yoshinori Masatsugu, Naoyuki Fukui, Hiroto Watanabe
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Patent number: 12018894Abstract: Sweating-boosted air cooled heat-pipe condensers employing a nanowick micro fin structure to form a sweating boosted heat dissipation system, wherein the nanowicks may be layered.Type: GrantFiled: March 20, 2020Date of Patent: June 25, 2024Assignee: University of South CarolinaInventors: Chen Li, Jamil Khan, Xinyu Huang, Tanvir Farouk, Raikan Dawas, Wei Chang, Pengtao Wang, Mohammad Alwazzan, Guanghan Huang
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Patent number: 12018893Abstract: An evaporator device is provided, including a chamber including an inlet, an outlet, and a surface, the inlet being configured to direct a liquid coolant into the chamber and the outlet is configured to direct a vapor coolant away from the chamber, and the surface is in thermal communication with the liquid coolant or the vapor coolant, and a porous unit disposed adjacent to the surface, the porous unit being configured to (i) absorb the liquid coolant, (ii) bring the liquid coolant into thermal communication with the surface, (iii) subject the liquid coolant to a phase transition to a vapor coolant, and (iv) direct said vapor coolant away from the surface, wherein the surface and the porous unit are of different materials, and the porous unit is thermally insulating.Type: GrantFiled: November 4, 2018Date of Patent: June 25, 2024Assignee: ZUTA-CORE LTD.Inventor: Nahshon Eadelson
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Patent number: 12017500Abstract: A heat exchanger for cooling electrical elements of a vehicle includes a pair of coolers disposed over and under an electrical element module, respectively, and each having a plurality of channels longitudinally formed to pass cooling fluid; pipe couplers respectively coupled to first ends of the pair of coolers to pass cooling fluid, having protrusions on first surfaces facing each other, respectively, and connected with pipes on second surfaces; bellows couplers respectively coupled to second ends of the pair of coolers to pass cooling fluid and having protrusions on first surfaces facing each other; and a bellows having top and bottom openings fitted on the protrusions, and being able to contract. The bellows couplers have grooves formed around the protrusions in a shape corresponding to the bellows, and widths of the grooves are larger than a width of the bellows.Type: GrantFiled: February 6, 2020Date of Patent: June 25, 2024Assignee: KOHSAN CO., LTD.Inventors: Young Il Kim, Kwan Kyo Chai, Gyu Young Jeong, Jeong Hui Kim
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Patent number: 12013196Abstract: Cooling sub-systems and methods of manufacturing cooling sub-systems are provided. For example, a cooling sub-system comprises a heat exchanger and a manifold that comprises a first sensor seat and a first valve seat, which are in fluid communication with a flow of a working fluid through the heat exchanger and the manifold. The heat exchanger and manifold are integrally formed as a single unit. In some embodiments, the manifold further comprises a second sensor seat, a second valve seat, and a plurality of internal passageways, which fluidly connects the first and second sensor seats and the first and second valve seats a working fluid inlet and a working fluid outlet for an ingress of working fluid into and out of the manifold. The cooling sub-system may be manufactured by one or more additive manufacturing methods.Type: GrantFiled: July 7, 2020Date of Patent: June 18, 2024Assignee: GE Avio S.r.l.Inventors: Alessandro Bordoni, Pietro Molesini, Lorenzo Dal Mas, Rosaria Conte
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Patent number: 12013192Abstract: A valve device 1 includes a rotational shaft 2, and a valve body 4 internally forming a space 10 and rotatable about the rotational shaft 2, the valve body 4 having an outer circumferential surface 28 where a first communication hole 36 and a bottomed groove 38 are formed, the first communication hole 36 communicating with the space 10, the bottomed groove 38 extending from the first communication hole 36 toward one side in a rotational direction of the rotational shaft 2, and the groove 38 including a first section 40 in which at least one of a depth D of the groove 38 and a width W of the groove 38 increases toward the first communication hole 36.Type: GrantFiled: March 1, 2021Date of Patent: June 18, 2024Assignee: MIKUNI CORPORATIONInventors: Takuya Kawasaki, Toshiaki Fujitani
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Patent number: 12007138Abstract: A heating, ventilation, and/or air conditioning (HVAC) system includes an enclosure that is divided by a partition extending between a first panel and a second panel of the enclosure such that the partition defines an outdoor air flow path and a return air flow path through the enclosure. The partition includes an opening extending between the outdoor airflow path and the return airflow path. The HVAC system also includes an energy recovery wheel that translatably extends through the opening and is positioned within the outdoor air flow path and the return air flow path. The energy recovery wheel is disposed within the enclosure at an oblique angle relative to the outdoor air flow path and the return air flow path.Type: GrantFiled: April 26, 2021Date of Patent: June 11, 2024Assignee: Tyco Fire & Security GmbHInventors: Vinay Nanjappa, Marcel P. Ferrere, Jr., Vishal S. Jagtap, Vijay A R, Chandra S. Yelamanchili, Curtis W. Caskey, Rajiv K. Karkhanis
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Patent number: 11988443Abstract: An electronic device is disclosed. The electronic device of the present invention comprises a communication unit and a processor for receiving information on a refrigerator from the refrigerator through the communication unit, dividing an operation section of the refrigerator into an event section and a normal section on the basis of the received information, and determining whether the refrigerator is abnormal on the basis of a state of the refrigerator in the normal section or the event section among the received information. The event section includes a section from a time point when a door of the refrigerator is opened to a time point when the temperature of the refrigerator reaches a predetermined temperature after the door is closed, and the normal section includes a section from a time point when the temperature of the refrigerator reaches the predetermined temperature to a time point before the door is opened.Type: GrantFiled: October 23, 2019Date of Patent: May 21, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Youngjae Oh, Taehan Jeon, Jaehyun Park, Minjae Kim, Boah Kim, Hyunwoo Kim, Jangpyo Park, Changwon Son, Dongeui Shin
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Patent number: 11978621Abstract: A temperature adjustment device includes: a pair of flow path plates, each of the pair of flow path plates including a flow path groove provided on a front surface of the each of the pair of flow path plates and at least a part of the front surface; a spacer member that includes a support surface projecting from the front surface, and connects the pair of flow path plates such that a back surface of one of the pair of flow path plates and a back surface of the other of the pair of flow path plate face each other; and a heat transfer plate that faces the flow path groove, and is supported by the support surface.Type: GrantFiled: October 30, 2019Date of Patent: May 7, 2024Assignee: KELK Ltd.Inventors: Atsushi Kobayashi, Hideaki Ohkubo
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Patent number: 11976857Abstract: A refrigeration cycle device according to the present disclosure includes: a refrigerant circuit including a compressor, a heat-source-side heat exchanger, a first expansion device, and a load-side heat exchanger, refrigerant cycling through the compressor, the heat-source-side heat exchanger, the first expansion device, and the load-side heat exchanger; a plurality of controllers configured to control the refrigerant circuit; a bypass pipe branching from a high pressure pipe on a discharge side of the compressor and connected to a low pressure pipe on a suction side of the compressor; a second expansion device provided to the bypass pipe, and configured to adjust a flow rate of the refrigerant flowing through the bypass pipe; and a plurality of refrigerant coolers provided to the bypass pipe, and configured to cool the plurality of controllers by using the refrigerant the flow rate of which is adjusted by the second expansion device, each of the plurality of refrigerant coolers including a refrigerant coolinType: GrantFiled: May 29, 2019Date of Patent: May 7, 2024Assignee: Mitsubishi Electric CorporationInventors: Takanori Koike, Naomichi Tamura, Hiroyuki Morimoto
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Patent number: 11959710Abstract: A heat exchanger for vehicle arranged to allow an internal circulation of at least one fluid, comprising at least a heat exchanger bundle and at least a duct (10) at least partially outside the heat exchanger bundle, the duct (10) penetrating into the heat exchanger bundle by a hole arranged in a terminal plate (8) of the heat exchanger bundle, the duct (10) comprising at least a collar (42) lining the hole, characterized in that the heat exchanger comprises a reinforcing mean (20) in touch with the collar (42) of the duct (10) and with the terminal plate (8) of the heat exchanger bundle.Type: GrantFiled: August 14, 2018Date of Patent: April 16, 2024Assignee: VALEO AUTOSYSTEMY SP. Z O.OInventors: Pawel Sus, Mateusz Kaczmarczyk, Tomasz Wator, Karol Pokrywinski
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Patent number: 11933543Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.Type: GrantFiled: October 21, 2022Date of Patent: March 19, 2024Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
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Patent number: 11913725Abstract: A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.Type: GrantFiled: December 11, 2019Date of Patent: February 27, 2024Assignee: COOLER MASTER CO., LTD.Inventor: Jen-Chih Cheng
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Patent number: 11903167Abstract: A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.Type: GrantFiled: May 30, 2019Date of Patent: February 13, 2024Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Shinichiro Takahashi, Takayuki Ota, Kazunori Oda, Toshihiko Takeda, Kiyotaka Takematsu, Terutoshi Momose, Yoko Nakamura
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Patent number: 11892241Abstract: At least one of an evaporator, a condenser, a liquid pipe, and a vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer including a porous body. The porous body includes a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, and a first convex portion provided inside the first bottomed hole. The first convex portion has a proximal end connected to a bottom face of the first bottomed hole and a distal end provided on an opposite side to the proximal end in a thickness direction of the first convex portion. The distal end is provided at a position further recessed toward the bottom face of the first bottomed hole than the one face of the inner metal layer.Type: GrantFiled: April 22, 2022Date of Patent: February 6, 2024Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yoshihiro Machida
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Patent number: 11892243Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.Type: GrantFiled: August 17, 2022Date of Patent: February 6, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Shih-Lin Huang, Chiu-Kung Chen
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Patent number: 11885518Abstract: An air-conditioning apparatus includes a refrigerant circuit, an air-conditioning load state detection unit, an operation-state detection unit, and a controller. The refrigerant circuit includes a main circuit and a bypass circuit. The air-conditioning apparatus has a simultaneous heating and defrosting operation mode. In the simultaneous heating and defrosting operation mode, the controller controls a compressor, a pressure reducing device, and a defrosting refrigerant pressure-reducing device such that control amounts of the compressor, the pressure reducing device, and the defrosting refrigerant pressure-reducing device reach respective normal-time control target values that are set based on an air-conditioning load state and an operation state.Type: GrantFiled: December 11, 2018Date of Patent: January 30, 2024Assignee: Mitsubishi Electric CorporationInventors: Koji Fukui, Kosuke Tanaka, Kazuya Watanabe
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Patent number: 11879649Abstract: An outdoor unit of an air-conditioning apparatus includes a casing, and grasp portions provided at corner portions of the casing in plan view. Each grasp portion includes an outer peripheral portion at an outer periphery, and a finger hook portion protruding downward from an upper part of the outer peripheral portion and extending in a lateral direction of the finger hook portion. The outer peripheral portion includes a first opening such that a lower end portion of the finger hook portion is exposed as seen in a horizontal direction and a direction perpendicular to the lateral direction, a second opening below the finger hook portion and continuous with the first opening, and a third opening behind the finger hook portion and continuous with the second opening, the second opening and the third opening are at one of the lateral end portions.Type: GrantFiled: July 19, 2018Date of Patent: January 23, 2024Assignee: Mitsubishi Electric CorporationInventors: Mizuo Sakai, Noka Sakabe, Tetsuya Yamashita, Masafumi Tomita, Hirokazu Murakami, Yuya Hata
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Patent number: 11867424Abstract: A thermal control system includes a housing defining an intake flow path for travel of intake airflow and an exhaust flow path for travel of exhaust airflow. An intake door is disposed along the intake flow path and has first and second positions blocking and allowing intake airflow through the intake door. An exhaust door is disposed along the exhaust flow path and has first and second positions blocking and allowing exhaust airflow through the exhaust door. A mode door is disposed in the housing between the intake flow path and the exhaust flow path with a first position blocking the intake airflow and allowing the exhaust airflow to pass through a heat exchanger, a second position blocking the exhaust airflow and allowing the intake airflow to pass through the heat exchanger, and a third position allowing the intake airflow and the exhaust airflow to pass through the heat exchanger.Type: GrantFiled: February 24, 2021Date of Patent: January 9, 2024Assignee: APPLE INC.Inventors: Scott Wujek, Kegan J. Connick, Paul D. Yeomans
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Patent number: 11850915Abstract: Thermal conditioning of a combustion engine of a vehicle is achieved by means of a fluid circuit or a sub-circuit of the fluid circuit and/or the air flowing into a passenger compartment of the vehicle by means of a heat pump circuit. In at least one operational state of the vehicle, heat is transferred from the fluid circuit or the sub-circuit of the fluid circuit to the heat pump circuit.Type: GrantFiled: May 4, 2018Date of Patent: December 26, 2023Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Peter Satzger, Felix Schedel