Patents Examined by Travis Ruby
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Patent number: 11852419Abstract: An air-cooled heat exchanger has a frame assembly that has a plurality of keyed structural members, where each of the plurality of keyed structural members is interconnected to a corresponding one of the plurality of keyed structural members with a unique mortise and tenon connection joint. Also disclosed is a method for manufacturing and assembling the frame assembly that begins with the step of providing a plurality of keyed structural members that each have a first connection joint component that is uniquely matched to a second connection joint component. The method continues with the step of assembling the frame assembly by interconnecting each of the plurality of keyed structural members using the first and second connection joint components. The method ends with the step of permanently connecting the frame assembly by permanently fastening each of the plurality of keyed structural members.Type: GrantFiled: March 28, 2019Date of Patent: December 26, 2023Assignee: Hudson Products CorporationInventors: Scott Williams, Rod Day, Steve Tietz
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Patent number: 11835304Abstract: A heat exchanger is provided for a gas turbine engine. This heat exchanger includes a pair of heat exchanger manifolds and a stack of flow channel modules arranged and fluidly coupled between the heat exchanger manifolds. The flow channel modules include a first flow channel module that includes a first heat exchanger section and a second heat exchanger section. The first heat exchanger section includes a base plate, a plurality of flow channel walls and a plurality of heat transfer augmentors. The flow channel walls project out from the base plate to the second heat exchanger section thereby forming a plurality of flow channels between the first heat exchanger section and the second heat exchanger section. The heat transfer augmentors project partially into at least one of the flow channels. A first of the heat transfer augmentors is formed from a different material than the base plate.Type: GrantFiled: November 2, 2020Date of Patent: December 5, 2023Assignee: RTX CORPORATIONInventors: Chris Vargas, Daniel B. Denis
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Patent number: 11815287Abstract: Using thermal radiation to supply occupant comfort has long existed in the heating domain, and to a lesser scale in the cooling domain. Cooling power of radiant cooling systems is limited by the risk of condensation on the panel itself, as well as adjacent surfaces. Similarly, convective system losses to the ambient air prevent maintaining a large temperature difference from the surface and the surroundings. The disclosed approach combats these common pitfalls of radiant cooling systems in the building domain, increasing the power and therefore applicability of radiant cooling.Type: GrantFiled: November 16, 2018Date of Patent: November 14, 2023Assignee: THE TRUSTEES OF PRINCETON UNIVERSITYInventors: Eric Teitelbaum, Forrest Meggers, Adam Rysanek
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Patent number: 11818831Abstract: A heat exchanger for cooling high temperature components of a circuit board is disclosed. The heat exchanger may comprise a housing including a coolant inlet, a coolant outlet, a first side wall, a second side wall, and an upper housing portion assembled with a lower housing portion. The heat exchanger may further include a first array of plates on the upper housing portion, and a second array of plates on the lower housing portion extending parallel to and interleaved with the first array of plates. Each of the plates may have an aperture that is laterally and vertically opposed to the aperture of an immediately adjacent plate. The interleaving first and second arrays of plates may create a lateral and vertical serpentine fluid flow path.Type: GrantFiled: September 24, 2019Date of Patent: November 14, 2023Assignee: BorgWarner Inc.Inventors: Aliihsan Karamavruc, Christopher Joel Maurus
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Patent number: 11808521Abstract: A loop heat pipe includes two outermost metal layers, an intermediate metal layer provided between the outermost metal layers, an evaporator, a condenser, and liquid and vapor pipes connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, a porous body provided between the pair of walls, and a strut penetrating the porous body and bonding the outermost metal layers, and one or more metal layers. Each of the one or more metal layers includes a first part forming a part of the pair of walls, a second part connected to the first part and forming a part of the porous body, and a third part connected to the second part and forming a part of the strut.Type: GrantFiled: March 5, 2021Date of Patent: November 7, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yoshihiro Machida
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Patent number: 11808528Abstract: An orifice insert is provided and includes a center plug and a ring feature. The center plug has first and second ends and an exterior surface extending between the first and second ends. The exterior surface defines multiple inflow channels that extend from the first end toward the second end and terminate at termination points midway between the first and second ends. The ring feature is disposed about the center plug and the multiple inflow channels to define, with the center plug, a plenum with which the termination points of the multiple inflow channels are fluidly communicative.Type: GrantFiled: February 3, 2020Date of Patent: November 7, 2023Assignee: HAMILTON SUNDSTRAND CORPORATIONInventor: Wei-Lin Cho
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Patent number: 11802740Abstract: A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to condense the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. Each of the evaporator, the condenser, the liquid pipe and the vapor pipe includes: a pair of outer metal layers; an intermediate metal layer provided between the pair of outer metal layers; and a flow channel defined by the pair of outer metal layers and the intermediate metal layer. At least one of the evaporator, the condenser, the liquid pipe and the vapor pipe further includes a reinforcing member that is built in at least one of the pair of outer metal layers and that is higher in rigidity than the pair of outer metal layers.Type: GrantFiled: August 23, 2021Date of Patent: October 31, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yoshihiro Machida
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Patent number: 11796255Abstract: An air-cooled condenser system for steam condensing applications in a power plant Rankine cycle includes an air cooled condenser having a plurality of interconnected modular cooling cells. Each cell comprises a frame-supported fan, inlet steam headers, outlet condensate headers, and tube bundle assemblies having extending between the headers. The tube bundle assemblies may be arranged in a V-shaped tube structure. A plurality of deflection limiter beams are arranged coplanar with the tube bundles. Top ends of each deflection limiter beam are slideably inserted in an associated floating end cap affixed to an upper tubesheet which moves vertically relative to the beams via thermal expansion/contraction concomitantly with the tubes. The deflection limiter beams provides guided restraint system for expansion/contraction of the tube bundles which prevents out of plane tube bowing.Type: GrantFiled: October 19, 2020Date of Patent: October 24, 2023Inventors: Krishna P. Singh, Vytautas Vincas Maciunas, Raghavendra Palle
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Patent number: 11796220Abstract: An air conditioner indoor unit includes a housing, a collection device, and a lifting device. The housing includes a body and a top cover. A top of the body includes a fitting port and the top cover is disposed at the fitting port. The collection device is disposed at the top cover. The lifting device is coupled to the top cover and configured to drive the top cover to move between a storage position and a detection position that allows the collection device to collect external information outside the housing.Type: GrantFiled: April 25, 2019Date of Patent: October 24, 2023Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.Inventors: Xianyou Mao, Zhiqiang Liu, Weitao Xie, Shupeng Chen
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Patent number: 11788801Abstract: A heat exchanger body includes at least a first channel wall portion, a second channel wall portion, and a third channel wall portion. A first channel for a first fluid, and a second channel for a second fluid are provided such that heat is allowed to be transferred between the first channel and the second channel via the second channel wall portion. A plurality of first support structures are arranged in the first channel and extend from the first channel wall portion to the second channel wall portion. A plurality of second support structures are arranged in the second channel and extending from the second channel wall portion to the third channel wall portion. The support structures are configured to support the second and third channel wall portions during manufacturing of the heat exchanger.Type: GrantFiled: October 13, 2017Date of Patent: October 17, 2023Assignee: VOLVO TRUCK CORPORATIONInventor: Yannick Sailler
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Patent number: 11781814Abstract: A tapered groove width heat pipe is disclosed, including a tube having an internal surface, a first end, a second end, and a central axis. A plurality of groove walls on the internal surface define a plurality of trapezoidal grooves. Each groove wall has a proximal width closest to the central axis and a distal width furthest from the central axis, the proximal width of a portion of each groove wall tapering gradually between the first end and the second end.Type: GrantFiled: March 16, 2020Date of Patent: October 10, 2023Assignee: The Boeing CompanyInventor: Kawthar Kasim
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Patent number: 11774182Abstract: A loop heat pipe includes a pair of outermost metal layers, an intermediate metal layer provided between the pair of outermost metal layers, an evaporator, a condenser, a liquid pipe and a vapor pipe connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, and a porous body provided between the pair of walls. The intermediate metal layer includes a first surface opposing one of the pair of outermost metal layers, and a plurality of first cavities, and a first projection between mutually adjacent first cavities, respectively famed at the first surface between the pair of walls. A first gap is famed between the first projection and the one of the pair of outermost metal layers.Type: GrantFiled: April 1, 2021Date of Patent: October 3, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yoshihiro Machida
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Patent number: 11774181Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.Type: GrantFiled: September 30, 2020Date of Patent: October 3, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yoshihiro Machida
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Patent number: 11768039Abstract: Recovery system for the recovery of thermal energy from waste water from building, which system comprises a heat pump adapted to absorb thermal energy from a non-freeze liquid circulating through the heat pump and arranged to deliver thermal energy to water flowing through the heat pump, a heat exchanger device that is in contact with said waste water, and a pipeline system disposed between the heat pump and the heat exchanger device, and in which non-freeze liquid can circulate. The heat exchanger device is designed so that the non-freeze liquid passes through the heat exchanger device, whereby the non-freeze liquid is able to absorb thermal energy from the waste water. Further, the system comprises a collector tank, and a pipeline system for supplying waste water to the collector tank. The heat exchanger device is disposed in the collector tank, wherein the non-freeze liquid can absorb thermal energy from waste water in the collector tank.Type: GrantFiled: October 25, 2017Date of Patent: September 26, 2023Inventor: Lennart Olofsson
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Patent number: 11761668Abstract: The cooling system may dehumidify and cool the indoor air by using the ejector, the ejector membrane, the evaporation chamber, and the indoor dehumidifying membrane. In addition, the coefficient of performance of the cooling system may be improved by cooling the refrigerant using evaporation latent heat generated in the evaporation chamber by the suction force of the ejector and cooling the indoor air using the refrigerant. In addition, by using solar heat to generate high-temperature and high-pressure steam and supply the generated steam to the ejector, energy use efficiency may be improved. In addition, since the temperature of the steam generated in the steam generating portion may be lowered by arranging and using the two first and second ejectors in multiple stages, energy efficiency may be further improved by reducing the consumption of the heat source required for steam generation.Type: GrantFiled: October 25, 2021Date of Patent: September 19, 2023Assignee: KOREA INSTITUTE OF ENERGY RESEARCHInventors: Beom Joon Lee, Gil-bong Lee, Chulwoo Roh, Young-jin Baik, Hyung-ki Shin, Jong Jae Cho
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Patent number: 11761645Abstract: Certain embodiments provide an energy exchange system that includes a supply air flow path, an exhaust air flow path, an energy recovery device disposed within the supply and exhaust air flow paths, and a supply conditioning unit disposed within the supply air flow path. The supply conditioning unit may be downstream from the energy recovery device. Certain embodiments provide a method of conditioning air including introducing outside air as supply air into a supply air flow path, pre-conditioning the supply air with an energy recovery device, and fully-conditioning the supply air with a supply conditioning unit that is downstream from the energy recovery device.Type: GrantFiled: February 5, 2021Date of Patent: September 19, 2023Assignee: Nortek Air Solutions Canada, Inc.Inventors: Kenneth Paul Coutu, Howard Brian Hemingson, Manfred Gerber
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Patent number: 11761643Abstract: A base member includes a substantially horizontal main body that supports one or more components of a heating and cooling unit. The main body includes a conditioned space portion about a first side of the main body and a non-conditional space portion about a second side of the main body. A substantially vertical separation wall extends up from the main body and separates the conditioned space portion from the non-conditioned space portion. A lip is formed at least partially about the non-conditioned space portion. At least one drainage hole extends through the non-conditioned space portion. A surface of the non-conditioned space portion is sloped towards the at least one drainage hole. A drain pan is disposed about the conditioned space portion. At least one drainage tube is in fluid communication with the drain pan. A surface of the drain pan is sloped towards the at least one drainage tube.Type: GrantFiled: December 7, 2020Date of Patent: September 19, 2023Assignee: Allied Air Enterprises LLCInventors: Jeffery Paul Gedcke, Joseph Ephraim Whisenhunt, Colin Mullins, Randy Brian Palm, Joseph Nathaniel Faulk
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Patent number: 11755082Abstract: In IHSs (Information Handling Systems), cooling is provided by increasing the airflow generated by cooling fans. However, unnecessary airflow cooling results in noise and wasted energy. An IHS processor may support faster operating frequencies when cooled below an upper threshold, but these operating frequencies drop at temperatures below a lower threshold. Embodiments provide techniques for calibrating the cooling of an IHS to the thermal characteristics of a specific processor since manufacturing variances result in processors having differing responses to cooling. A turbo frequency supported by a processor is measured at a series of temperature margins that are progressively lower than the processor's specification temperature. A rate of increase in the measured turbo frequencies is determined at each of the temperature margins. A first temperature margin is identified at which the rate of increase in turbo frequencies falls below a threshold. This margin is used in providing airflow cooling.Type: GrantFiled: April 2, 2020Date of Patent: September 12, 2023Assignee: Dell Products, L.P.Inventors: Yuan David Ma, Travis C. North
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Patent number: 11754302Abstract: A portable air purifier may include at least one blower fan which rotates with respect to a rotational shaft extending in a first direction, and includes a hub, and a plurality of fan blades radially connected around the hub; and a fan cover provided with at least one shielding plate that shields the hub, and a plurality of guide vanes that guides a discharge direction of air discharged by the at least one blower fan. A foreground of a rotational area of the plurality of fan blades forms a blowing surface, and the plurality of guide vanes may be arranged in front of the blowing surface and extend radially with respect to the rotational shaft. Each of the plurality of guide vanes may include a first guide surface positioned adjacent to the at least one blower fan and a second guide surface connected to the first guide surface and positioned further from the at least one blower fan than the first guide surface. The second guide surface may extend parallel to the first guide surface.Type: GrantFiled: September 11, 2018Date of Patent: September 12, 2023Assignee: LG ELECTRONICS INC.Inventors: Youngjun Kim, Ho-Jung Kim, Ji Hyung Kim, Tae Yoon Kim, Myung Jin Ku, Seong Ho Hong, Juhyun Kim, Jongkeon Jeon
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Patent number: 11744044Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.Type: GrantFiled: November 5, 2021Date of Patent: August 29, 2023Assignee: Deeia, Inc.Inventors: Himanshu Pokharna, Gin Hwee Tan