Patents Examined by Tremesha S Willis
  • Patent number: 10939562
    Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 2, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata, Hiroyuki Kobayashi
  • Patent number: 10930609
    Abstract: A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: February 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toyohiro Aoki, Takashi Hisada, Eiji Nakamura
  • Patent number: 10932386
    Abstract: An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 23, 2021
    Assignee: DYCONEX AG
    Inventors: Marc Hauer, Eckardt Bihler, Jochen Held
  • Patent number: 10928963
    Abstract: A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: February 23, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hiroshige Nakamura, Tadashi Kuriki
  • Patent number: 10928861
    Abstract: A security apparatus for securing a portable electronic device to an immovable object includes a locking head having a base and a plurality of pillar structures extending from the base. The plurality of pillar structures is configured to be inserted into an aperture of the portable electronic device. The locking head also has a ball positioned within each of the plurality of pillar structures. The ball is extendable outwardly from a corresponding pillar structure to inhibit the locking head from being removed from the aperture. The locking head further has a linear movable structure positioned within each of the plurality of pillar structures and operable to selectively extend outwardly each ball from the plurality of pillar structures. The security apparatus also includes a security device attached to the locking head and configured to engage the immovable object.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: February 23, 2021
    Assignee: ACCO BRANDS CORPORATION
    Inventors: John Hung, Ryan White, Guillermo Andres, David Thomas Dobson, Jacque Gagne
  • Patent number: 10912190
    Abstract: An electrical connector element, for use on a printed circuit board assembly, includes a soldering pad having a longitudinal length and a cross-sectional width. The soldering pad is configured to be electrically-coupleable to a PCB device conductor. At least one impedance inducing feature is positioned along the longitudinal length of the soldering pad.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: February 2, 2021
    Assignee: EMC IP Holding Company, LLC
    Inventors: Mickey S. Felton, Bhyrav M. Mutnury, Vijendera Kumar
  • Patent number: 10903152
    Abstract: A substrate includes: (1) a first patterned conductive layer, the first patterned conductive layer including a pair of first transmission lines adjacent to each other; and (2) a first reference layer above the pair of first transmission lines, the first reference layer defining an opening, wherein the pair of first transmission lines are exposed to the opening.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: January 26, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuan-Hsi Chou, Tsun-Lung Hsieh, Chen-Chao Wang
  • Patent number: 10902867
    Abstract: An approach to forming an electronic device assembly that includes a plurality of interconnect pads on an electronic device, an interconnect die with a first set of interconnect pads adjacent to a first edge of the interconnect die connecting to a second set of interconnect pads adjacent to a second edge of the interconnect die, where a first set of connections between the plurality of interconnects on the electronic device and the first set of interconnect pads on the interconnect die occurs. Furthermore, the electronic assembly includes a second set of connections between the second set of interconnects on the interconnect die and a set of interconnect pads on a flex cable.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: January 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: Robert Biskeborn, Calvin Shyhjong Lo
  • Patent number: 10897817
    Abstract: A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: January 19, 2021
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Kenji Iwamoto, Satoshi Kurosawa
  • Patent number: 10888276
    Abstract: A living body-attachable electrode includes a substrate that has a first main surface and a second main surface and is made of a material having stretchability, a first electrode pair that is formed on/in the first main surface and includes two opposite electrodes, a second electrode pair that is formed on/in the first main surface and includes two opposite electrodes sandwiching the first electrode pair, and a plurality of gel electrodes that are formed on the second main surface and are in a one-to-one correspondence with the electrodes in the first and second electrode pairs. Each of the electrodes in the first and second electrode pairs and corresponding one of the gel electrodes are electrically connected to each other via a plurality of via conductors penetrating through the substrate.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: January 12, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kazuki Iwasaki
  • Patent number: 10879156
    Abstract: A method comprising incorporating indium into an entire Sn film for preventing the growth of whiskers from the Sn film, wherein the Sn film is applied to a metallic substrate. The indium is present in the entire thickness of the Sn film.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: December 29, 2020
    Assignee: Washington State University
    Inventor: Indranath Dutta
  • Patent number: 10868229
    Abstract: A method of manufacturing an electrode substrate for a transparent light emitting device display that includes laminating copper foil on a transparent base material; forming a copper foil pattern by etching the copper foil; forming a transparent photosensitive resin composition layer on a front surface of the transparent base material and the copper foil pattern; and exposing at least a part of the copper foil pattern by removing at least a part of the transparent photosensitive resin composition layer provided on the copper foil pattern.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: December 15, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Yong Goo Son, Kun Seok Lee, Seung Heon Lee
  • Patent number: 10867926
    Abstract: Discussed generally herein are methods and devices including or providing a high density interconnect structure. A high density interconnect structure can include a stack of alternating dielectric layers and metallization layers comprising at least three metallization layers including conductive material with low k dielectric material between the conductive material, and at least two dielectric layers including first medium k dielectric material with one or more first vias extending therethrough, the at least two dielectric layers situated between two metallization layers of the at least three metallization layers, a second medium k dielectric material directly on a top surface of the stack, a second via extending through the second medium k dielectric material, the second via electrically connected to conductive material in a metallization layer of the three or more metallization layers, and a pad over the second medium k dielectric material and electrically connected to the second via.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: December 15, 2020
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Kemal Aygun, Ajay Jain, Zhiguo Qian
  • Patent number: 10868415
    Abstract: An exterior member of an electrical wire includes a first tubular body and a second tubular body. The first tubular body includes a hollow portion through which the electrical wire is inserted, an opening portion from which the electrical wire is drawn out, and a vent portion which is impermeable to moisture and permeable to air. The second tubular body is provided to extend from the first tubular body and to cover an outer periphery of the electrical wire drawn from the opening portion, and is made of a material more flexible than a material of the first tubular body.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: December 15, 2020
    Assignee: Yazaki Corporation
    Inventors: Yuto Ito, Yohei Koseki
  • Patent number: 10869382
    Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: December 15, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirokazu Yazaki, Keito Yonemori
  • Patent number: 10863624
    Abstract: A camera module with reduced light leakage includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. A step is defined at the printed circuit board. The step passes through the first surface and at least one side surface. A flange is defined on the mounting bracket. The flange is received and fixed in the step and this structure places less reliance on the strength and opacity of the particular adhesive used.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: December 8, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Jing-Wei Li, Shin-Wen Chen, Yu-Shuai Li, Jian-Chao Song
  • Patent number: 10856414
    Abstract: A printed circuit board includes a circuit trace and a connector pad. The connector pad provides electrical and mechanical mounting of a connector lead of a surface mount device and provides a circuit path between the surface mount device and the circuit trace. The connector pad includes 1) a connector pad base electrically coupled to the circuit trace, and 2) a first connector pad island electrically isolated from the connector pad base. The connector pad base has a length that is substantially equal to a length of a contact portion of the connector lead.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: December 1, 2020
    Assignee: Dell Products, L.P.
    Inventors: Chun-Lin Liao, Ching-Huei Chen, Bhyrav M. Mutnury
  • Patent number: 10856365
    Abstract: An improved resistive heating device includes multiple printed heating elements joined through a flexible film substrate to bus bars printed on an opposite side of the flexible film. The heating elements may be printed using a positive temperature coefficient ink to provide a self-regulated maximum temperature based on a given input voltage. This printing of electrical components on both sides of a flexible film, referred to herein as double-sided polymer circuitry (D/SPC®), provides various additional advantages over single-sided printing, such as an increased heat per unit surface area. This also provides a more concentrated and evenly distributed heat pattern, and will reduce or eliminate the exhibition of hot spots or varying patterns of heat throughout the heating element. This printing on both sides of the flexible film results in an improved, fault-tolerant bus bar topology, which may be used in fault-critical medical applications or other mission-critical applications.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: December 1, 2020
    Inventor: Mark Allen Ester
  • Patent number: 10849221
    Abstract: An electrode embedded member includes a plate-shaped substrate made of a ceramic; an inner electrode embedded in the substrate; a terminal disposed at a position that overlaps the inner electrode in a thickness direction of the substrate and is farther than the inner electrode from the front surface of the substrate; an intermediate insulator embedded in the substrate between the inner electrode and the terminal and that is made of a ceramic; and a connection electrode disposed along an outer surface of the intermediate insulator and that connects the terminal and the inner electrode. When seen in the thickness direction of the substrate, a cutout portion is formed in the connection electrode located at least outside an overlapping region where the terminal and the connection electrode overlap. The substrate and/or the intermediate insulator penetrates the cutout portion, and thereby the substrate and the intermediate insulator are integrated with each other.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: November 24, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Atsushi Tsuchida, Noriaki Tokusho
  • Patent number: 10849238
    Abstract: One embodiment includes a method for manufacturing an electronic apparatus, including bonding an integrated circuit (IC) die to a substrate to form an IC package using a first reflow process, which causes the substrate to warp, reversibly connecting a lid with the IC package over the IC die so that the lid applies a force to the IC die, providing a printed circuit board (PCB) including an array of first contact pads, respectively disposing an array of bonding elements on an array of second contact pads of the substrate, placing the IC package on to the PCB with respective ones of the bonding elements contacting respective ones of the first contact pads, performing a second reflow process to apply heat to the bonding elements to bond the first contact pads with the second contact pads, and removing the lid from the IC package after the second reflow process.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: November 24, 2020
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventor: Yogev Buzaglo